| Model | Maintenance | Cooling |
|---|---|---|
| KR1280-X2-A0-R0-00 | Rear access | Air cooling |
| KR1280-X2-A0-F0-00 | Front access | Air cooling |
| KR1280-X2-C0-R0-00 | Rear access | Cold-plate liquid cooling |
| Symbol | Description |
|---|---|
| [symbol-exclamation] DANGER | A potential for serious injury, or even death if not properly handled |
| [symbol-exclamation] WARNING | A potential for minor or moderate injury if not properly handled |
| [symbol-exclamation] CAUTION | A potential loss of data or damage to equipment if not properly handled |
| [symbol-exclamation] IMPORTANT | Operations or information that requires special attention to ensure successful installation or configuration |
| [symbol-document] NOTE | Supplementary description of document information |
| Version | Date | Description of Changes |
|---|---|---|
| V1.0 | 2025/04/22 | Initial release |
| Technical Feature | Description |
|---|---|
| 4th/5th Gen Intel Xeon Scalable processors (Sapphire Rapids/Emerald Rapids) | • Features 4th/5th Gen Intel Xeon Scalable processors (Sapphire Rapids/Emerald Rapids), with up to 64 cores per processor, a maximum TDP of 385 W, a max. Turbo frequency of 4.2 GHz, an L3 cache of 5 MB per core, and up to 4 UPI links per CPU at up to 20 GT/s per link, delivering unrivaled processing performance. - Up to 2 processors with up to 128 cores and 256 threads, maximizing the concurrent execution of multi-threaded applications. - With the processor cache hierarchy optimization, a larger L2 cache of private 1 MB per core is provided, so that memory data can be put and processed directly in L2 cache, improving the memory access performance and reducing the demand for L3 cache capacity. - Supports Intel Turbo Boost Technology 2.0 and automatically scales CPU speeds up to the max Turbo frequency at peak workloads, allowing processor cores to exceed the thermal design power (TDP) for a limited time. - Supports Intel Hyper-Threading Technology, allowing up to 2 threads to run on each core to improve the performance of multi-threaded applications. - Supports Intel Virtualization Technology that provides hardware assist to the virtualization software, allowing the operating system to better use hardware to handle virtualization work. - Supports Intel Advanced Vector Extensions 512 (Intel AVX-512), significantly improving floating-point performance for compute-intensive applications. |
| Technical Feature | Description |
|---|---|
| - Supports Intel Deep Learning Boost (Intel DL Boost) that uses Vector Neural Network Instructions (VNNI), improving the performance for deep learning applications. | |
| DDR5 DIMMs | Up to 32 DDR5 ECC DIMMs (5,600 MT/s, RDIMMs), delivering superior speed, high availability, and a memory capacity of up to 4 TB. |
| Flexible Drive Configurations | Provides elastic and scalable storage solutions to meet different capacity and upgrade requirements. |
| Support for All-SSD Configuration | Brings significantly higher I/O performance over all-HDD configuration or HDD-SSD mixing configuration. |
| 24 Gbps Serial Attached SCSI (SAS) | Quadruples the data transfer rate of internal storage of the 6 Gbps SAS solution, maximizing the performance of storage I/O-intensive applications. |
| Intel Integrated I/O Technology | The processors integrate the PCIe 5.0 controller to reduce I/O latency and enhance overall system performance. |
| PCIe Expansion | Up to 8 PCIe 5.0 expansion slots (for 4 standard PCIe x16 expansion cards + 3 OCP 3.0 cards + 1 RAID mezz card). |
| OCP Expansion | Up to 3 OCP slots that can flexibly support 1/10/25/100/200 Gb hot-plug OCP 3.0 cards. |
| Technical Feature | Description |
|---|---|
| Hot-Swap SAS/SATA/NVMe Drive | Supports hot-swap SAS/SATA/NVMe drives and RAID cards with RAID levels 0/1/1E/10/5/50/6/60, RAID cache and data protection enabled by the super-capacitor in case of power failures. Supported RAID levels vary by RAID card. |
| Reliability | • SSDs are much more reliable than traditional HDDs, increasing the system uptime. • The BMC monitors system parameters in real time and sends alerts in advance, enabling technicians to take appropriate measures in time to minimize system downtime. |
| Availability | • The LEDs on front and rear panels, the LCD module, and |
| Technical Feature | Description |
|---|---|
| the BMC Web GUI indicate the status of key components and quickly lead technicians to failed (or failing) components, simplifying maintenance and speeding up troubleshooting. • Provides 2 hot-swap PSUs with 1+1 redundancy and 8 hot-swap fan modules with N+1 redundancy. | |
| Maintenance Efficiency | • The BMC management network ports on the front and rear panels enable remote BMC O&M, improving O&M efficiency. • Memory online diagnosis helps technicians to quickly identify the DIMM needing maintenance. |
| Technical Feature | Description |
|---|---|
| Remote Management | The BMC monitors system operating status and enables remote management. |
| Network Controller Sideband Interface (NC-SI) Feature | Allows a network port to serve as a management port and a service port. The NC-SI feature is disabled by default and can be enabled/disabled through the BIOS or BMC. Notes: The NC-SI port supports the following features: • The NC-SI port can be bonded to any network port of the OCP card or of PCIe NIC that supports NC-SI. • Supports the enablement/disablement and configuration of Virtual Local Area Network (VLAN). VLAN is disabled by default. • Supports both IPv6 and IPv4 addresses. The subnet mask of IPv4 or prefix length of IPv6 subnet mask, IP addresses, and default gateways can be configured. |
| Intel PFR | Intel Platform Firmware Resilience (PFR) is a security technology that follows NIST SP 800-193 guidelines. Intel PFR helps protect platform assets, detects corrupted firmware as well as other malicious or erroneous traffic, and even restores platform firmware to a good state. |
| Unified Extensible Firmware Interface (UEFI) | The industry-standard UEFI improves the efficiency of setup, configuration and update, and simplifies the error handling process. |
| Technical Feature | Description |
|---|---|
| TPM & TCM | Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) provide advanced encryption. |
| Intel Trusted Execution Technology | Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks. |
| Firmware Update Mechanism | The firmware update mechanism based on digital signatures prevents unauthorized firmware updates. |
| UEFI Secure Boot | Protects the system from malicious bootloaders. |
| Hierarchical Password Protection in BIOS | Ensures system boot and management security. |
| BIOS Secure Flash and BIOS Lock Enable (BLE) | Reduces attacks from malicious software on the BIOS flash region. |
| Dual-Image Mechanism for BMC and BIOS | Recovers firmware upon detection of corrupted firmware. |
| BMC Secure Boot | Protects BMC from malicious tampering. |
| BMC Access Control Policies | Flexible BMC access control policies improve BMC management security. |
| Chassis Intrusion Detection | Enhances physical security. |
| BMC Management Security | Supports flexible BMC access control policies and double factor authentication. |
| Intel SGX Technology | Intel Software Guard Extensions (SGX) technology allows applications to run in its own isolated space, helping prevent malicious theft and modification of critical codes and data. |
| System Secure Erase | (Optional) System secure erase function can wipe data on the storage device with just one click. |
| Front Bezel with a Lock | (Optional) Prevents unauthorized users from removing or installing drives, thus ensuring the security of local data. |
| Technical Feature | Description |
|---|---|
| 80 Plus Platinum/Titanium PSUs | Equipped with 80 Plus Platinum/Titanium PSUs of different power efficiency levels, with a power efficiency of up to 96% at a load of 50%. |
| 1+1 Redundant PSUs | Supports AC/DC power input for improved power conversion efficiency. |
| VRD Solution | Features the high-efficiency single-board voltage regulator down (VRD) solution, reducing DC-DC conversion loss. |
| Intelligent Fan Speed Control and CPU Frequency Scaling | Supports Proportional-Integral-Derivative (PID) intelligent fan speed control and intelligent CPU frequency scaling, conserving energy. |
| System Cooling Design | Offers a fully-optimized system cooling design with energy-efficient cooling fans, lowering energy consumption from system cooling. |
| Power Capping and Power Control | Provides power capping and power control measures. |
| Staggered Spin-up of Drives | Supports staggered spin-up of drives, reducing power consumption during server startup. |
| Intel Intelligent Power Capability | Supports Intel Intelligent Power Capability (IIPC) to optimize energy usage in the processor cores by turning computing functions on only when needed. |
| Low Energy Consumption | Supports low-voltage Intel Xeon Scalable processors (Sapphire Rapids/Emerald Rapids), consuming less energy and meeting the demands of data centers and telecommunications environments constrained by power and thermal limits. |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | E1.S SSD + M.2 SSD Module | 16 | PSU |
| 2 | M.2 SSD | 17 | FHHL PCIe Riser Module |
| 3 | E1.S SSD | 18 | DC-SCM Board |
| 4 | 2.5-Inch Drive Module | 19 | PCIe Butterfly Riser Module |
| 5 | E1.S + M.2 Drive Backplane | 20 | HHHL PCIe Riser Module |
| 6 | M.2 Drive Backplane | 21 | PSU Air Duct |
| 7 | E1.S Drive Backplane | 22 | Cold Plate Module |
| 8 | 3.5-Inch Drive Backplane | 23 | Super-Capacitor |
| 9 | 2 × 2.5-Inch Drive Backplane | 24 | Motherboard (configured with EVAC heatsinks) |
| 10 | 8 × 2.5-Inch Drive Backplane | 25 | Fan Module |
| 11 | 3.5-Inch Drive Module | 26 | Honeycomb Panel |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 12 | Reinforcement Crossbar | 27 | 4 × 2.5-Inch Drive Backplane |
| 13 | System Air Duct | 28 | 2.5-Inch Drive Module |
| 14 | Top Cover | 29 | Chassis |
| 15 | OCP 3.0 Card | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | E3.S SSD | 11 | PSU Air Duct |
| 2 | E3.S Drive Backplane | 12 | Super-Capacitor |
| 3 | Front FHHL PCIe Riser Module | 13 | DC-SCM Board |
| 4 | Honeycomb Panel | 14 | Rear FHHL PCIe Riser Module |
| 5 | Fan Module | 15 | Motherboard (configured with standard heatsinks) |
| 6 | Reinforcement Crossbar | 16 | E1.S + M.2 Drive Backplane |
| 7 | System Air Duct | 17 | E1.S SSD |
| 8 | Top Cover | 18 | M.2 SSD |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 9 | Rear OCP 3.0 Card | 19 | Front OCP 3.0 Card |
| 10 | PSU | 20 | Chassis |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Serial Label Pull Tag (with an SN label) | 7 | USB 3.0 Port |
| 2 | E1.S Drive Bay | 8 | USB 2.0/LCD Port |
| 3 | M.2 Drive Bay | 9 | VGA Port |
| 4 | Power Button and LED | 10 | Ear Latch |
| 5 | UID/BMC RST Button and LED | 11 | 3.5-Inch Drive Bay |
| 6 | LEDs | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Serial Label Pull Tag (with an SN label) | 6 | USB 3.0 Port |
| 2 | 2.5-Inch Drive Bay | 7 | VGA Port |
| 3 | Power Button and LED | 8 | Ear Latch |
| 4 | UID/BMC RST Button and LED | 9 | 3.5-Inch Drive Bay |
| 5 | LEDs | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Serial Label Pull Tag (with an SN label) | 5 | Ear Latch |
| 2 | 2.5-Inch Drive Bay | 6 | USB 2.0/LCD Port |
| 3 | Power Button and LED | 7 | LEDs |
| 4 | UID/BMC RST Button and LED | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Serial Label Pull Tag (with an SN label) | 4 | LEDs |
| 2 | Power Button and LED | 5 | Ear Latch |
| 3 | UID/BMC RST Button and LED | 6 | 2.5-Inch Drive Bay |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Serial Label Pull Tag (with an SN label) | 6 | UID/BMC RST Button and LED |
| 2 | E1.S Drive Bay | 7 | Ear Latch |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 3 | M.2 Drive Bay | 8 | USB 2.0/LCD Port |
| 4 | VGA Port | 9 | LEDs |
| 5 | Power Button and LED | 10 | 2.5-Inch Drive Bay |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | PCIe Slot 2 | 9 | VGA Port |
| 2 | PCIe Slot 3 | 10 | Ear Latch |
| 3 | E3.S Drive Bay/2.5-Inch Drive Bay | 11 | OCP 3.0 Card 0 |
| 4 | Serial Label Pull Tag (with an SN label) | 12 | Power Button and LED |
| 5 | LEDs | 13 | UID/BMC RST Button and LED |
| 6 | USB 3.0 Port | 14 | Management Network Port Link Activity LED |
| 7 | USB 2.0/LCD Port | 15 | Management Network Port Link Speed LED |
| 8 | BMC Management Network Port | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | PCIe Slot 2 | 9 | BMC Management Network Port |
| 2 | PCIe Slot 3 | 10 | VGA Port |
| 3 | Serial Label Pull Tag (with an SN label) | 11 | Ear Latch |
| 4 | E1.S Drive Bay | 12 | OCP 3.0 Card 0 |
| 5 | M.2 Drive Bay | 13 | Power Button and LED |
| 6 | LEDs | 14 | UID/BMC RST Button and LED |
| 7 | USB 3.0 Port | 15 | Management Network Port Link Activity LED |
| 8 | USB 2.0/LCD Port | 16 | Management Network Port Link Speed LED |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | PCIe Slot 0 | 10 | System/BMC Serial Port (micro USB) |
| 2 | PCIe Slot 1 | 11 | OCP 3.0 Card 0 |
| 3 | PCIe Slot 2 | 12 | PSU LED |
| 4 | PSU1 | 13 | OCP 3.0 Card 1 Hot-Plug Button and LED |
| 5 | PSU0 | 14 | Management Network Port Link Speed LED |
| 6 | OCP 3.0 Card 1 | 15 | Management Network Port Link Activity LED |
| 7 | BMC Management Network Port | 16 | UID/BMC RST Button and LED |
| 8 | USB 3.0 Port | 17 | OCP 3.0 Card 0 Hot-Plug Button and LED |
| 9 | VGA Port | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | PCIe Slot 0 | 9 | System/BMC Serial Port (micro USB) |
| 2 | PCIe Slot 1 | 10 | OCP 3.0 Card 0 |
| 3 | PSU1 | 11 | PSU LED |
| 4 | PSU0 | 12 | OCP 3.0 Card 1 Hot-Plug Button and LED |
| 5 | OCP 3.0 Card 1 | 13 | Management Network Port Link Speed LED |
| 6 | BMC Management Network Port | 14 | Management Network Port Link Activity LED |
| 7 | USB 3.0 Port | 15 | UID/BMC RST Button and LED |
| 8 | VGA Port | 16 | OCP 3.0 Card 0 Hot-Plug Button and LED |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | 2.5-Inch Drive Bay | 9 | System/BMC Serial Port (micro USB) |
| 2 | PCIe Slot 2 | 10 | OCP 3.0 Card 0 |
| 3 | PSU1 | 11 | PSU LED |
| 4 | PSU0 | 12 | OCP 3.0 Card 1 Hot-Plug Button and LED |
| 5 | OCP 3.0 Card 1 | 13 | Management Network Port Link Speed LED |
| 6 | BMC Management Network Port | 14 | Management Network Port Link Activity LED |
| 7 | USB 3.0 Port | 15 | UID/BMC RST Button and LED |
| 8 | VGA Port | 16 | OCP 3.0 Card 0 Hot-Plug Button and LED |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | PCIe Slot 0 | 10 | VGA Port |
| 2 | PCIe Slot 1 | 11 | System/BMC Serial Port (micro USB) |
| 3 | Quick Disconnect (inlet) | 12 | OCP 3.0 Card 0 |
| 4 | Quick Disconnect (outlet) | 13 | PSU LED |
| 5 | PSU1 | 14 | OCP 3.0 Card 1 Hot-Plug Button and LED |
| 6 | PSU0 | 15 | Management Network Port Link Speed LED |
| 7 | OCP 3.0 Card 1 | 16 | Management Network Port Link Activity LED |
| 8 | BMC Management Network Port | 17 | UID/BMC RST Button and LED |
| 9 | USB 3.0 Port | 18 | OCP 3.0 Card 0 Hot-Plug Button and LED |
| Icon | Feature | Description |
|---|---|---|
| [power icon] | Power Button and LED | • Power LED: - Off = No power - Solid green = Power-on state - Solid orange = Standby state • Power button: |
| Icon | Feature | Description |
|---|---|---|
| - Press and release the button to power on the system from the standby state - Press and hold the button for 6 seconds to force a shutdown from the power-on state | ||
| UID | UID/BMC RST Button and LED | • Solid blue = The UID LED is activated by the UID button or via the BMC • Gradually turning blue within 2 seconds and then gradually turning off within 2 seconds = PFR authentication in progress (Note: The server can be powered on only after this LED turns off.) • Press and hold the button for 6 seconds to force BMC to reset. |
| [diagram] | System Status LED | • Off = Normal • Blinking red (1 Hz) = A warning error is detected on CPU, memory, power supply, drive, fan, etc. • Solid red = A critical error is detected on CPU, memory, power supply, drive, fan, etc. |
| [diagram] | Memory Status LED | • Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs |
| [diagram] | Fan Status LED | • Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs, including fan failure and fan absence |
| [diagram] | Power Status LED | • Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs |
| [diagram] | System Overheat LED | • Off = Normal • Blinking red (1 Hz) = A warning error occurs, including Proc Hot, resulting in CPU throttling • Solid red = A critical error occurs, |
| Icon | Feature | Description |
|---|---|---|
| including CPU Thermal Trip/PCH Hot/MEM Hot. | ||
| [diagram] | Network Status LED | • Off = No network connection • Blinking green = Network connected with data being transmitted • Solid green = Network connected without data being transmitted Note: It only indicates the status of the self-developed OCP card. |
| - | OCP 3.0 Card Hot-Plug Button and LED | This button is used for hot-plugging the OCP 3.0 card. LED: • Solid yellow-green = OCP card is powered on • Blinking orange (1 Hz) = OCP card is getting ready for hot-plugging or OCP card is being identified after being inserted • Off = OCP card is powered off |
| - | Management Network Port Link Speed LED | • Off = No network connection • Solid green = Network connected with link speed at 1,000 Mbps • Solid orange = Network connected with link speed at 10 Mbps or 100 Mbps |
| - | Management Network Port Link Activity LED | • Off = No network connection • Solid green = Network connected without data being transmitted • Blinking green = Network connected with data being transmitted |
| Item | Port | Description |
|---|---|---|
| 1 | VGA Port | Enables you to connect a display terminal to the system. |
| 2 | USB 3.0 Port | Enables you to connect a USB 3.0/2.0 device to the system. |
| Item | Port | Description |
|---|---|---|
| 3 | USB 2.0/LCD Port | Enables you to connect a USB 2.0 device or an LCD module to the system. |
| 4 | System/BMC Serial Port | • Enables you to debug and monitor the BMC. • Enables you to debug and monitor the system. |
| 5 | BMC Management Network Port | Enables you to manage the server. Note: It is a Gigabit Ethernet port that supports 100/1,000 Mbps auto-negotiation. |
| 6 | OCP 3.0 Network Port | Enables you to connect the system to the network. |
| Item | Description | Example |
|---|---|---|
| 1 | Capacity | • 16 GB • 32 GB • 64 GB • 128 GB • 256 GB |
| 2 | Rank(s) | • 1R = Single rank • 2R = Dual rank • 2S2R = Two ranks of two high stacked 3DS DRAM • 4DR = DDP (Dual Die Package) 4 rank • 4R = Quad rank |
| 3 | Data width of DRAM | • x4 = 4 bits • x8 = 8 bits |
| 4 | DIMM slot type | PC5 = DDR5 |
| 5 | Maximum memory speed | • 4,800 MT/s • 5,600 MT/s |
| 6 | CAS latency | • SDP 4800B = 40-39-39 • 3DS 4800B = 46-39-39 • SDP 5600B = 46-45-45 • 3DS 5600B = 52-45-45 |
| 7 | DIMM type | R = RDIMM |
| CPU | Channel ID | Silk Screen |
|---|---|---|
| CPU0 | Channel 0 | CPU0_C0D0 |
| CPU0_C0D1 | ||
| Channel 1 | CPU0_C1D0 | |
| CPU0_C1D1 | ||
| Channel 2 | CPU0_C2D0 | |
| CPU0_C2D1 | ||
| Channel 3 | CPU0_C3D0 | |
| CPU0_C3D1 | ||
| Channel 4 | CPU0_C4D0 | |
| CPU0_C4D1 | ||
| Channel 5 | CPU0_C5D0 | |
| CPU0_C5D1 | ||
| Channel 6 | CPU0_C6D0 | |
| CPU0_C6D1 | ||
| Channel 7 | CPU0_C7D0 | |
| CPU0_C7D1 | ||
| CPU1 | Channel 0 | CPU1_C0D0 |
| CPU1_C0D1 | ||
| Channel 1 | CPU1_C1D0 | |
| CPU1_C1D1 | ||
| Channel 2 | CPU1_C2D0 | |
| CPU1_C2D1 | ||
| Channel 3 | CPU1_C3D0 | |
| CPU1_C3D1 | ||
| Channel 4 | CPU1_C4D0 | |
| CPU1_C4D1 | ||
| Channel 5 | CPU1_C5D0 | |
| CPU1_C5D1 | ||
| Channel 6 | CPU1_C6D0 | |
| CPU1_C6D1 | ||
| Channel 7 | CPU1_C7D0 | |
| CPU1_C7D1 |
| Item | Value | |||||
|---|---|---|---|---|---|---|
| Capacity per DDR5 DIMM (GB) | 16 | 32 | 64 | 96 | 128 | |
| Type | RDIMM | RDIMM | RDIMM | RDIMM | RDIMM | |
| Rated speed (MT/s) | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 | |
| Operating voltage (V) | 1.1 | 1.1 | 1.1 | 1.1 | 1.1 | |
| Maximum number of DDR5 DIMMs supported in a servera | 32 | 32 | 32 | 32 | 32 | |
| Maximum capacity of DDR5 DIMMs supported in a server (GB)b | 512 | 1,024 | 2,048 | 3,072 | 4,096 | |
| Actual speed (MT/s) | 1 DPCc | 4,800 | 4,800 | 4,800 | 4,800 | 4,800 |
| 2 DPC | 4,400 | 4,400 | 4,400 | 4,400 | 4,400 | |
| Item | Value |
|---|---|
| a: The maximum number of DDR5 DIMMs supported is based on the dual-CPU configuration. The number is halved for the single-CPU configuration. b: It indicates the maximum memory capacity supported when all the DIMM slots are populated with DDR5 DIMMs. c: DIMM Per Channel (DPC) is the number of DIMMs per memory channel. The above information is for reference only. Consult your local sales representative for details. | |
| Item | Value | ||||
|---|---|---|---|---|---|
| Capacity per DDR5 DIMM (GB) | 16 | 32 | 64 | 128 | |
| Type | RDIMM | RDIMM | RDIMM | RDIMM | |
| Rated speed (MT/s) | 5,600 | 5,600 | 5,600 | 5,600 | |
| Operating voltage (V) | 1.1 | 1.1 | 1.1 | 1.1 | |
| Maximum number of DDR5 DIMMs supported in a servera | 32 | 32 | 32 | 32 | |
| Maximum capacity of DDR5 DIMMs supported in a server (GB)b | 512 | 1,024 | 2,048 | 4,096 | |
| Actual speed (MT/s) | 1 DPCc | 5,600 | 5,600 | 5,600 | 5,600 |
| 2 DPC | 4,400 | 4,400 | 4,400 | 4,400 | |
| DDR QTY | CPU0 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | |
| 1 | ● | |||||||||||||||
| 2 | ● | ● | ||||||||||||||
| 4 | ● | ● | ● | ● | ||||||||||||
| 6 | ● | ● | ● | ● | ● | ● | ||||||||||
| 8 | ● | ● | ● | ● | ● | ● | ● | |||||||||
| 12 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ||||
| 16 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● |
| DDR | CPU0 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| QTY | C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | |
| 0 | |||||||||||||||||
| 1 | ● | ||||||||||||||||
| 2 | ● | ● | |||||||||||||||
| 4 | ● | ● | ● | ● | |||||||||||||
| 8 | ● | ● | ● | ● | ● | ● | ● | ● | |||||||||
| 16 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● |
| DDR | CPU0 | CPU1 | |||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| QTY | C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | |
| 0 | |||||||||||||||||||||||||||||||||
| 2 | ● | ● | |||||||||||||||||||||||||||||||
| 4 | ● | ||||||||||||||||||||||||||||||||
| 8 | ● | ● | ● | ● | |||||||||||||||||||||||||||||
| 16 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | |||||||||||||||||
| 32 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | |
| DDR QTY | CPU0 | |||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | |
| 8 | ● | ● | ● | ● | ● | ● | ● | ● | ||||||||
| 16 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● |
| DDR QTY | CPU0 | CPU1 | ||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | C0D0 | C0D1 | C1D0 | C1D1 | C2D0 | C2D1 | C3D0 | C3D1 | C4D0 | C4D1 | C5D0 | C5D1 | C6D0 | C6D1 | C7D0 | C7D1 | |
| 16 | ● | ● | ● | ● | ● | ● | ● | ● | ||||||||||||||||||||||||
| 32 | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● | ● |
| Configuration | Front Drives | Rear Drives | Internal Drives | Drive Management Mode |
|---|---|---|---|---|
| 4 × 3.5-Inch Drive + 2 × E1.S SSD + 2 × M.2 SSD Config. | • 4 × 3.5-inch drive: Drive bays with physical drive No. 4 to 7 support SAS/SATA/NVMe drives • 2 × E1.S SSD: Drive bays with physical drive No. 0 to 1 support NVMe drives • 2 × M.2 SSD: Drive bays with physical drive No. 2 to 3 support SATA drives | 2 × 2.5-inch SAS/SATA drive | 2 × SATA/PCIe M.2 SSD | • SAS/SATA drive or front M.2 SSD: RAID mezz card, PCIe RAID card or directly connected to the PCH • Internal SATA/PCIe M.2 SSD: directly connected to the PCH • NVMe drive/E1.S SSD: tri-mode PCIe RAID card or directly connected to CPUs |
| Configuration | Front Drives | Rear Drives | Internal Drives | Drive Management Mode |
|---|---|---|---|---|
| 4 × 3.5-Inch Drive + 4 × 2.5-Inch Drive Config. | • 4 × 3.5-inch drive: Drive bays with physical drive No. 4 to 7 support SAS/SATA/NVMe drives • 4 × 2.5-inch drive: Drive bays with physical drive No. 0 to 3 support SAS/SATA/NVMe drives | 2 × 2.5-inch SAS/SATA drive | 2 × SATA/PCIe M.2 SSD | • SAS/SATA drive: RAID mezz card, PCIe RAID card or directly connected to the PCH • Internal SATA/PCIe M.2 SSD: directly connected to the PCH • NVMe drive: tri-mode PCIe RAID card or directly connected to CPUs |
| 10 × 2.5-Inch Drive Config. | 10 × 2.5-inch drive: Drive bays with physical drive No. 0 to 9 support SAS/SATA/NVMe drives | 2 × 2.5-inch SAS/SATA drive | 2 × SATA/PCIe M.2 SSD | • SAS/SATA drive: PCIe RAID card, RAID mezz card or directly connected to the PCH • Internal SATA/PCIe M.2 SSD: directly connected to the PCH • NVMe drive: tri-mode PCIe RAID card or directly connected to CPUs |
| Configuration | Front Drives | Rear Drives | Internal Drives | Drive Management Mode |
|---|---|---|---|---|
| 12 × 2.5-Inch Drive Config. | 12 × 2.5-inch drive: Drive bays with physical drive No. 0 to 11 support SAS/SATA/NVMe drives | 2 × 2.5-inch SAS/ SATA drive | 2 × SATA/ PCIe M.2 SSD | • SAS/SATA drive: PCIe RAID card, RAID mezz card or directly connected to the PCH • Internal SATA/PCIe M.2 SSD: directly connected to the PCH • NVMe drive: tri-mode PCIe RAID card or directly connected to CPUs |
| 8 × 2.5-Inch Drive + 2 × E1.S SSD + 2 × M.2 SSD Config. | • 8 × 2.5-inch drive: Drive bays with physical drive No. 0 to 7 support SAS/SATA/ NVMe drives • 2 × E1.S SSD: Drive bays with physical drive No. 8 to 9 support NVMe drives • 2 × M.2 SSD: Drive bays with physical drive No. 10 to 11 support SATA drives | 2 × 2.5-inch SAS/ SATA drive | 2 × SATA/ PCIe M.2 SSD | • SAS/SATA drive or front M.2 SSD: PCIe RAID card, RAID mezz card or directly connected to the PCH • Internal SATA/PCIe M.2 SSD: directly connected to the PCH • NVMe drive/E1.S SSD: tri-mode PCIe RAID card or directly |
| Configuration | Front Drives | Rear Drives | Internal Drives | Drive Management Mode |
|---|---|---|---|---|
| connected to CPUs |
| Configuration | Front Drives | Drive Management Mode |
|---|---|---|
| 4 × E3.S SSD Config. | 4 × E3.S SSD: Drive bays with physical drive No. 0 to 3 support NVMe drives | E3.S SSD: tri-mode PCIe RAID card or directly connected to CPUs |
| 4 × 2.5-Inch Drive Config. | 4 × 2.5-inch drive: Drive bays with physical drive No. 0 to 3 support SAS/SATA/NVMe drives | • SAS/SATA drive: RAID mezz card, PCIe RAID card or directly connected to the PCH • NVMe drive: tri-mode PCIe RAID card or directly connected to CPUs |
| 12 × E1.S SSD + 2 × M.2 SSD Config. | • 12 × E1.S SSD: Drive bays with physical drive No. 0 to 11 support NVMe drives • 2 × M.2 SSD: Drive bays with physical drive No. 12 to 13 support SATA drives | • E1.S SSD: tri-mode PCIe RAID card or directly connected to CPUs • M.2 SSD: RAID mezz card, PCIe RAID card or directly connected to the PCH |
| Configuration | Front Drives | Drive Management Mode |
|---|---|---|
| 4 × 3.5-Inch Drive + 2 × E1.S SSD + 2 × M.2 SSD Config. | • 4 × 3.5-inch drive: Drive bays with physical drive No. 4 to 7 support SAS/SATA/NVMe drives • 2 × E1.S SSD: Drive bays with physical drive No. 0 to 1 support NVMe drives • 2 × M.2 SSD: Drive bays with physical drive No. 2 to 3 support SATA drives | • SAS/SATA drive or front M.2 SSD: PCIe RAID card or directly connected to the PCH • NVMe drive/E1.S SSD: tri-mode PCIe RAID card or directly connected to CPUs |
| 8 × 2.5-Inch Drive + 2 × E1.S SSD + 2 × M.2 SSD Config. | • 8 × 2.5-inch drive: Drive bays with physical drive No. 0 to 7 support SAS/SATA/NVMe drives • 2 × E1.S SSD: Drive bays with physical drive No. 8 to 9 support NVMe drives • 2 × M.2 SSD: Drive bays with physical drive No. 10 to 11 support SATA drives | • SAS/SATA drive or front M.2 SSD: PCIe RAID card or directly connected to the PCH • NVMe drive/E1.S SSD: tri-mode PCIe RAID card or directly connected to CPUs |
| 10 × 2.5-Inch Drive Config. | 10 × 2.5-inch drive: Drive bays with physical drive No. 0 to 9 support SAS/SATA/NVMe drives | • SAS/SATA drive: PCIe RAID card or directly connected to the PCH • NVMe drive: tri-mode PCIe RAID card or |
| Configuration | Front Drives | Drive Management Mode |
|---|---|---|
| directly connected to CPUs | ||
| 12 × 2.5-Inch Drive Config. | 12 × 2.5-inch drive: Drive bays with physical drive No. 0 to 11 support NVMe drives | • NVMe drive: tri-mode PCIe RAID card or directly connected to CPUs |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 2 × E1.S SSD | 0 to 1 | 0 to 1 | Front | 8i tri-mode RAID card: 0 to 1 |
| 2 × M.2 SSD | 2 to 3 | 2 to 3 | Front | 8i RAID card: 0 to 1 |
| 4 × SAS/SATA Drive | 4 to 7 | 4 to 7 | Front | 8i RAID card: 4 to 7 |
| 4 × NVMe Drive | 4 to 7 | 4 to 7 | Front | 16i tri-mode RAID card: 0 to 3 |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 8 × SAS/SATA Drive | 0 to 7 | 0 to 7 | Front | 8i RAID card: 0 to 7 |
| 8 × NVMe Drive | 0 to 3 | 0 to 3 | Front | - |
| 4 to 7 | 4 to 7 | Front | 16i tri-mode RAID card: 0 to 3 |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 10 × SAS/SATA Drive | 0 to 9 | 0 to 9 | Front | 16i RAID card: 0 to 9 |
| 10 × NVMe Drive | 0 to 1 | 0 to 1 | Front | 8i tri-mode RAID card: 0 to 1 |
| 2 to 7 | 2 to 7 | Front | - | |
| 8 to 9 | 8 to 9 | Front | 8i tri-mode RAID card: 0 to 1 |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 12 × SAS/SATA Drive | 0 to 11 | 0 to 11 | Front | 16i RAID card: 0 to 11 |
| 12 × NVMe Drive | 0 to 1 | 0 to 1 | Front | 8i tri-mode RAID card: 0 to 1 |
| 2 to 11 | 2 to 11 | Front | - |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 8 × SAS/SATA Drive | 0 to 7 | 0 to 7 | Front | 8i RAID card: 0 to 7 |
| 8 × NVMe Drive | 0 to 1 | 0 to 1 | Front | 8i tri-mode RAID card: 0 to 1 |
| 2 to 7 | 2 to 7 | Front | - |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 2 × E1.S SSD | 8 to 9 | 8 to 9 | Front | - |
| 2 × M.2 SSD | 10 to 11 | 10 to 11 | Front | 8i RAID card: 0 to 1 |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 12 × E1.S SSD | 0 to 11 | 0 to 11 | Front | - |
| 2 × M.2 SSD | 12 to 13 | 12 to 13 | Front | 8i RAID card: 0 to 1 |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 4 × SAS/SATA Drive | 0 to 3 | 0 to 3 | Front | 8i RAID card: 0 to 3 |
| Configuration | Physical Drive No. | Drive No. Identified by the BMC | Front/Rear | Drive No. Identified by the RAID Card |
|---|---|---|---|---|
| 4 × NVMe Drive | 0 to 3 | 0 to 3 | Front | - |
| 4 × E3.S SSD | 0 to 3 | 0 to 3 | Front | - |
| Activity LED (①) | Locator/Error LED (②) | Description | ||
|---|---|---|---|---|
| Green | Blue | Red | ||
| Off | Off | RAID created | RAID not created | Drive absent |
| Solid on | Off | |||
| Solid on | Off | Off | Drive present but not in use | |
| Blinking | Off | Off | Drive present and in use | |
| Blinking | Solid pink | Copyback/Rebuild in progress | ||
| Solid on | Solid on | Off | Drive selected but not in use | |
| Blinking | Solid on | Off | Drive selected and in use | |
| Off | Solid on | Off | Drive is selected but fails | |
| Any status | Off | Solid on | Drive fails | |
| Activity LED (①) | Locator/Error LED (②) | Description | |
|---|---|---|---|
| Green | Blue | Red | |
| Off | Off | Off | Drive absent |
| Solid on | Off | Off | Drive present but not in use |
| Blinking | Off | Off | Drive present and in use |
| Blinking | Solid pink | Copyback/Rebuild/Initializing/ Verifying in progress | |
| Solid on | Solid on | Off | Drive selected but not in use |
| Blinking (4 Hz) | Solid on | Off | Drive selected and in use |
| Off | Solid on | Off | Drive is selected but fails |
| Any status | Off | Solid on | Drive fails |
| PCIe Slot | Owner | PCIe Standard | Connector Width | Bus Width | Port No. | Form Factor |
|---|---|---|---|---|---|---|
| Slot 2 | CPU1 | PCIe 5.0 | x16 | x16 | PE3 | FHHL |
| Slot 3 | CPU1 | PCIe 5.0 | x16 | x16 | PE4 | FHHL |
| OCP 3.0 Slot | CPU0 | PCIe 5.0 | x16 | x16 | PE4 | Standard OCP 3.0 |
| PCIe Slot | Owner | PCIe Standard | Connector Width | Bus Width | Port No. | Form Factor |
|---|---|---|---|---|---|---|
| Slot 0 | CPU0 | PCIe 5.0 | x16 | x16 | PE1 | FHHL |
| Slot 1 | CPU1 | PCIe 5.0 | x16 | x16 | PE2 | HHHL |
| OCP 3.0 Slot | CPU0 | PCIe 5.0 | x8 | x8 | PE0 | Standard OCP 3.0 |
| PCIe Slot | Owner | PCIe Standard | Connector Width | Bus Width | Port No. | Form Factor |
|---|---|---|---|---|---|---|
| OCP 3.0 Slot | CPU1 | PCIe 5.0 | x8/x16 | x8/x16 | PE0 | Standard OCP 3.0 |
| OCPA Slot | CPU0 | PCIe 5.0 | x8 | x8 | PE0 | - |
| PCIe Slot | Owner | PCIe Standard | Connector Width | Bus Width | Port No. | Form Factor |
|---|---|---|---|---|---|---|
| Slot 0 | CPU0 | PCIe 5.0 | x16 | x16 | PE1 | FHHL |
| Slot 1 | CPU0 | PCIe 5.0 | x16 | x16 | PE4 | HHHL |
| Slot 2 | CPU1 | PCIe 5.0 | x16 | x16 | PE2 | HHHL |
| OCP 3.0 Slot | CPU0 | PCIe 5.0 | x8 | x8 | PE0 | Standard OCP 3.0 |
| OCP 3.0 Slot | CPU1 | PCIe 5.0 | x8/x16 | x8/x16 | PE0 | Standard OCP 3.0 |
| OCPA Slot | CPU0 | PCIe 5.0 | x8 | x8 | PE0 | - |
| PCIe Slot | Owner | PCIe Standard | Connector Width | Bus Width | Port No. | Form Factor |
|---|---|---|---|---|---|---|
| Slot 2 | CPU1 | PCIe 5.0 | x16 | x16 | PE2 | HHHL |
| OCP 3.0 Slot | CPU0 | PCIe 5.0 | x8 | x8 | PE0 | Standard OCP 3.0 |
| OCP 3.0 Slot | CPU1 | PCIe 5.0 | x8/x16 | x8/x16 | PE0 | Standard OCP 3.0 |
| OCPA Slot | CPU0 | PCIe 5.0 | x8 | x8 | PE0 | - |
| Item | PSU LED Status | Description |
|---|---|---|
| 1 | Solid green | Normal |
| 2 | Off | No AC/DC input to the PSU |
| 3 | Solid amber | PSU critical event causing a shutdown (possible causes: PSU overtemperature protection, PSU overcurrent protection, PSU overvoltage protection, short circuit protection) |
| 4 | Blinking amber (1 Hz) | PSU warning event where the PSU continues to operate (possible causes: PSU overtemperature warning, PSU overcurrent warning, excessively low fan speed warning) |
| 5 | Blinking green (1 Hz) | PSU operating in standby state with normal input |
| Item | PSU LED Status | Description |
|---|---|---|
| 6 | Blinking green (on for 2 seconds, and off for 1 second) | PSU in cold redundant state |
| 7 | Blinking green (2 Hz) | PSU firmware updating |
| Feature | Item |
|---|---|
| Basic Information | Host name |
| IP address | |
| Asset label | |
| Product serial number | |
| Product model | |
| All CPU models | |
| Total memory capacity (GB) | |
| Firmware version Note: BMC/BIOS/ME/CPLD version | |
| Status (Power-on/power-off/processor/memory/hard disk/fan/power/network) | |
| Hardware Device | Processor |
| Memory | |
| Device list |
| Feature | Item | |
|---|---|---|
| Power | ||
| Health | Processor | |
| Memory | ||
| Hard disk | ||
| Network | ||
| Power consumption | ||
| Power | ||
| Fan | ||
| Temperature | ||
| Voltage | ||
| GPU | ||
| Warning | No. | |
| Item | ||
| Status | ||
| Time | ||
| Network Conditions | LAN interface type | |
| MAC address | ||
| IPv4 configuration | IPv4 address | |
| Subnet mask | ||
| IPv4 default gateway | ||
| IPv6 configuration | IPv6 address | |
| Subnet mask | ||
| IPv6 default gateway | ||
| Log | Logs | |
| Service Support | Service support (hotline and official website) | |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | OCP 3.0 Card 0 Hot-Plug Button and LED Connector | 29 | PSU1 Connector |
| 2 | Mid-Drive Power Connector | 30 | GPU Riser Power Connector |
| 3 | Right Control Panel Connector | 31 | MCIO x8 Connector |
| 4 | System TF Card Adapter Connector | 32 | NC-SI Connector |
| 5 | Mini-SAS HD Connector | 33 | PSU0 Connector |
| 6 | Rear Drive BP Power Connector | 34 | GPU Power Connector |
| 7 | OCP 3.0 Card 2 Power Connector | 35 | Smart NIC UART Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 8 | Drive BP I2C Connector | 36 | Riser I2C Connector |
| 9 | SATA 7-Pin Connector | 37 | MCIO x8 Connector |
| 10 | MCIO x8 Connector | 38 | Riser 0 Power Connector |
| 11 | Front Drive BP Power Connector | 39 | MCIO x16 Connector |
| 12 | Inlet Temperature Sensor Connector | 40 | Riser 1 Power Connector |
| 13 | Front Drive BP Power Connector | 41 | OCP 3.0 Card 1 Connector |
| 14 | MCIO x8 Connector | 42 | OCP 3.0 Card 1 MCIO Connector |
| 15 | Intrusion Detection Connector | 43 | GPU Riser 2 Power Connector |
| 16 | OCP 3.0 Card 2 Sideband Connector | 44 | OCPA Connector |
| 17 | OCP 3.0 Card 2 Hot-Plug Button and LED Connector | 45 | OCP 3.0 Card 1 Hot-Plug Button and LED Connector |
| 18 | MCIO x8 Connector | 46 | DC-SCM Connector |
| 19 | CMOS Jumper | 47 | VPP Connector |
| 20 | Drive BP I2C Connector | 48 | Leak Detection Connector |
| 21 | VPP Connector | 49 | Riser 0 Connector |
| 22 | Left Control Panel Connector | 50 | GPU0 Power Connector |
| 23 | Rear Drive BP I2C Connector | 51 | GPU Riser 0 Power Connector |
| 24 | Drive BP I2C Connector | 52 | Riser I2C Connector |
| 25 | IPMB Connector | 53 | Button Cell Battery Socket |
| 26 | RAID Key Connector | 54 | Smart NIC Power Connector |
| 27 | Capacitor Board Power Connector | 55 | Drive BP SGPIO Connector |
| 28 | Riser I2C Connector | 56 | OCP 3.0 Card 0 Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | BMC TF Card Slot | 4 | USB 3.0 Port |
| 2 | TCM/TPM Connector | 5 | VGA Port |
| 3 | BMC Management Network Port | 6 | System/BMC Serial Port |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Power Connector | 3 | BMC_I2C Connector |
| 2 | SGPIO Connector | 4 | SATA 7-Pin Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Power Connector | 3 | BMC_I2C Connector |
| 2 | SGPIO Connector | 4 | SATA 7-Pin Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Slimline x4 Connector | 3 | Power Connector |
| 2 | BMC_I2C Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | BMC_I2C Connector | 3 | MCIO x8 Connector |
| 2 | VPP Connector | 4 | Power Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | VPP Connector | 4 | Power Connector |
| 2 | Slimline x4 Connector | 5 | BMC_I2C Connector |
| 3 | MCIO x8 Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | MCIO x8 Connector | 5 | Power Connector 1 |
| 2 | BMC_I2C Connector | 6 | VPP Connector |
| 3 | Power Connector 0 | 7 | Drive Connector |
| 4 | Slimline x4 Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | BMC_I2C Connector | 3 | Power Connector |
| 2 | Slimline x4 Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Power Connector | 4 | VPP Connector |
| 2 | Slimline x4 Connector | 5 | MCIO x8 Connector |
| 3 | BMC_I2C Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Slimline x4 Connector | 5 | VPP Connector |
| 2 | Control Panel Connector | 6 | Power Connector 0 |
| 3 | Power Connector 1 | 7 | MCIO x8 Connector |
| 4 | BMC_I2C Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Power Connector | 3 | Slimline x8 Connector |
| 2 | VPP Connector | 4 | BMC_I2C Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | Power Connector | 5 | VPP Connector |
| 2 | SATA M.2 SSD Connector | 6 | BMC_I2C Connector |
| 3 | E1.S SSD Connector | 7 | Slimline x4 Connector |
| 4 | MCIO x8 Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | BMC_I2C Connector | 5 | MCIO x8 Connector |
| 2 | SATA M.2 SSD Connector | 6 | VPP Connector |
| 3 | E1.S SSD Connector | 7 | Slimline x4 Connector |
| 4 | Power Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | VPP Connector | 4 | Slimline x4 Connector |
| 2 | Power Connector | 5 | BMC_I2C Connector |
| 3 | MCIO x8 Connector | 6 | MCIO x8 Connector |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | VPP Connector | 4 | BMC_I2C Connector |
| 2 | MCIO x8 Connector | 5 | MCIO x8 Connector |
| 3 | Power Connector | - | - |
| Item | Feature | Item | Feature |
|---|---|---|---|
| 1 | SATA 7-Pin Connector | 4 | BMC_I2C Connector |
| 2 | Power Connector | 5 | SGPIO Connector |
| 3 | SATA 7-Pin Connector | - | - |
| Item | Description |
|---|---|
| Form Factor | 1U rack server |
| Chipset | Intel C741 chipset |
| Processor | Supports 1 or 2 processors. • Intel Xeon Scalable processors (SPR/EMR) • Integrated memory controllers and 8 memory channels per processor • Integrated PCIe controllers and 80 PCIe 5.0 lanes per processor • Up to 64 cores per CPU • Max. Turbo frequency of 4.2 GHz • 4 UPI links per CPU at up to 20 GT/s per link • L3 cache up to 5 MB per core • TDP up to 385 W Note: The information above is for reference only. See 7.2 Hardware Compatibility for details. |
| Memory | Supports up to 32 DDR5 DIMMs. • RDIMMs supported • ECC, memory mirroring and memory sparing supported • 8 memory channels per processor with up to 2 DIMMs per channel • Up to 5,600 MT/s at 1 DPC and 4,400 MT/s at 2 DPC • Mixing DDR5 DIMMs of different specifications (capacity, bit width, rank, height, etc.) is not supported. • A server must use DDR5 DIMMs with the same part number (P/N code). Note: The information above is for reference only. See 7.2 Hardware Compatibility for details. |
| Storage | Supports multiple drive configurations. See 5.7.1 Drive Configurations for details. • Front (one of the following configurations): |
| Item | Description |
|---|---|
| - Up to 12 × 2.5-inch SAS/SATA/NVMe drive, hot-swappable - Up to 10 × 2.5-inch SAS/SATA/NVMe drive, hot-swappable - Up to 4 × 3.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD, the 3.5-inch drives and E1.S SSDs are hot-swappable, and the M.2 SSDs are not hot-swappable - Up to 4 × 3.5-inch SAS/SATA/NVMe drive + 4 × 2.5-inch SAS/SATA/NVMe drive, hot-swappable - Up to 8 × 2.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD, the 2.5-inch drives and E1.S SSDs are hot-swappable, and the M.2 SSDs are not hot-swappable • Rear: Up to 2 × 2.5-inch SAS/SATA drive, hot-swappable • Internal: Up to 2 × SATA/PCIe M.2 SSD | |
| Network | • Up to two 1/10/25/100/200 Gb hot-plug OCP 3.0 cards, with balanced mode supported for the dual-CPU configuration and NC-SI feature • Standard 1/10/25/40/100/200 Gb PCIe NICs • 1 BMC management network port of 100/1,000 Mbps auto-negotiation |
| I/O Expansion | • Up to 3 standard PCIe expansion cards • Up to two 1/10/25/100/200 Gb OCP 3.0 cards For details, see 5.9.2 PCIe Slot Locations and 5.9.4 PCIe Slot Description. |
| Port | • Front: - 1 × USB 2.0/LCD port - 1 × USB 3.0 port - 1 × VGA port • Rear: - 2 × USB 3.0 port - 1 × VGA port - 1 × system/BMC serial port (micro USB) - 1 × BMC management network port Note: OS installation on the USB storage media is not recommended. |
| Display | Integrated VGA on the DC-SCM board with a video memory of 64 MB and a maximum 16M color resolution of 1,920 × 1,200 at 60 Hz |
| Item | Description |
|---|---|
| Notes: • The integrated VGA can support a maximum resolution of 1,920 × 1,200 only when the video driver matching the OS version is installed; otherwise, only the default resolution of the OS is supported. • When both the front and rear VGA ports are connected to monitors, only the monitor connected to the front VGA port works. | |
| System Management | • UEFI • BMC • NC-SI • KSManage • KSManage Tools |
| Security Feature | • Intel Platform Firmware Resilience (PFR) • Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) • Intel Trusted Execution Technology • Firmware update mechanism based on digital signatures • UEFI Secure Boot • Double factor authentication • Single sign-on • BIOS secure boot based on TPM • BMC secure boot based on hardware • BIOS Secure Flash and BIOS Lock Enable (BLE) • BMC and BIOS dual-image mechanism • Chassis intrusion detection • Optional system secure wiping |
| Item | Description |
|---|---|
| Temperature1,2,3 | • Operating: 5°C to 45°C (41°F to 113°F) • Storage (packed): -40°C to +65°C (-40°F to +149°F) • Storage (unpacked): -40°C to +70°C (-40°F to +158°F) |
| Relative Humidity (RH, non-condensing) | • Operating: 5% to 90% RH • Storage (packed): 5% to 95% RH • Storage (unpacked): 5% to 95% RH |
| Operating Altitude | • Operating: 0 to 3,050 m (0 to 10,007 ft) • Shipping (storage): 0 to 12,000 m (0 to 39,370 ft) |
| Acoustic Noise4,5,6 | Noise emissions are measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Listed are the declared A-weighted |
| Item | Description |
|---|---|
| sound power levels (LWAd) and the declared average bystander position A-weighted sound pressure levels (LpAm) at a server operating temperature of 23°C (73.4°F): • Idle: - LWAd: 5.92 Bels - LpAm: 42.3 dBA • Operating: - LWAd: 6.14 Bels - LpAm: 46.3 dBA |
| Item | Description |
|---|---|
| Outer Packaging Dimensions (L × W × H) | 1,090 × 600 × 240 mm (42.91 × 23.62 × 9.45 in.) |
| Installation Dimension Requirements | • Installation requirements for the cabinet are as follows: - General cabinet compliant with the International Electrotechnical Commission 297 (IEC 297) standard - Width: 482.6 mm (19 in.) - Depth: Above 1,000 mm (39.37 in.) for the chassis with a depth of 800 mm (31.50 in.), and above 1,100 mm (43.31 in.) for the chassis with a depth of 850 mm (33.46 in.) • Installation requirements for the server rails are as follows: - L-bracket static rails: The distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.). - Ball-bearing rail kit: The distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.). |
| Weight | • 12 × 2.5-inch drive configuration: - Net weight: 19.96 kg (44.00 lbs) - Gross weight: 28.16 kg (62.08 lbs, including the server, packaging box, rails and accessory box) • 10 × 2.5-inch drive configuration (ten 2.5-inch drives and 3 GPUs loaded): - Net weight: 19.59 kg (43.19 lbs) - Gross weight: 27.98 kg (61.69 lbs, including the server, packaging box, rails and accessory box) • 4 × 3.5-inch drive + 4 × 2.5-inch drive configuration: - Net weight: 20.33 kg (44.82 lbs) - Gross weight: 29.27 kg (64.53 lbs, including the server, packaging box, rails and accessory box) |
| Item | Description |
|---|---|
| • 4 × 3.5-inch drive + 2 × E1.S SSD + 2 × M.2 SSD configuration: - Net weight: 19.83 kg (43.72 lbs) - Gross weight: 28.77 kg (63.43 lbs, including the server, packaging box, rails and accessory box) • 8 × 2.5-inch drive + 2 × M.2 SSD + 2 × E1.S SSD configuration: - Net weight: 18.57 kg (40.94 lbs) - Gross weight: 27.41 kg (60.43 lbs, including the server, packaging box, rails and accessory box) Note: The server weight varies by configuration. |
| Configuration | Za | Zb | Zc | Xa | Xb | Xc | Ya |
|---|---|---|---|---|---|---|---|
| 10 × 2.5-Inch Drive Configuration (configured with standard heatsinks) | 800 mm (31.50 in.) | 830 mm (32.68 in.) | 30.18 mm (1.19 in.) | 482 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| 12 × 2.5-Inch Drive Configuration | 850 mm (33.46 in.) | 880 mm (34.65 in.) | 30.18 mm (1.19 in.) | 482.1 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| Other Configurations | 850 mm (33.46 in.) | 880 mm (34.65 in.) | 30.18 mm (1.19 in.) | 482 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| Item | Description |
|---|---|
| Form Factor | 1U rack server |
| Chipset | Intel C741 chipset |
| Processor | Supports 1 or 2 processors. • Intel Xeon Scalable processors (SPR/EMR) • Integrated memory controllers and 8 memory channels per processor • Integrated PCIe controllers and 80 PCIe 5.0 lanes per processor • Up to 64 cores per CPU • Max. Turbo frequency of 4.2 GHz • 4 UPI links per CPU at up to 20 GT/s per link • L3 cache up to 5 MB per core • TDP up to 385 W Note: The information above is for reference only. See 7.2 Hardware Compatibility for details. |
| Memory | Supports up to 32 DDR5 DIMMs. |
| Item | Description |
|---|---|
| • RDIMMs supported • ECC, memory mirroring and memory sparing supported • 8 memory channels per processor with up to 2 DIMMs per channel • Up to 5,600 MT/s at 1 DPC and 4,400 MT/s at 2 DPC • Mixing DDR5 DIMMs of different specifications (capacity, bit width, rank, height, etc.) is not supported. • A server must use DDR5 DIMMs with the same part number (P/N code). Note: The information above is for reference only. See 7.2 Hardware Compatibility for details. | |
| Storage | Supports multiple drive configurations. See 5.7.1 Drive Configurations for details. • Front (one of the following configurations): - Up to 12 × E1.S SSD + 2 × M.2 SSD, the E1.S SSDs are hot-swappable, and the M.2 SSDs are not hot-swappable - Up to 4 × E3.S SSD or 4 × 2.5-inch SAS/SATA/NVMe drive, hot-swappable |
| Network | • Up to three 1/10/25/100/200 Gb hot-plug OCP 3.0 cards, with NC-SI feature • Standard 1/10/25/40/100/200 Gb PCIe NICs • 1 BMC management network port of 100/1,000 Mbps auto-negotiation |
| I/O Expansion | • Up to 4 standard PCIe expansion cards • Up to 2 rear and 1 front 1/10/25/100/200 Gb OCP 3.0 cards • For details, see 5.9.2 PCIe Slot Locations and 5.9.4 PCIe Slot Description. |
| Port | • Front: - 1 × USB 2.0/LCD port - 1 × USB 3.0 port - 1 × VGA port - 1 × BMC management network port • Rear: - 2 × USB 3.0 port - 1 × VGA port - 1 × system/BMC serial port (micro USB) |
| Item | Description |
|---|---|
| - 1 × BMC management network port Note: OS installation on the USB storage media is not recommended. | |
| Display | Integrated VGA on the DC-SCM board with a video memory of 64 MB and a maximum 16M color resolution of 1,920 × 1,200 at 60 Hz Notes: • The integrated VGA can support a maximum resolution of 1,920 × 1,200 only when the video driver matching the OS version is installed; otherwise, only the default resolution of the OS is supported. • When both the front and rear VGA ports are connected to monitors, only the monitor connected to the front VGA port works. |
| System Management | • UEFI • BMC • NC-SI • KSManage • KSManage Tools |
| Security Feature | • Intel Platform Firmware Resilience (PFR) • Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) • Intel Trusted Execution Technology • Firmware update mechanism based on digital signatures • UEFI Secure Boot • Double factor authentication • Single sign-on • BIOS secure boot based on TPM • BMC secure boot based on hardware • BIOS Secure Flash and BIOS Lock Enable (BLE) • BMC and BIOS dual-image mechanism • Chassis intrusion detection • Optional system secure wiping |
| Item | Description |
|---|---|
| Temperature1,2,3 | • Operating: 5°C to 45°C (41°F to 113°F) • Storage (packed): -40°C to +65°C (-40°F to +149°F) • Storage (unpacked): -40°C to +70°C (-40°F to +158°F) |
| Item | Description |
|---|---|
| Relative Humidity (RH, non-condensing) | • Operating: 5% to 90% RH • Storage (packed): 5% to 95% RH • Storage (unpacked): 5% to 95% RH |
| Operating Altitude | • Operating: 0 to 3,050 m (0 to 10,007 ft) • Shipping (storage): 0 to 12,000 m (0 to 39,370 ft) |
| Acoustic Noise4,5,6 | Noise emissions are measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Listed are the declared A-weighted sound power levels (LWAd) and the declared average bystander position A-weighted sound pressure levels (LpAm) at a server operating temperature of 23°C (73.4°F): • Idle: - LWAd: 5.92 Bels - LpAm: 42.3 dBA • Operating: - LWAd: 6.14 Bels - LpAm: 46.3 dBA |
| Item | Description |
|---|---|
| Outer Packaging Dimensions (L × W × H) | 1,090 × 600 × 240 mm (42.91 × 23.62 × 9.45 in.) |
| Installation Dimension Requirements | • Installation requirements for the cabinet are as follows: - General cabinet compliant with the International Electrotechnical Commission 297 (IEC 297) standard - Width: 482.6 mm (19 in.) - Depth: Above 1,000 mm (39.37 in.) for the chassis with a depth of 800 mm (31.50 in.), and above 1,100 mm (43.31 in.) for the chassis with a depth of 850 mm (33.46 in.) • Installation requirements for the server rails are as follows: - L-bracket static rails: The distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.). - Ball-bearing rail kit: The distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.). |
| Weight | • 12 × E1.S SSD configuration: - Net weight: 18.13 kg (39.97 lbs) - Gross weight: 26.69 kg (58.84 lbs, including the server, packaging box, rails and accessory box) • 4 × E3.SSD configuration: - Net weight: 16.1 kg (35.49 lbs) - Gross weight: 25.1 kg (55.34 lbs, including the server, packaging box, rails and accessory box) • 4 × 2.5-inch drive configuration: |
| Item | Description |
|---|---|
| - Net weight: 17.0 kg (37.48 lbs) - Gross weight: 25.4 kg (56.00 lbs, including the server, packaging box, rails and accessory box) Note: The server weight varies by configuration. |
| Configuration | Za | Zb | Zc | Xa | Xb | Xc | Ya |
|---|---|---|---|---|---|---|---|
| 4 × E3.S SSD/2.5-Inch Drive Configuration | 850 mm (33.46 in.) | 880 mm (34.65 in.) | 30.18 mm (1.19 in.) | 482 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| 12 × E1.S SSD + 2 × M.2 SSD Configuration |
| Item | Description |
|---|---|
| Form Factor | 1U rack server |
| Chipset | Intel C741 chipset |
| Processor | Supports 1 or 2 processors. • Intel Xeon Scalable processors (SPR/EMR) • Integrated memory controllers and 8 memory channels per processor • Integrated PCIe controllers and 80 PCIe 5.0 lanes per processor • Up to 64 cores per CPU • Max. Turbo frequency of 4.2 GHz • 4 UPI links per CPU at up to 20 GT/s per link • L3 cache up to 5 MB per core • TDP up to 385 W Note: The information above is for reference only. See 7.2 Hardware Compatibility for details. |
| Memory | Supports up to 32 DDR5 DIMMs. • RDIMMs supported • ECC, memory mirroring and memory sparing supported • 8 memory channels per processor with up to 2 DIMMs per channel • Up to 5,600 MT/s at 1 DPC and 4,400 MT/s at 2 DPC • Mixing DDR5 DIMMs of different specifications (capacity, bit width, rank, height, etc.) is not supported. • A server must use DDR5 DIMMs with the same part number (P/N code). Note: The information above is for reference only. See 7.2 Hardware Compatibility for details. |
| Storage | Supports multiple drive configurations. See 5.7.1 Drive Configurations for details. • Front (one of the following configurations): |
| Item | Description |
|---|---|
| - Up to 12 × 2.5-inch NVMe drive, hot-swappable - Up to 10 × 2.5-inch SAS/SATA/NVMe drive, hot-swappable - Up to 4 × 3.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD, the 3.5-inch drives and E1.S SSDs are hot-swappable, and the M.2 SSDs are not hot-swappable - Up to 8 × 2.5-inch SAS/SATA/NVMe drive + 2 × M.2 SSD + 2 × E1.S SSD, the 2.5-inch drives and E1.S SSDs are hot-swappable, and the M.2 SSDs are not hot-swappable | |
| Network | • Up to two 1/10/25/100/200 Gb hot-plug OCP 3.0 cards, with balanced mode supported for the dual-CPU configuration and NC-SI feature • Standard 1/10/25/40/100/200 Gb PCIe NICs • 1 BMC management network port of 100/1,000 Mbps auto-negotiation |
| I/O Expansion | • Up to 2 standard PCIe expansion cards • Up to two 1/10/25/100/200 Gb OCP 3.0 cards For details, see 5.9.2 PCIe Slot Locations and 5.9.4 PCIe Slot Description. |
| Cold Plate | • Material: copper • Liquid coolant: deionized water, PG25, etc. • Filtered particle size (diameter) ≤5μm • Flow rate: 1 to 1.4 L/min per node. The flow rate may vary by configuration • Inlet liquid temperature: below 50°C (122°F) • Outlet liquid temperature: varies by configuration • Operating pressure: below 50 psi • Maximum transient pressure: 100 psi • Quick disconnects: TSC/D-4Z02BSSJE |
| Port | • Front: - 1 × USB 2.0/LCD port - 1 × USB 3.0 port - 1 × VGA port • Rear: |
| Item | Description |
|---|---|
| - 2 × USB 3.0 port - 1 × VGA port - 1 × system/BMC serial port (micro USB) - 1 × BMC management network port Note: OS installation on the USB storage media is not recommended. | |
| Display | Integrated VGA on the DC-SCM board with a video memory of 64 MB and a maximum 16M color resolution of 1,920 × 1,200 at 60 Hz Notes: • The integrated VGA can support a maximum resolution of 1,920 × 1,200 only when the video driver matching the OS version is installed; otherwise, only the default resolution of the OS is supported. • When both the front and rear VGA ports are connected to monitors, only the monitor connected to the front VGA port works. |
| System Management | • UEFI • BMC • NC-SI • KSManage • KSManage Tools |
| Security Feature | • Intel Platform Firmware Resilience (PFR) • Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) • Intel Trusted Execution Technology • Firmware update mechanism based on digital signatures • UEFI Secure Boot • Double factor authentication • Single sign-on • BIOS secure boot based on TPM • BMC secure boot based on hardware • BIOS Secure Flash and BIOS Lock Enable (BLE) • BMC and BIOS dual-image mechanism • Chassis intrusion detection • Optional system secure wiping |
| Item | Description |
|---|---|
| Temperature1,2,3 | • Operating: 5°C to 45°C (41°F to 113°F) • Storage (packed): -40°C to +65°C (-40°F to +149°F) • Storage (unpack ed): -40°C to +70°C (-40°F to +158°F) |
| Relative Humidity (RH, non-condensing) | • Operating: 5% to 90% RH • Storage (packed): 5% to 95% RH • Storage (unpack ed): 5% to 95% RH |
| Operating Altitude | • Operating: 0 to 3,050 m (0 to 10,007 ft) • Shipping (storage): 0 to 12,000 m (0 to 39,370 ft) |
| Acoustic Noise4,5,6 | Noise emissions are measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Listed are the declared A-weighted sound power levels (LWAd) and the declared average bystander position A-weighted sound pressure levels (LpAm) at a server operating temperature of 23°C (73.4°F): • Idle: - LWAd: 5.92 Bel - LpAm: 42.3 dBA • Operating: - LWAd: 6.14 Bel - LpAm: 46.3 dBA |
| Item | Description |
|---|---|
| Outer Packaging Dimensions (L × W × H) | 1,090 × 600 × 240 mm (42.91 × 23.62 × 9.45 in.) |
| Installation Dimension Requirements | • Installation requirements for the cabinet are as follows: - General cabinet compliant with the International Electrotechnical Commission 297 (IEC 297) standard - Width: 482.6 mm (19 in.) - Depth: above 1,000 mm (39.37 in.) for the chassis with a depth of 800 mm (31.50 in.), and above 1,100 mm (43.31 in.) for the chassis with a depth of 850 mm (33.46 in.) • Installation requirements for the server rails are as follows: - L-bracket static rails: The distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.). - Ball-bearing rail kit: The distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.). |
| Configuration | Za | Zb | Zc | Xa | Xb | Xb | Ya |
|---|---|---|---|---|---|---|---|
| 10 × 2.5-Inch Drive Configuration | 800 mm (31.50 in.) | 830 mm (32.68 in.) | 30.18 mm (1.19 in.) | 482 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| 12 × 2.5-Inch Drive Configuration | 850 mm (33.46 in.) | 880 mm (34.65 in.) | 30.18 mm (1.19 in.) | 482.1 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| Other Configurations | 850 mm (33.46 in.) | 880 mm (34.65 in.) | 30.18 mm (1.19 in.) | 482 mm (18.98 in.) | 438 mm (17.24 in.) | 438 mm (17.24 in.) | 43.05 mm (1.69 in.) |
| Model | Cores | Threads | Base Frequency (GHz) | Max. Turbo Frequency (GHz) | Cache (MB) | TDP (W) |
|---|---|---|---|---|---|---|
| 8480+ | 56 | 112 | 2.00 | 3.80 | 105 | 350 |
| 8470 | 52 | 104 | 2.00 | 3.80 | 105 | 350 |
| 8468 | 48 | 96 | 2.10 | 3.80 | 105 | 350 |
| 8462Y+ | 32 | 64 | 2.80 | 4.10 | 60 | 300 |
| 6442Y | 24 | 48 | 2.60 | 4.00 | 60 | 225 |
| 6438M | 32 | 64 | 2.20 | 3.90 | 60 | 205 |
| 6426Y | 16 | 32 | 2.50 | 4.10 | 37.5 | 185 |
| 6430 | 32 | 64 | 2.10 | 3.40 | 60 | 270 |
| 6454S | 32 | 64 | 2.20 | 3.40 | 60 | 270 |
| 6418H | 24 | 48 | 2.10 | 4.00 | 60 | 185 |
| 6416H | 18 | 36 | 2.20 | 4.20 | 45 | 165 |
| 5418Y | 24 | 48 | 2.00 | 3.80 | 45 | 185 |
| 4410T | 10 | 20 | 2.70 | 4.00 | 26.25 | 150 |
| 8592+ | 64 | 128 | 1.9 | 3.90 | 320 | 350 |
| 8580 | 60 | 120 | 2.00 | 4.00 | 300 | 350 |
| 8570 | 56 | 112 | 2.10 | 4.00 | 300 | 350 |
| 8568Y+ | 48 | 96 | 2.30 | 4.00 | 300 | 350 |
| 8592V | 64 | 128 | 2.00 | 3.90 | 320 | 330 |
| 8581V | 60 | 120 | 2.00 | 3.90 | 300 | 270 |
| Model | Cores | Threads | Base Frequency (GHz) | Max. Turbo Frequency (GHz) | Cache (MB) | TDP (W) |
|---|---|---|---|---|---|---|
| 8562Y+ | 32 | 64 | 2.80 | 4.10 | 60 | 300 |
| 6548Y+ | 32 | 64 | 2.50 | 4.10 | 60 | 250 |
| 6544Y | 16 | 32 | 3.60 | 4.10 | 45 | 270 |
| 6534 | 8 | 16 | 3.90 | 4.20 | 22.5 | 195 |
| 6526Y | 16 | 32 | 2.80 | 3.90 | 37.5 | 195 |
| 6538Y+ | 32 | 64 | 2.20 | 4.00 | 60 | 225 |
| 6548N | 32 | 64 | 2.80 | 4.10 | 60 | 250 |
| 6542Y | 24 | 48 | 2.90 | 4.10 | 60 | 250 |
| 5520+ | 28 | 56 | 2.20 | 4.00 | 52.5 | 205 |
| 5515 + | 8 | 16 | 3.20 | 4.10 | 22.5 | 165 |
| 5512U | 28 | 56 | 2.10 | 3.70 | 52.5 | 185 |
| 4516Y+ | 24 | 48 | 2.20 | 3.70 | 45 | 185 |
| Type | Capacity (GB) | Speed (MT/s) | Data Width | Organization |
|---|---|---|---|---|
| RDIMM | 16 | 4,800 | x80 | 1R x8 |
| RDIMM | 32 | 4,800 | x80 | 1R x4/2R x8 |
| RDIMM | 64 | 4,800 | x80 | 2R x4 |
| RDIMM | 96 | 4,800 | x80 | 2R x4 |
| RDIMM | 128 | 4,800 | x80 | 4R x4 |
| RDIMM | 16 | 5,600 | x80 | 1R x8 |
| RDIMM | 32 | 5,600 | x80 | 2R x8 |
| RDIMM | 64 | 5,600 | x80 | 2R x4 |
| Type | Speed (RPM) | Capacity | Max. Qty. |
|---|---|---|---|
| SAS HDD | 10K | 600 GB/1.2 TB/1.8 TB/2.4 TB | 12 |
| Type | Speed (RPM) | Capacity | Max. Qty. |
|---|---|---|---|
| SATA HDD | 7.2K | 4 TB/6 TB/8 TB/10 TB/12 TB/14 TB/16 TB/18 TB | 4 |
| Type | Capacity | Max. Qty. |
|---|---|---|
| SATA SSD | 240 GB | 12 |
| SATA SSD | 480 GB | 12 |
| SATA SSD | 960 GB | 12 |
| SATA SSD | 1.92 TB | 12 |
| SATA SSD | 3.84 TB | 12 |
| SATA SSD | 7.68 TB | 12 |
| SAS SSD | 960 GB | 12 |
| SAS SSD | 1.92 TB | 12 |
| SAS SSD | 3.84 TB | 12 |
| Type | Capacity | Max. Qty. |
|---|---|---|
| U.2 NVMe SSD | 960 GB | 12 |
| U.2 NVMe SSD | 1.6 TB | 12 |
| U.2 NVMe SSD | 1.92 TB | 12 |
| U.2 NVMe SSD | 3.2 TB | 12 |
| U.2 NVMe SSD | 3.8 TB | 12 |
| U.2 NVMe SSD | 6.4 TB | 12 |
| U.2 NVMe SSD | 7.68 TB | 12 |
| U.2 NVMe SSD | 8 TB | 12 |
| U.2 NVMe SSD | 12.8 TB | 12 |
| U.2 NVMe SSD | 15.36 TB | 12 |
| Type | Capacity | Max. Qty. |
|---|---|---|
| SATA M.2 SSD | 240 GB | 2 |
| Type | Capacity | Max. Qty. |
|---|---|---|
| SATA M.2 SSD | 480 GB | 2 |
| PCIe M.2 SSD | 960 GB | 2 |
| PCIe M.2 SSD | 1.92 TB | 2 |
| PCIe M.2 SSD | 3.84 TB | 2 |
| Type | Description |
|---|---|
| SAS Card | SAS Card_MT0801M6E_SHBA_8_SAS4_P4E |
| SAS Card_MT0800M6H_HBA_8_SAS4_P4E | |
| SAS Card_BRCM_8R0_9500-8i_SMSAS3_PCIE4 | |
| SAS Card_BRCM_16R0_9500-16i_SMSAS3_PCIE4 | |
| SAS卡_PM8222_SmartHBA_8_SAS3_PCIE3_MCTP | |
| SAS卡_PM8222_HBA_8_SAS3_PCIE3_MCTP | |
| SAS卡_MT0801M6E_SHBA_8_SAS4_P4E | |
| SAS卡_MT0800M6H_HBA_8_SAS4_P4E | |
| RAID Card | RAID Card_MT0804M6R_RA_8_4GB_SAS4_P4E |
| RAID Card_MT0808M6R_RA_8_8GB_SAS4_P4E | |
| RAID Card_BRCM_8R0_9540-8i_0_SMSAS3_PCIE4 | |
| RAID Card_BRCM_8R0_9560-8i_4G_SS3_P4_7 | |
| RAID Card_BRCM_16R0_9560-16i_8G_SS3_P4_7 | |
| RAID Card_SND_2R0_9230_N_M.2_PCIE2_v1 | |
| RAID Card_BRCM_8R0_9560-8i_4G_SMSAS3_PCIE4 | |
| RAID Card_BRCM_16R0_9560-16i_8G_SMSAS3_PCIE4 | |
| RAID Card_PM8204_RA_8_2GB_SAS3_PCIE3_MCTP | |
| RAID Card_PM8204_RA_8_4GB_SAS3_PCIE3 | |
| RAID Card_MT0804M6R_RA_8_4GB_SAS4_P4E | |
| RAID Card_MT0808M6R_RA_8_8GB_SAS4_P4E |
| Type | Description | Speed (Gbps) | Port Qty. |
|---|---|---|---|
| OCP 3.0 Card | NIC_SND_1G_I350_RJ_OCP3x4_2_XR | 1 | 2 |
| NIC_Andes-M6_X710_10G_LC_OCP3x8_2 | 10 | 2 | |
| NIC_I_10G_X710-DA2_LC_OCP3x16_2_XR | 10 | 2 | |
| NIC_I_10G_X710T4L_RJ_OCP3x8_4_XR | 10 | 4 | |
| NIC_SND_10G_X550_RJ_OCP3x4_2_XR | 10 | 2 | |
| NIC_M_25G_MCX562A-ACAB_LC_OCP3x16_2_XR | 25 | 2 | |
| NIC_M_25G_MCX623432AN_LC_OCP3x16_2_XR | 25 | 2 | |
| NIC_M_25G_MCX631432AN_LC_OCP3x8_2_XR | 25 | 2 | |
| NIC_Andes-M6_E810_25G_LC_OCP3x8_2 | 25 | 2 | |
| NIC_BRCM_100G_57508_LC_OCP3x16_2_XR | 100 | 2 | |
| NIC_I_100G_E810CQDA2_LC_OCP3x16_2_XR | 100 | 2 | |
| NIC_M_200G_MCX623435AN_LC_OCP3x16_XR | 200 | 1 | |
| NIC_Mozart_I350_1G_RJ_O3x4_4 | 1 | 4 |
| Type | Description | Speed (Gbps) | Port Qty. |
|---|---|---|---|
| PCIe NIC | NIC_SND_W_I350-AM2_RJ_PCI-E4X_1KM_Dual | 1 | 2 |
| NIC_Vostok_I350_1G_RJ_PCIEx4_4 | 1 | 2 | |
| NIC_Intel_W_I350-T2V2_RJ_PCI-E4X_1KM_Dual | 1 | 2 | |
| NIC_I_10G_X710DA2_LC_PCIEx8_2_XR | 10 | 2 | |
| NIC_I_10G_EX710DA2_LC_PCIEx8_2_XR_Lmt | 10 | 2 | |
| NIC_Vostok_X710_10G_LC_PCIEx8_2 | 10 | 2 | |
| NIC_SOLARFL_25G_9250_LC_PCIEx8_2_XR_PLUS | 10 | 2 | |
| NIC_Sbt_X722_10G_LC_PCIEx8-G3_2 | 10 | 2 | |
| NIC_X550_10G_RJ45_PCIEX8_Dual | 10 | 2 | |
| NIC_I_10G_X710T2L_RJ_PCIEx8_2_XR | 10 | 2 | |
| NIC_M_25G_MCX512A-ACAT_LC_PCIEx8_2_XR | 25 | 2 | |
| NIC_M_25G_MCX631102AN_LC_PCIEx8_2_XR | 25 | 2 | |
| NIC_Andes-M6_E810_25G_LC_PCIEx8_2 | 25 | 2 | |
| NIC_I_25G_E810XXVDA2_LC_PCIEx8_2_XR | 25 | 2 | |
| NIC_BRCM_25G_57414_LC_PCIEx8_2_XR_42C | 25 | 2 | |
| NIC_I_25G_E810XXVDA4_LC_PCIEx16_4_XR | 25 | 4 | |
| NIC_I_40G_EXL710QDA2_LC_PCIEx8_2_XR | 40 | 2 | |
| NIC_M_100G_MCX623106AN_LC_PCIEx16_2_XR | 100 | 2 | |
| NIC_BRCM_100G_508_LC_PCIEx16_2_XR | 100 | 2 | |
| NIC_I_100G_E810CQDA2_LC_PCIEx16_2_XR | 100 | 2 | |
| NIC_M_200G_MCX623105AN_LC_PCIEx16_XR | 200 | 1 | |
| NIC_Vostok_I350_1G_RJ_P4-G2_4 | 1 | 4 | |
| NIC_Pyxis_X550_10G_RJ_P4-G3_2 | 10 | 2 | |
| NIC_Vostok_X710_10G_LC_P8-G3_2 | 10 | 2 | |
| NIC_Andes-M6_E810_25G_LC_P8-G4_2 | 25 | 2 | |
| NIC_BRCM_25G_57414_LC_PCIEx8_2_XR | 25 | 2 |
| Type | Description | Speed (Gbps) | Port Qty. |
|---|---|---|---|
| HBA Card | HBA Card_E_OR1_LPE31000-AP_FC16G_PCIE | 16 | 1 |
| HBA Card_E_OR2_LPE31002-AP_FC16G_PCIE | 16 | 2 | |
| HBA Card_QL_OR1_QLE2690-ISR-BK_FC16G_PCIE | 16 | 1 | |
| HBA Card_QL_OR2_QLE2692-ISR-BK_FC16G_PCIE | 16 | 2 | |
| HBA Card_E_OR1_LPE32000-AP_FC32G_PCIE | 32 | 1 | |
| HBA Card_E_OR2_LPE32002-AP_FC32G_PCIE | 32 | 2 | |
| HBA Card_QL_OR1_QLE2740_FC32G_PCIE | 32 | 1 | |
| HBA Card_QL_OR2_QLE2742-ISR-BK_FC32G_PCIE | 32 | 2 | |
| HBA Card_E_OR1_LPE35000-AP_FC32G_PCIE | 32 | 1 | |
| HBA Card_E_OR2_LPE35002_FC32G_PCIE | 32 | 2 | |
| HBA Card_Marvell_OR1_QLE2770_FC32G_PCIE_4.0 | 32 | 1 | |
| HBA Card_Marvell_OR2_QLE2772_FC32G_PCIE_4.0 | 32 | 2 |
| Type | Description | Speed (Gbps) | Port Qty. |
|---|---|---|---|
| HCA Card | MCX653105A-ECAT PCIe 3.0/4.0 X16 | 100 | 1 |
| MCX653106A-ECAT PCIe 3.0/4.0 X16 | 100 | 2 | |
| MCX653105A-HDAT PCIe 3.0/4.0 X16 | 100 | 1 | |
| MCX653106A-HDAT PCIe 3.0/4.0 x16 | 100 | 2 | |
| HCA Card_NV_1-NDR_MCX75310AAS-NEAT_PCIE | 200 | 1 |
| Type | Description | Max. Qty. |
|---|---|---|
| GPU | GPU_NV_16G_NVIDIA-A2-PCIe4_128b | 3 |
| Graphics Card_NV_8G_T1000_128b_P | 3 |
| Type | Description | Max. Qty. |
|---|---|---|
| Graphics Card | Graphics Card_NV_4G_T400_64b_P | 3 |
| Organization | Weight Limit (kg/lbs) |
|---|---|
| European Committee for Standardization (CEN) | 25/55.13 |
| International Organization for Standardization (ISO) | 25/55.13 |
| National Institute for Occupational Safety and Health (NIOSH) | 23/50.72 |
| Health and Safety Executive (HSE) | 25/55.13 |
| General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China (AQSIQ) | • Male: 15/33.08 • Female: 10/22.05 |
| Feature | Description |
|---|---|
| Management Interface | Supports extensive remote management interfaces for various server O&M scenarios. The supported interfaces include: • IPMI • SMASH CLP • SNMP • HTTPS • Web GUI • Redfish • Syslog |
| Accurate and Intelligent Fault Location | IDL, a fault diagnosis system, offers accurate and comprehensive hardware fault location capabilities, and outputs detailed fault causes and handling suggestions. |
| Alert Management | Supports rich automatic remote alert capabilities, including proactive alerting mechanisms such as SNMP Trap (v1/v2c/v3), email alerts and syslog remote alerts to ensure 24 × 7 reliability. |
| Feature | Description |
|---|---|
| Remote Console KVM | Supports HTML5- and Java-based remote console to remotely control and operate the monitor/mouse/keyboard of the server, providing highly available remote management capabilities without on-site operation. |
| Virtual Network Console (VNC) | Supports mainstream third-party VNC clients without relying on Java, improving management flexibility. |
| Remote Virtual Media | Supports virtualizing local images, USB devices, and folders as media devices of remote servers, simplifying OS installation, file sharing, and other O&M tasks. |
| Web GUI | Supports the visual management interface, displaying abundant information of the server and components, and offers easy-to-use Web GUIs. |
| Crash Screenshot and Crash Video Recording | Supports automatic crash screenshot and crash video recording (video needs to be enabled manually) to capture the last screen and video before crash provides manual screenshot, which can quickly capture the screen for easy inspection at scheduled time. |
| Dual Flash and Dual Image | Supports dual flash and dual image, enabling automatic flash failover in case of software or flash corruption, improving operational reliability. |
| Power Capping | Supports power capping, increasing deployment density and reducing energy consumption. |
| IPv4/IPv6 | Supports both IPv4 and IPv6, enhancing network deployment flexibility. |
| Auto-Switching of Management Network Port | Supports auto-switching between the dedicated management network port and shared management network port, providing customers with flexible network deployment solutions for different management network deployment scenarios. |
| BMC Self-Diagnosis and Self-Recovery System | • Supports the reliable dual watchdog mechanism for hardware and software, enabling automatic restoration of BMC in case of BMC abnormality. • Provides a thermal protection mechanism, which is automatically triggered when the BMC is abnormal to ensure that the fan operates at safe speeds to avoid system overheating. • Supports self-diagnosis of processors, memory modules, and storage devices of BMC, and automatically cleans the workload to restore to normal when the device usage rate is too high. |
| Power Control | Supports virtual power buttons for power on/off, power cycle and reset. |
| Feature | Description |
|---|---|
| UID LED | Supports remote lighting of the UID LED for locating the server in the server room. |
| Secure Firmware Update | • Supports firmware update based on secure digital signatures, and mismatch prevention mechanism for firmware from different manufacturers and firmware for different models; • Supports firmware update of BMC/BIOS/CPLD/PSU. |
| Serial Port Redirection | Supports remote redirection of the system serial port, BMC serial port and other serial ports, and directs the server-side serial port output to the local administrator via the network for server debugging. |
| Storage Information Display | Displays RAID logical array information and drive information, and supports remote RAID creation for improved deployment efficiency. |
| User Role Management | Supports user detail management based on user roles and flexible creation of user roles with different privileges, and provides more user roles to allow administrators to grant different privileges to O&M personnel. |
| Security Features | Adopts the industry-leading server security baseline standard V3.0. SSH, HTTPS, SNMP and IPMI use secure and reliable algorithms. BMC offers capabilities including secure update and boot and security reinforcement mechanisms such as anti-replay, anti-injection, and anti-brute force. |
| Double Factor Authentication | Supports double factor authentication for local BMC users. Users need to log in to the BMC with both password and certificate, thus to prevent attacks caused by password leakage. |
| Configuration Exporting and Importing | To import and export the existing system configurations. |
| System Information Display | Displays the server basic information such as the information and health status of key server components, including CPU, memory, power supply, device inventory, hard drive, network adapter, and security chip. |
| Fan Management | Displays the status, current speed, duty ratio, and other information of a fan module. You can select the fan control mode and preset the speed for each fan module in the Manual Fan Control mode. |
| Power Policy | To set how the server operating system reacts under the BMC's control when AC power is reconnected to the server. |
| Feature | Description |
|---|---|
| One-Click Erasing | To perform non-recoverable erasing on all storage devices of the server, preventing data leakage when the server is to be retired. |
| System Lockdown | After this feature is enabled, some parameters of the server cannot be set and some operations cannot be performed on the server. |
| Feature | Description |
|---|---|
| Home | • Display of basic information (data centers, server rooms, cabinets, assets and alerts), quick addition of devices and custom home page |
| Assets | • Online asset management combined with offline asset management enabled by IoT solutions brings integrated digital asset management • Management of the full range of our server family, including general-purpose rack servers, AI servers, multi-node servers, edge servers and all-in-one servers • Management of our general-purpose disk arrays and distributed storage devices • Management of network devices (switches, routers, etc.), security devices (firewalls, load balancers, etc.), cabinets and clouds • Management of data centers • Asset warranty information management, asset inventory reports for server acceptance, asset attribute expansion, etc. |
| Monitor | • Display of real-time alerts, history alerts, blocked alerts and events • Fault prediction of drives and memories • Custom inspection plan and inspection result management • Notification record viewing • Intelligent fault diagnosis and analysis, automatic fault reporting and repair ticket viewing • Trap management and Redfish management • Management of monitoring rules, such as alert rules, notification rules, blocking rules, alert noise reduction rules, compression rules and fault reporting rules, and redefinition of the above rules. |
| Control | • Quick start of firmware update, OS installation, power management, drive data erasing and stress test • Batch firmware update (BMC/BIOS/RAID Card/NIC/Drive/HBA Card/MB CPLD/BP CPLD/PSU) • Batch firmware configuration (BMC/BIOS) • Batch RAID configuration and OS deployment for servers • Secure and quick drive data erasing • CPU and memory stress test • Automatic firmware baseline management • BMC and BIOS snapshot management |
| Feature | Description |
|---|---|
| • Repositories for update files | |
| Energy Efficiency | • Overview of data center power consumption trend chart and carbon emission trend chart • Setting of server dynamic power consumption policies and minimum power consumption policies • Carbon asset and carbon emission management |
| Log | • Fault log record management • Diagnosis record and diagnosis rule management |
| Topologies | • Centralized management of multiple data centers and panoramic 3D views, including dynamic display of power consumption, temperature, alerts and cabinet capacity of the data center • Network topologies |
| Reports | • Management of warranty information reports, alert reports, asset reports, hardware reports and performance reports • Export of reports in .xlsx format |
| System | • Password management, alert forwarding and data dump • Customized KSManage parameters |
| Security | Security control of KSManage via a set of security policies such as user management, role management, authentication management (local authentication and LDAP authentication) and certificate management. |
| Feature | Description |
|---|---|
| KSManage Kits | A lightweight automatic batch O&M tool for servers, mainly used for server deployment, routine maintenance, firmware update, fault handling, etc. |
| KSManage Boot | A unified batch management platform for bare metals, with features including firmware management, hardware configuration, system deployment and migration, stress test and in-band management |
| KSManage Server CLI | Fast integration with third-party management platforms, delivering a new O&M mode of Infrastructure as Code (IaC) |
| Feature | Description |
|---|---|
| KSManage Driver | Operates under the OS and gets system asset and performance information via the in-band mode, providing users with more comprehensive server management capabilities |
| KSManage Server Provisioning | Offers users with RAID configuration, intelligent OS installation, firmware update, hardware diagnosis, secure erasing and software upgrade, using the TF card as the carrier |
| Country/Region | Certification | Mandatory/Voluntary |
|---|---|---|
| International | CB | Voluntary |
| EU | CE | Mandatory |
| US | FCC | Mandatory |
| UL | Voluntary | |
| Energy Star | Voluntary | |
| EAEU | EAC | Mandatory |
| EAC RoHS | ||
| India | BIS | Mandatory |
| South Korea | E-Standby | Mandatory |
| KC | ||
| Australia | RCM | Mandatory |
| Taiwan (China) | BSMI | Mandatory |
| United Arab Emirates | ECAS RoHS | Mandatory |
| Mexico | NOM | Mandatory |
| Egypt | NTRA | Voluntary |
| Saudi Arabia | SABER | Mandatory |
| Configuration | Max. Operating Temp. 30°C (86°F) | Max. Operating Temp. 35°C (95°F) | Max. Operating Temp. 40°C (104°F) | Max. Operating Temp. 45°C (113°F) | |
|---|---|---|---|---|---|
| 4 × 3.5-Inch Drive Config. | NIC Config. | All options supported | CPUs ≤300 W when NICs ≥200 Gb are configured | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported |
| GPU Config. | CPUs ≤300 W | CPUs ≤250 W | GPUs not supported | GPUs not supported | |
| Drive Config. | All options supported | CPUs ≤250 W | Rear drives not supported | Rear drives not supported | |
| 10 × 2.5-Inch Drive/8 × 2.5-Inch Drive Config. | NIC Config. | All options supported | CPUs ≤300 W when NICs ≥200 Gb are configured | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported |
| GPU Config. | CPUs ≤300 W | CPUs ≤250 W | GPUs not supported | GPUs not supported | |
| Drive Config. | All options supported | CPUs ≤250 W | Rear drives not supported | Rear drives not supported | |
| 12 × 2.5-Inch Drive Config. | NIC Config. | All options supported | CPUs ≤300 W when NICs ≥200 Gb are configured | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported |
| GPU Config. | CPUs ≤300 W | CPUs ≤250 W | GPUs not supported | GPUs not supported | |
| Configuration | Max. Operating Temp. 30°C (86°F) | Max. Operating Temp. 35°C (95°F) | Max. Operating Temp. 40°C (104°F) | Max. Operating Temp. 45°C (113°F) | |
|---|---|---|---|---|---|
| Drive Config. | All options supported | CPUs ≤250 W | Rear drives not supported | Rear drives not supported | |
| Configuration | Max. Operating Temp. 30°C (86°F) | Max. Operating Temp. 35°C (95°F) | Max. Operating Temp. 40°C (104°F) | Max. Operating Temp. 45°C (113°F) | |
|---|---|---|---|---|---|
| 12 × E1.S SSD Config. | NIC Config. | All options supported | CPUs ≤300 W when NICs ≥200 Gb are configured | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported |
| GPU Config. | CPUs ≤300 W | • Front GPU: CPUs ≤225 W • Rear GPU: CPUs ≤250 W | GPUs not supported | GPUs not supported | |
| Drive Config. | All options supported | CPUs ≤250 W | Rear drives not supported | Rear drives not supported | |
| 4 × 2.5-Inch Drive/ E3.S SSD Config. | NIC Config. | All options supported | CPUs ≤300 W when NICs ≥200 Gb are configured | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported | • CPUs ≥165 W not supported • NICs ≥100 Gb not supported |
| Configuration | Max. Operating Temp. 30°C (86°F) | Max. Operating Temp. 35°C (95°F) | Max. Operating Temp. 40°C (104°F) | Max. Operating Temp. 45°C (113°F) | |
|---|---|---|---|---|---|
| GPU Config. | CPUs ≤300 W | CPUs ≤250 W | GPUs not supported | GPUs not supported | |
| Drive Config. | All options supported | CPUs ≤270 W | Rear drives not supported | Rear drives not supported | |
| Configuration | Max. Operating Temp. 35°C (95°F) | Max. Operating Temp. 40°C (104°F) | Max. Operating Temp. 45°C (113°F) | |
|---|---|---|---|---|
| All models | All configurations | All options supported | • NICs ≥100 Gb not supported • GPUs not supported • Rear drives not supported | • NICs ≥100 Gb not supported • GPUs not supported • Rear drives not supported |
| Certified Model | Description |
|---|---|
| KR1280-X2-A0-R0-00 | Global |
| KR1280-X2-A0-F0-00 | Global |
| KR1280-X2-C0-R0-00 | Global |
| Sensor | Description | Sensor Location |
|---|---|---|
| Inlet_Temp | Air inlet temperature | Motherboard |
| Outlet_Temp | Air outlet temperature | Motherboard |
| PVCCIN_CPUx | CPUx core voltage | CPUx x indicates the CPU number with a value of 0 - 1 |
| PVCCFA_FIVR_CPUx | UPI IIO voltage | CPUx x indicates the CPU number with a value of 0 - 1 |
| PVCCINFAON_CPUx | CPUx boot voltage | CPUx x indicates the CPU number with a value of 0 - 1 |
| PVCCFA_EHV_CPUx | Controller voltage | CPUx x indicates the CPU number with a value of 0 - 1 |
| PVCCD_HV_CPUx | Memory controller voltage | CPUx x indicates the CPU number with a value of 0 - 1 |
| CPUx_VR_Temp | CPUx VR temperature | CPUx x indicates the CPU number with a value of 0 - 1 |
| PSUx_VIN | PSUx input voltage | PSUx x indicates the PSU number with a value of 0 - 1 |
| PSUx_VOUT | PSUx output voltage | PSUx x indicates the PSU number with a value of 0 - 1 |
| SYS_12V | System 12 V voltage (output by HSC) | Motherboard |
| SYS_5V | System 5 V voltage | Motherboard |
| SYS_3V3 | System 3.3 V voltage | Motherboard |
| Sensor | Description | Sensor Location |
|---|---|---|
| RTC_Battery | Motherboard RTC battery voltage | Motherboard |
| PVNN_MAIN_CPUx | CPUx voltage | Motherboard |
| P12V_CPUx_DIMM | CPUx DIMM voltage | Motherboard |
| PVNN_PCH_STBY | PCH core voltage | Motherboard |
| P1V05_PCH_STBY | PCH logic voltage | Motherboard |
| CPUx_Temp | CPUx core temperature | CPUx x indicates the CPU number with a value of 0 - 1 |
| CPUx_DTS | CPU margin temperature before it reaches the throttling frequency | CPUx x indicates the CPU number with a value of 0 - 1 |
| CPUx_DIMM_T | The maximum temperature among DDR5 DIMMs of CPUx | CPUx x indicates the CPU number with a value of 0 - 1 |
| PCH_Temp | PCH temperature | Motherboard |
| PSU_Inlet_Temp | PSU temperature | PSU |
| Total_Power | Total power | Motherboard |
| FAN_Power | Total fan power | Fan |
| PSUx_PIN | PSUx input power | PSUx x indicates the PSU number with a value of 0 - 1 |
| PSUx_POUT | PSUx output power | PSUx x indicates the PSU number with a value of 0 - 1 |
| CPU_Power | Total CPU power | Motherboard |
| Memory_Power | Total memory power | Motherboard |
| FANx_F_Speed, FANx_R_Speed | FANx speed | • FANx: x indicates the fan number with a value of 0, 2, 3, 5, 6, 7, 8 or 9 • F stands for front fan • R stands for rear fan |
| RAID_Temp | PCIe RAID card temperature (Max temp. will be taken in case of multiple RAID | PCIe RAID card |
| Sensor | Description | Sensor Location |
|---|---|---|
| cards, including SAS, RAID, and HBA) | ||
| HDD_MAX_Temp | Maximum temperature among all drives | - |
| OCP_RAID_Temp | RAID mezz card temperature | RAID mezz card |
| NVMe_Temp | Maximum temperature among all NVMe drives | - |
| OCP_NIC_SFP_Temp | OCP card SFP module temperature | Optical module |
| PCIe_NIC_SFP_T | PCIe NIC SFP module temperature | Optical module |
| OCP_NIC_Temp | OCP card temperature (Max temp. will be taken in case of multiple OCP cards) | OCP card |
| PCIe_NIC_Temp | PCIe NIC temperature (Max temp. will be taken in case of multiple PCIe NICs) | PCIe NIC |
| MEM_ResourceRate | Memory utilization rate | - |
| CPU_ResourceRate | CPU utilization rate | - |
| GPUx_Temp | GPUx core temperature | GPUx x indicates the GPU number with a value of 0 - 2 |
| CPUx_Status | CPUx status | CPUx x indicates the CPU number with a value of 0 - 1 |
| SEL_Status | SEL status | - |
| PSU_Mismatch | PSU model mismatch | - |
| PSU_Redundant | PSU redundancy status | - |
| FANx_Status | FANx status | FANx x indicates the fan number with a value of 0, 2, 3, 5, 6, 7, 8 or 9 |
| FAN_Redundant | Fan redundancy status | - |
| PCIe_Status | The status of PCIe device (including PCIe buses, slots and expansion cards) | - |
| Sensor | Description | Sensor Location |
|---|---|---|
| POST_Status | System firmware and POST status | - |
| PWR_CAP_Fail | Power capping failure | - |
| CPU_Config | CPU configuration status (mixing of CPUs, or primary CPU not installed) | - |
| PSUx_Status | PSUx status | PSUx x indicates the PSU number with a value of 0 - 1 |
| K_HDDx | Drive | Drive • K denotes front, internal and rear, with a value of F/I/R respectively • x indicates the drive number with a value of 0 - 11 |
| ACPI_PWR | ACPI power status | - |
| Sys_Health | System health status | - |
| BMC_Boot_Up | BMC boot up complete | - |
| BIOS_Boot_Up | BIOS boot up complete | - |
| Intrusion | Detects chassis-opening activity | Top cover |
| LeakageSensor | Leak detection | Leak detection cable |
| ME_FW_Status | ME health status | - |
| TPM_Verify | TPM status verification | - |
| ACPI_PWR | ACPI power status | - |
| PWR_On_TMOUT | Power on timeout | - |
| System_Error | System emergency error | - |
| BMC_Status | BMC status | - |
| HBA_Temp | HBA card temperature | HBA card |
| FPGA_Card_Temp | FPGA temperature | FPGA card |
| PCIe_HCA_Temp | PCIe HCA card temperature | HCA card |
| PCIe_HCA_SFP_T | PCIe HCA card SFP module temperature | HCA card SFP module |
| Sensor | Description | Sensor Location |
|---|---|---|
| R_HDD_BP_Temp | Rear drive temperature | Rear drive backplane |
