# Aivres KR2180 white paper (parsed) Parsed from Aivres's PDF https://aivres.com/wp-content/uploads/Aivres-White-Paper-KR2180-E2-v1.pdf on 2026-10-15 (94 pages; OCR and table reconstruction by Reducto; tables are HTML inside this Markdown, images are figure crops from the PDF). Specifications belong to Aivres and are subject to change without notice; the PDF is the authority. Products: [kr2180-e2](https://aivres.upstation.io/p/kr2180-e2) ---

White Paper for KR2180V2 Series Servers Powered by AMD Processors For KR2180-E2-A0-R0-00 Document Version: V1.0 Release Date: Apri 28, 2025 Copyright © 2025 AIVRES SYSTEMS INC. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without our prior written consent. Applicable Model Model: KR2180-E2-A0-R0-00 Maintenance: Rear access Cooling: Air cooling Technical Support Global Service Hotline: (+1) 844-912-0007 Address: 1501 McCarthy Blvd, Milpitas, CA 95035 AIVRES SYSTEMS INC. Website: https://aivres.com Email: serversupport@aivres.com Environmental Protection Please dispose of product packaging by recycling at a local recycling center for a greener planet. Trademarks All the trademarks or registered trademarks mentioned herein may be the property of their respective holders. This document does not mark any product or brand with the symbol ® or ™. Security Statement We are intensely focused on server product safety and have placed a high priority on this. For a better understanding of our server products, carefully read through the following security risk statements. • When servers are to be repurposed or retired, it is recommended to restore their firmware factory settings, delete information and clear logs from BIOS and BMC to protect data privacy. Meanwhile, we recommend you to wipe the drive data thoroughly and securely with trusted erasing tools. You can use KSManage Server Provisioning. Contact us for specific server models to which KSManage Server Provisioning is applicable. • For server open source software statements, please contact us. • Some interfaces and commands for production, assembly and return-to-depot, and advanced commands for locating faults, if used improperly, may cause equipment abnormality or business interruption. This is not described herein. Please contact us for such information. • External ports of our servers do not use private protocols for communication. • Our products will not initiatively obtain or use your personal data. Only when you consent to use certain functions or services, some personal data such as IP address and email address for alerts may be obtained or used during business operation or fault location. We have implemented necessary measures on product functions to ensure personal data security throughout the data lifecycle, including but not limited to data collection, storage, use, transmission, and destruction. Meanwhile, you are obligated to establish necessary user privacy policies in accordance with applicable national/regional laws and regulations to fully protect user personal data. • Committed to product data security, we have implemented necessary measures on product functions to protect system operation and security data throughout its lifecycle in strict accordance with relevant laws, regulations and supervision requirements. As the owner of system operation and security data, you are obligated to establish necessary data security policies and take adequate measures in accordance with applicable national/regional laws and regulations to fully protect system operation and security data. • We will remain committed to the safety of our products and solutions to achieve better customer satisfaction. We have established emergency response procedures and action plans for security vulnerabilities, so that product safety issues can be dealt with in a timely manner. Please contact us for any safety problems found or necessary support on security vulnerabilities when using our products. Disclaimer The purchased products, services and features shall be bound by the contract made between the customer and us. All or part of the products, services and features described herein may not be within your purchase or usage scope. Unless otherwise agreed in the contract, we make no express or implied statement or warranty on the contents herein. Images provided herein are for reference only and may contain information or features that do not apply to your purchased model. This document is only used as a guide. We shall not be liable for any damage, including but not limited to loss of profits, loss of information, interruption of business, personal injury, or any consequential damage incurred before, during, or after the use of our products. We assume you have sufficient knowledge of servers and are well trained in protecting yourself from personal injury or preventing product damage during operation and maintenance. The information in this document is subject to change without notice. We shall not be liable for technical or editorial errors or omissions contained in this document. *Preface* Abstract This document describes the KR2180V2 AMD-based server's appearance, features, performance parameters, and software and hardware compatibility, providing in-depth information of KR2180V2. Intended Audience This document is intended for pre-sales engineers. Symbol Conventions The symbols that may be found in this document are defined as follows.

Symbol	Description
DANGER	A potential for serious injury, or even death if not properly handled
WARNING	A potential for minor or moderate injury if not properly handled
CAUTION	A potential loss of data or damage to equipment if not properly handled
IMPORTANT	Operations or information that requires special attention to ensure successful installation or configuration
NOTE	Supplementary description of document information

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Revision History

Version	Date	Description of Changes
V1.0	2025/04/28	Initial release

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Table of Contents 1 Product Overview ... 1 2 Features ... 3 2.1 Scalability and Performance ... 3 2.2 Availability and Serviceability ... 4 2.3 Manageability and Security... 5 2.4 Energy Efficiency ... 6 3 System Parts Breakdown... 7 4 System Logical Diagram... 8 5 Hardware Description ... 10 5.1 Front Panel... 10 5.1.1 24 × 2.5-Inch Drive Configuration ... 10 5.1.2 25 × 2.5-Inch Drive Configuration ... 10 5.1.3 12 × 3.5-Inch Drive Configuration ... 11 5.1.4 24 × E3.S Drive Configuration... 11 5.2 Rear Panel... 12 5.2.1 8 × PCIe Card Configuration ... 12 5.2.2 4 × 3.5-Inch Drive + 4 × 2.5-Inch Drive Configuration ... 13 5.2.3 4 × 3.5-Inch Drive + 2 × PCIe Card Configuration ... 13 5.2.4 4 × 2.5-Inch Drive + 6 × PCIe Card Configuration ... 14 5.2.5 2 × PCIe Card + 4 × GPU Configuration ... 15 5.3 LEDs and Buttons ... 15 5.4 Port Description... 18 5.5 Processor ... 18 5.6 Memory ... 19 5.6.1 DDR5 DIMMs ... 19 5.7 Storage 23 5.7.1 Drive Configurations 23 5.7.2 Drive Numbering 25 5.7.3 Drive LEDs 27 5.7.4 RAID Cards 29 5.8 Network 29 5.9 I/O Expansion 29 5.9.1 PCIe Expansion Cards 29 5.9.2 PCIe Slot Locations 30 5.9.3 PCIe Riser Modules 31 5.9.4 PCIe Slot Description 32 5.10 PSUs 34 5.11 Fan Modules 34 5.12 Boards 36 5.12.1 Motherboard 36 5.12.2 Drive Backplanes 38 6 Product Specifications 43 6.1 Technical Specifications 43 6.2 Environmental Specifications 45 6.3 Physical Specifications 46 7 Operating System and Hardware Compatibility 49 7.1 Supported Operating System 49 7.2 Hardware Compatibility 50 7.2.1 CPU Specifications 50 7.2.2 DIMM Specifications 50 7.2.3 Drive Specifications 51 7.2.4 SAS/RAID Card Specifications 52 7.2.5 NIC Specifications ... 52 7.2.6 HBA/HCA Card Specifications ... 53 7.2.7 PSU Specifications ... 53 8 Regulatory Information ... 55 8.1 Safety ... 55 8.1.1 General ... 55 8.1.2 Personal Safety ... 55 8.1.3 Equipment Safety ... 57 8.1.4 Transportation Precautions ... 58 8.1.5 Manual Handling Weight Limits ... 58 9 Limited Warranty ... 59 9.1 Warranty Service ... 59 9.1.1 Remote Technical Support ... 59 9.1.2 RMA Service ... 60 9.1.3 ARMA Service ... 60 9.1.4 9 × 5 × NBD Onsite Service ... 60 9.1.5 24 × 7 × 4 Onsite Service ... 61 9.2 Our Service SLA ... 61 9.3 Warranty Exclusions ... 61 10 System Management ... 63 10.1 Intelligent Management System BMC ... 63 10.2 KSManage ... 66 10.3 KSManage Tools ... 69 11 Certifications ... 70 12 Appendix A ... 71 12.1 Thermal Restrictions ... 71 12.2 Model ... 72 12.3 RAS Features ... 72 12.4 Sensor List ... 73 13 Appendix B Acronyms and Abbreviations ... 79 13.1 A - E ... 79 13.2 F - J ... 81 13.3 K - O ... 82 13.4 P - T ... 83 13.5 U - Z ... 85 1 Product Overview The KR2180V2 AMD-based system is a cost-effective, scalable 2U single-socket rack server powered by the AMD EPYC 9004 series processor. Featuring multiple cores, high base frequency, large cache, and high scalability, it maximizes the performance of the single processor. In a 2U space, it maximizes the storage and expansion capabilities, making it particularly suitable for scenarios such as big data, distributed storage, video transcode, and HPC. Figure 1-1 24 × 2.5-Inch Drive Configuration

figure p10 — XXXX XXX XXXX XXX XXXX XXXX T XXXX XXXX XXXX XXXX XXXX

Figure 1-2 25 × 2.5-Inch Drive Configuration

Figure 1-3 12 × 3.5-Inch Drive Configuration ![figure](images/reducto/p010_figure_0069.jpg) 1 Figure 1-4 24 × E3.S Drive Configuration ![figure](images/reducto/p011_figure_0074.jpg) 2

2.1 Scalability and Performance Table 2-1 Scalability and Performance

Technical Feature	Description
4^th Gen AMD EPYC Processor (Genoa)	• Supports up to 128 cores, a TDP up to 400 W, a max boost frequency up to 4.40 GHz, and an L3 cache up to 384 MB per core, delivering unrivalled processing performance. - Supports 1 processor with up to 128 cores and 256 threads, maximizing the concurrent execution of multi-threaded applications. - Increases the capacity of L2 cache. Each core has its own 1 MB L2 cache. - AMD Turbo Core technology brings you an intelligent self-adaption system. It allows the CPU cores to exceed the processor TDP at peak workload and run at the max boost frequency. - Hyper-threading technology allows every processor core to run multiple threads (up to 2 threads per core) concurrently, improving the performance of multi-threaded applications. - AMD Virtualization (AMD-V) technology integrates hardware-level virtualization features, allowing the operating system to better utilize the hardware for virtualization workloads. - Advanced Vector Extensions 512 (AVX-512), an instruction set, can significantly improve the floating-point performance for compute-intensive applications.
DDR5 ECC DIMMs	Up to 24 DDR5 ECC DIMMs (4,800 MT/s at 1 DPC, RDIMMs), delivering superior speed, high availability, and a memory capacity up to 3,072 GB.
Flexible Drive Configuration	Provides elastic and scalable storage solutions to meet different capacity and update requirements.

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Technical Feature	Description
All-SSD Configuration	Brings higher I/O performance over all-HDD configuration or HDD-SSD mixing configuration.
12 Gbps Serial Attached SCSI (SAS)	Doubles the internal storage data transfer rate of 6 Gbps SAS, maximizing the performance of storage I/O-intensive applications.
Infinity Fabric Technology	IOD and PCIe 5.0 controllers are integrated into processors, significantly shortening I/O latency and enhancing overall system performance.
PCIe Expansion	Supports up to 8 PCIe 5.0 expansion slots.
OCP Expansion	Two OCP 3.0 slots that can flexibly support 1/10/25/40/100/200 Gb hot-plug OCP 3.0 cards.

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2.2 Availability and Serviceability Table 2-2 Availability and Serviceability

Technical Feature	Description
Hot-swap SAS/SATA/NVMe Drive	Supports hot-swap SAS/SATA/NVMe drives and RAID cards with RAID levels 0/1/1E/10/5/50/6/60, RAID cache and data protection enabled by the super-capacitor in case of power failures.
Reliability	• SSDs are much more reliable than traditional HDDs, increasing system uptime. • The BMC monitors system parameters in real time and sends alerts in advance, enabling technicians to take corresponding measures in time to minimize system downtime.
Availability	• The LEDs on front and rear panels and the BMC Web GUI indicate the status of key components and quickly lead technicians to failed (or failing) components, simplifying maintenance and speeding up troubleshooting. • Provides 2 hot-swap PSUs with 1+1 redundancy. • Provides 6 hot-swap fan modules with N+1 redundancy.
Maintenance Efficiency	The BMC management network port on the rear panel supports remote BMC O&M, improving O&M efficiency.

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4 2.3 Manageability and Security Table 2-3 Manageability and Security

Technical Feature	Description
Remote Management	The BMC monitors system operating status and enables remote management.
Network Controller Sideband Interface (NC-SI) Feature	Allows a network port to serve as a management port and a service port. The NC-SI feature is disabled by default and can be enabled/disabled through the BIOS or BMC. Notes: The NC-SI port supports the following features: • The NC-SI port can be bonded to any network port of the OCP 3.0 card or of PCIe NIC that supports NC-SI. • Supports the enablement/disablement and configuration of Virtual Local Area Network ID (VLAN). VLAN is disabled by default. • Supports IPv6 and IPv4 addresses. IP address, subnet mask, default gateway, and prefix length of IPv6 address can be configured.
Unified Extensible Firmware Interface (UEFI)	The industry-standard UEFI improves the efficiency of setup, configuration and update, and simplifies the error handling process.
TPM & TCM	Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) provide advanced encryption.
AMD Secure Processor	AMD Secure Processor (ASP), a microcontroller within the AMD processor that provides enhanced security through hardware-based resistance to malicious software attacks.
AMD SEV	AMD Secure Encrypted Virtualization (SEV) allows applications to run in isolated space, helping prevent malicious theft and modification of critical codes and data.
Firmware Update Mechanism	The firmware update mechanism based on digital signatures prevents unauthorized firmware updates.
UEFI Secure Boot	Protects the system from malicious bootloaders.
Hierarchical Password Protection in BIOS	Ensures system boot and management security.
BIOS Secure Flash and BIOS Lock Enable (BLE)	Reduces attacks from malicious software on the BIOS flash region.

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Technical Feature	Description
Dual-image Mechanism for BMC and BIOS	Recovers firmware upon detection of corrupted firmware.
BMC Secure Boot	Protects BMC from malicious tampering.
BMC Access Control Policies	Flexible BMC access control policies improve BMC management security.
Chassis Intrusion Detection	Enhances physical security.

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2.4 Energy Efficiency Table 2-4 Energy Efficiency

Technical Feature	Description
80 Plus Platinum/Titanium PSUs	Equipped with 80 Plus Platinum/Titanium power supply units (PSUs) (550 W to 2,000 W), with power efficiency up to 94% at a load of 50%.
1+1 Redundant Power Supplies	Supports AC/DC power input for improved power conversion efficiency.
VRD Power Supply	Features the high-efficiency single-board voltage regulator down (VRD) solution, reducing DC-DC conversion loss.
Intelligent Fan Speed PID Control and CPU Frequency Scaling	Supports Proportional-Integral-Derivative (PID) intelligent fan speed control and intelligent CPU frequency scaling, conserving energy.
System Cooling Design	Offers a fully-optimized system cooling design with energy-efficient cooling fans, lowering energy consumption from system cooling.
Power Capping and Power Control	Provides power capping and power control measures.
Staggered Spin-up of Drives	Supports staggered spin-up of drives, reducing power consumption during startup.
Low Energy Consumption	The power consumption of an SSD is 80% lower than that of a traditional HDD.

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6 3 System Parts Breakdown Figure 3-1 Exploded View

Item	Feature	Item	Feature
1	E3.S SSD Module	13	PCIe Riser Module
2	E3.S Drive Backplane	14	PCIe Riser Module (with an FH card)
3	2.5-Inch Drive Module	15	PCIe Riser Module
4	2.5-Inch Drive Backplane	16	DC-SCM Board
5	3.5-Inch Drive Module	17	OCP 3.0 Card
6	3.5-Inch Drive Backplane	18	Super-Capacitor
7	Chassis	19	DIMMs
8	Fan Module	20	Motherboard
9	Fan Cage	21	M.2 SSD Module
10	Top Cover	22	CPU
11	GPU	23	Heatsink
12	PSU	-	-

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7 4 System Logical Diagram Figure 4-1 System Logical Diagram

figure p17 — DDR5 DIMM x24 CH-F CH-E CH-D CH-C CH-B CH-A G1 PCl5.0x16 MCIO x16 PCle5.0 x16 MOO x16 CH-L CH-K CH-I CH-I CH-H CH-G PCle5.0 x8 PCle5.0 x8 Genoa MCIO x8 SATA/PCl5.0 x8 MCIO x8 CPUO SATA/PCl5.0 x8 MCO x8 PS/WAFL ||UARTO дана |SPI TF Card P POE Gen2 x1 Internal USB3.1 BOPORT USB3.1 ESP ESP USB3 CPLD CH USB3.1 NCSI Conn to OCPI USB 3.0 HUB 0 NES Contac USB 3.0 HUB 1 SmartNIC Smart NIC USB3.1 Buffer USB2.0 REAR VGA USB3.1 Front Left Panel USB3.1 USB2.0 05 BART BMC UARY CPLD AST2600 LIARTS WOT DART TO USE RJ45 TF Card croUSB DC-SCM

• The 4^th Gen AMD EPYC processor (Genoa), with a TDP up to 400 W. • Up to 24 DDR5 DIMMs. • Supports 2 PCIe 5.0 M.2 x16 connectors, 11 PCIe 5.0 M.2 x8 connectors, and 2 OCP 3.0 slots (one of which is onboard). • Onboard SATA can be directly connected to CPU PCIe P0/G3; the motherboard supports up to 32 SATA connectors, with a maximum speed of 6 Gbps (SATA 3.0). • The motherboard has the ability to expand add-in high-performance graphics cards; the DC-SCM board integrates a 2D graphics controller with 16 MB of video memory, and the maximum resolution of the display controller on the DC-SCM board is 1,920 × 1,200 32 bpp at 60 Hz. 8 • The PCIe RAID card is connected to CPU0 via the PCIe bus, and is connected to the drive backplane via the SAS signal cable. Multiple local storage configurations are supported through different drive backplanes. 9 5 Hardware Description 5.1 Front Panel 5.1.1 24 × 2.5-Inch Drive Configuration Figure 5-1 Front View ![figure](images/reducto/p019_figure_0131.jpg)

Item	Feature	Item	Feature
1	Power Button and LED	6	Ear Latch
2	2.5-Inch Drive Bay	7	USB Type-C Port
3	VGA Port	8	USB Type-C Port Status LED
4	USB 3.0 Port	9	UID/BMC RST Button and LED
5	USB 2.0/LCD Port	10	LEDs

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5.1.2 25 × 2.5-Inch Drive Configuration Figure 5-2 Front View

figure p19 — 10 XXXX XXXX XXXXII: XXXX: XXXX XXXX XXXXB XXXX XXXX XXXXI 9000 XXXX XXXX XXXXB XXXX XXXXII XXXX XXXX XXXX XXXX XXXXB XXXX XXXX 1 XXXX ( XXXX XXXX

Item	Feature	Item	Feature
1	Power Button and LED	6	Ear Latch
2	2.5-Inch Drive Bay	7	USB Type-C Port
3	VGA Port	8	USB Type-C Port Status LED

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4	USB 3.0 Port	9	UID/BMC RST Button and LED
5	USB 2.0/LCD Port	10	LEDs

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5.1.3 12 × 3.5-Inch Drive Configuration IMPORTANT A 3.5-inch drive tray can accommodate a 2.5-inch drive. Figure 5-3 Front View

Item	Feature	Item	Feature
1	Power Button and LED	6	Ear Latch
2	3.5-Inch Drive Bay	7	USB Type-C Port
3	VGA Port	8	USB Type-C Port Status LED
4	USB 3.0 Port	9	UID/BMC RST Button and LED
5	USB 2.0/LCD Port	10	LEDs

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5.1.4 24 × E3.S Drive Configuration Figure 5-4 Front View ![figure](images/reducto/p020_figure_0149.jpg)

Item	Feature	Item	Feature

1	Power Button and LED	6	Ear Latch
2	E3.S Drive Bay	7	USB Type-C Port
3	VGA Port	8	USB Type-C Port Status LED
4	USB 3.0 Port	9	UID/BMC RST Button and LED
5	USB 2.0/LCD Port	10	LEDs

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5.2 Rear Panel 5.2.1 8 × PCIe Card Configuration Figure 5-5 Rear View

figure p21 — 3 5 6 7 9 2 23 22 21 20 19 15 (14) 13

Item	Feature	Item	Feature
1	PCIe Riser Module 0	13	PSU LED
2	PCIe Slot 2	14	PSU0
3	PCIe Slot 1	15	OCP 3.0 Card 1
4	PCIe Slot 0	16	OCP 3.0 Card 1 Hot-Plug Button and LED
5	PCIe Riser Module 1	17	BMC Management Network Port
6	PCIe Slot 5	18	USB 3.0 Port
7	PCIe Slot 4	19	VGA Port
8	PCIe Slot 3	20	System/BMC Serial Port (Micro USB)
9	PCIe Riser Module 2	21	UID/BMC RST Button and LED
10	PCIe Slot 7	22	OCP 3.0 Card 0
11	PCIe Slot 6	23	OCP 3.0 Card 0 Hot-Plug Button and LED
12	PSU1	-	-

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12 5.2.2 4 × 3.5-Inch Drive + 4 × 2.5-Inch Drive Configuration Figure 5-6 Rear View

Item	Feature	Item	Feature
1	3.5-Inch Drive Bay	8	BMC Management Network Port
2	2.5-Inch Drive Bay	9	USB 3.0 Port
3	PSU1	10	VGA Port
4	PSU LED	11	System/BMC Serial Port (Micro USB)
5	PSU0	12	UID/BMC RST Button and LED
6	OCP 3.0 Card 1	13	OCP 3.0 Card 0
7	OCP 3.0 Card 1 Hot-Plug Button and LED	14	OCP 3.0 Card 0 Hot-Plug Button and LED

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5.2.3 4 × 3.5-Inch Drive + 2 × PCIe Card Configuration Figure 5-7 Rear View

Item	Feature	Item	Feature
1	3.5-Inch Drive Bay	9	OCP 3.0 Card 1 Hot-Plug Button and LED
2	PCIe Riser Module 0	10	BMC Management Network Port

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Item	Feature	Item	Feature
3	PCIe Slot 0	11	USB 3.0 Port
4	PCIe Slot 1	12	VGA Port
5	PSU1	13	System/BMC Serial Port (Micro USB)
6	PSU LED	14	UID/BMC RST Button and LED
7	PSU0	15	OCP 3.0 Card 0
8	OCP 3.0 Card 1	16	OCP 3.0 Card 0 Hot-Plug Button and LED

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5.2.4 4 × 2.5-Inch Drive + 6 × PCIe Card Configuration Figure 5-8 Rear View

figure p23 — 4 8 9 10 21 20 19 18 17 16 15 14 13 12 11

Item	Feature	Item	Feature
1	PCIe Riser Module 0	12	PSU0
2	PCIe Slot 2	13	OCP 3.0 Card 1
3	PCIe Slot 1	14	OCP 3.0 Card 1 Hot-Plug Button and LED
4	PCIe Slot 0	15	BMC Management Network Port
5	PCIe Riser Module 1	16	USB 3.0 Port
6	PCIe Slot 5	17	VGA Port
7	PCIe Slot 4	18	System/BMC Serial Port (Micro USB)
8	PCIe Slot 3	19	UID/BMC RST Button and LED
9	2.5-Inch Drive Bay	20	OCP 3.0 Card 0
10	PSU1	21	OCP 3.0 Card 0 Hot-Plug Button and LED
11	PSU LED	-	-

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14 5.2.5 2 × PCIe Card + 4 × GPU Configuration Figure 5-9 Rear View

figure p24 — PC3➤ 15 14 13 12 11 10 987 6 5 4 3

Item	Feature	Item	Feature
1	GPU	9	USB 3.0 Port
2	PSU1	10	VGA Port
3	PSU LED	11	System/BMC Serial Port (Micro USB)
4	PSU0	12	UID/BMC RST Button and LED
5	PCIe Slot 3	13	OCP 3.0 Card 0
6	OCP 3.0 Card 1	14	OCP 3.0 Card 0 Hot-Plug Button and LED
7	OCP 3.0 Card 1 Hot-Plug Button and LED	15	PCIe Slot 0
8	BMC Management Network Port	-	-

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5.3 LEDs and Buttons Table 5-1 LED and Button Description

Icon	Feature	Description
[power symbol]	Power Button and LED	• Power LED: - Off = No power - Solid green = Power-on state - Solid orange = Standby state • Power button: - Press and release the button to power on the system from the standby state

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Icon	Feature	Description
		- Press and hold the button for 6 seconds to force a shutdown from the power-on state
[icon]	System Status LED	• Off = Normal • Blinking red (1 Hz) = A warning error is detected on CPU, memory, power supply, drive, fan, etc. • Solid red = A critical error is detected on CPU, memory, power supply, drive, fan, etc.
[icon]	Memory Status LED	• Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs
[icon]	Fan Status LED	• Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs, including fan failure and fan absence
[icon]	Power Status LED	• Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs
[icon]	System Overheat LED	• Off = Normal • Blinking red (1 Hz) = A warning error occurs, including Proc Hot, resulting in CPU throttling • Solid red = A critical error occurs, including CPU Thermal Trip/PCH Hot/MEM hot, etc.
[icon]	Network Status LED	• Off = No network connection • Blinking green = Network connected with data being transmitted • Solid green = Network connected without data being transmitted Note: It only indicates the status of the self-developed OCP card.

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Icon	Feature	Description
[Icon: UID]	UID/BMC RST Button and LED	• Solid blue = The UID LED is activated by the UID button or via the BMC • Press and hold the button for 6 seconds to force the BMC to reset
-	USB Type-C Port Status LED	• Connects to a terminal (PC or phone): - Off = Port not connected to a terminal (PC or phone) - Blinking green (2 Hz) for 3 seconds and then off = Port function has been disabled - Solid green = Port connected to a terminal (PC or phone) • Connects to a USB storage device: - Off = Port not connected to a USB storage device - Blinking red (1 Hz) = Job has failed or has been completed with an error reported - Blinking green (2 Hz) = Job in progress - Blinking green (2 Hz) 5 times and then off = Port function has been disabled - Solid green = Job has been completed
-	OCP 3.0 Card Hot-Plug Button and LED	• OCP 3.0 card hot-plug LED: - Off = OCP card is powered off - Blinking green = OCP card is getting ready for hot-plugging or OCP card is being identified after being inserted - Solid green = OCP card is powered on • OCP 3.0 card hot-plug button:

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Icon	Feature	Description
		- With the LED solid on, press and release the button to power off the OCP card. - With the LED off and the OCP 3.0 card installed, press and release the button to power on the OCP card.

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5.4 Port Description Table 5-2 Port Description

Feature	Description
VGA Port	Enables you to connect a display terminal
USB 3.0 Port	Enables you to connect a USB 3.0/2.0 device
USB 2.0/LCD Port	Enables you to connect a USB 2.0 device or LCD device to the system
BMC/System Serial Port	• Enables you to debug and monitor the BMC • Enables you to debug and monitor the system
BMC Management Network Port	Enables you to manage the server Note: It is a Gigabit Ethernet port that supports 100/1,000 Mbps auto-negotiation.
OCP 3.0 Network Port	Enables you to connect the system to the network

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5.5 Processor • The server supports 1 processor. For specific processor options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 18 Figure 5-10 Processor Location

5.6 Memory 5.6.1 DDR5 DIMMs 1. Identification To determine DIMM characteristics, refer to the label attached to the DIMM and the following figure and table. Figure 5-11 DIMM Identification

Item	Description	Example
		• 256 GB
2	Rank(s)	• 1R = Single rank • 2R = Dual rank • 2S2R = Two ranks of two high stacked 3DS DRAM • 2S4R = Four ranks of two high stacked 3DS DRAM • 4R = Quad rank
3	Data width of DRAM	• x4 = 4 bits • x8 = 8 bits
4	DIMM slot type	PC5 = DDR5
5	Maximum memory speed	• 4,800 MT/s • 5,600 MT/s
6	CAS latency	• SDP 4800B = 40-39-39 • 3DS 4800B = 46-39-39 • SDP 5600B = 46-45-45 • 3DS 5600B = 52-45-45
7	DIMM type	R = RDIMM

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2. Memory Subsystem Architecture The server supports 24 DIMM slots. Within a channel, populate the DIMM slot with its silk screen ending with D1 first. For instance, within CPU0 Channel A, populate CPU0_CAD1 first. To install DIMMs, refer to the recommended DIMM population rules. Table 5-3 DIMM Slot List

CPU	Channel ID	Silk Screen
CPU0	Channel A	CPU0_CAD0
	Channel A	CPU0_CAD1
	Channel B	CPU0_CBD0
	Channel B	CPU0_CBD1
	Channel C	CPU0_CCD0
	Channel C	CPU0_CCD1
	Channel D	CPU0_CDD0
	Channel D	CPU0_CDD1
Channel E	CPU0_CED0

📷 view source screenshot for verification (page 29)

CPU	Channel ID	Silk Screen
		CPU0_CED1
	Channel F	CPU0_CFDO
	Channel F	CPU0_CFD1
	Channel G	CPU0_CGD0
	Channel G	CPU0_CGD1
	Channel H	CPU0_CHD0
	Channel H	CPU0_CHD1
	Channel I	CPU0_CID0
	Channel I	CPU0_CID1
	Channel J	CPU0_CJD0
	Channel J	CPU0_CJD1
	Channel K	CPU0_CKD0
	Channel K	CPU0_CKD1
	Channel L	CPU0_CLD0
	Channel L	CPU0_CLD1

📷 view source screenshot for verification (page 30)

3. Compatibility Refer to the following rules to select the DDR5 DIMMs. IMPORTANT • A server must use DDR5 DIMMs bearing the same part number (P/N code). All DDR5 DIMMs operate at the same speed, which is the lowest of: - Memory speed supported by a specific CPU. - Maximum operating speed of a specific memory configuration. • Mixing DDR5 DIMM specifications (capacity, bit width, rank, height, etc.) is not supported. • For specific memory options, consult your local sales representative or refer to 7.2 Hardware Compatibility. • DDR5 DIMMs can be used with AMD EPYC processors (Genoa). The maximum memory capacity supported is identical for different CPU models. • The total memory capacity is the sum of the capacities of all DDR5 DIMMs. 21

Maximum number of DIMMs supported per channel ≤ Maximum number of ranks supported per channel ÷ Number of ranks per DIMM. Table 5-4 DDR5 DIMM Specifications

Item		Value
Capacity per DDR5 DIMM (GB)		16	32	64	128
Type		RDIMM	RDIMM	RDIMM	RDIMM
Rated speed (MT/s)		4,800	4,800	4,800	4,800
Operating voltage (V)		1.1	1.1	1.1	1.1
Maximum number of DDR5 DIMMs supported in a server¹		24	24	24	24
Maximum capacity of DDR5 DIMMs supported in a server (GB)²		384	768	1,536	3,072
Actual speed (MT/s)	1DPC³	4,800	4,800	4,800	4,800
Actual speed (MT/s)	2DPC	3,600	3,600	3,600	3,600

📷 view source screenshot for verification (page 31)

Notes: 1. The maximum number of DDR5 DIMMs supported is based on 2DPC. The number is halved for 1 DPC. 2. It indicates the maximum memory capacity supported when all the DIMM slots are populated with DDR5 DIMMs. 3. DIMM Per Channel (DPC) is the number of DIMMs per memory channel. The above information is for reference only. Consult your local sales representative for details. 4. DIMM Population Rules General population rules for DDR5 DIMMs: • Install DIMMs only when the corresponding processor has been installed. • Install dummies in the empty DIMM slots. Population rules for DDR5 DIMMs in specific modes: ● Memory patrol scrubbing mode - Follow the general population rules. 22 5. DIMM Slot Layout Up to 24 DDR5 DIMMs can be installed in a server, and a balanced DIMM configuration is recommended for optimal memory performance. DIMM configuration must be compliant with the DIMM population rules. Figure 5-12 DIMM Slot Layout

figure p32 — CPUO CFD1 CPUO_CFDO CPUO_CED1 CPUO_CEDO CPUO CDD1 CPUO_CD DO CPUO_CCD1 CPUO_CCDO CPUO_CBD1 CPUO_CBDO ຕ ໍ່ມາ CPUO_CAD1 CPUO_CADO 0 CPUO 0 CPUO_CGDO CPUO_CGD1 CPUO_CHDO PUO_CHD1 PUO_CIDO PUO_CID1 PUO_CJDO PUO_CKDO PUO_CKD1 PUO_CLDO CPUO_CLD1

Table 5-5 DDR5 DIMM Population Rules (Single-CPU Configuration)

CPU0
DDR	CAD0	CAD1	CBD0	CBD1	CCD0	CCD1	CCD0	CCD1	CCD0	CCD1	CFD0	CFD1	CGD0	CGD1	CHD0	CHD1	CID0	CID1	CJD0	CJD1	CKD0	CKD1	CLD0	CLD1
1		●
2		●				●								●				●
4		●		●		●								●
6		●		●		●								●		●		●
8		●		●		●				●				●		●						●
10		●		●		●		●		●				●		●		●		●
12		●		●		●		●		●		●		●		●		●		●			●
16	●	●	●	●	●	●		●		●		●		●	●	●		●		●		●
20	●	●	●	●	●	●		●		●		●		●	●	●		●		●		●
24	●	●	●	●	●	●		●		●		●		●	●	●		●		●		●

📷 view source screenshot for verification (page 32)

5.7 Storage 5.7.1 Drive Configurations NOTE For the physical drive No. of each configuration, refer to 5.7.2 Drive Numbering. 23 Table 5-6 Drive Configurations

Configuration	Front Drives	Rear Drives	Internal Drives	Drive Management Mode
24 × 2.5-Inch Drive Config.	24 × 2.5-inch drive: Drive bays with physical drive No. 0 to 23 support SAS/SATA/NVMe drives	4 × 2.5-inch SAS/SATA/NVMe drive	M.2 SSD: Configured through the internal M.2 adapter that supports two SATA/PCIe M.2 SSDs	• SAS/SATA drive: SAS/RAID card • NVMe drive or internal M.2 SSD: directly connected to the CPU
25 × 2.5-Inch Drive Config.	25 × 2.5-inch drive: Drive bays with physical drive No. 0 to 20 support SAS/SATA drives only and those with physical drive No. 21 to 24 support SAS/SATA/NVMe drives only	4 × 2.5-inch SAS/SATA drive	M.2 SSD: Configured through the internal M.2 adapter that supports two SATA/PCIe M.2 SSDs	• SAS/SATA drive: SAS/RAID card • NVMe drive or internal M.2 SSD: directly connected to the CPU
12 × 3.5-Inch Drive Config. (A 3.5-inch drive tray can accommodate a 2.5-inch drive.)	12 × 3.5-inch drive: Drive bays with physical drive No. 0 to 11 support SAS/SATA drives only (12 × 2.5-inch drive: Drive bays with physical drive No. 0 to 11 support SAS/SATA/NVMe drives)	4 × 3.5-inch SAS/SATA drive or 4 × 2.5-inch SAS/SATA/NVMe drive	M.2 SSD: Configured through the internal M.2 adapter that supports two SATA/PCIe M.2 SSDs	• SAS/SATA drive: SAS/RAID card or directly connected to the CPU • Internal M.2 SSD: directly connected to the CPU

📷 view source screenshot for verification (page 33)

Configuration	Front Drives	Rear Drives	Internal Drives	Drive Management Mode
24 × E3.S Drive Config.	24 × E3.S SSD: Drive bays with physical drive No. 0 to 23 support E3.S SSDs only	4 × 2.5-inch SAS/SATA drive	M.2 SSD: Configured through the internal M.2 adapter that supports two SATA/PCIe M.2 SSDs	• E3.S SSD: directly connected to the CPU • Internal M.2 SSD: directly connected to the CPU

📷 view source screenshot for verification (page 34)

5.7.2 Drive Numbering 1. 24 × 2.5-Inch SAS/SATA/NVMe Drive Configuration Figure 5-13 Drive Numbering

Configuration	Physical Drive No.	Drive No. Identified by the BMC	Front/Rear	Drive No. Identified by the 8i RAID Card
24 × SAS/SATA	0 to 7	0 to 7	Front	0 to 7
	8 to 15	8 to 15	Front	8 to 15
	16 to 23	16 to 23	Front	16 to 23
24 × NVMe	0 to 23	0 to 23	Front	-

📷 view source screenshot for verification (page 34)

2. 25 × 2.5-Inch SAS/SATA/NVMe Drive Configuration Figure 5-14 Drive Numbering

Configuration	Physical Drive No.	Drive No. Identified by the BMC	Front/Rear	Drive No. Identified by the 8i RAID Card
25 × SAS/SATA	0 to 7	0 to 7	Front	0 to 7
	8 to 15	8 to 15	Front	8 to 15
	16 to 23	16 to 23	Front	16 to 23
	24	24	Front	24
25 × NVMe	0 to 24	0 to 24	Front	-

📷 view source screenshot for verification (page 35)

3. 12 × 3.5-Inch SAS/SATA/NVMe Drive Configuration Figure 5-15 Drive Numbering

Configuration	Physical Drive No.	Drive No. Identified by the BMC	Front/Rear	Drive No. Identified by the 8i RAID Card
12 × SAS/SATA	0 to 7	0 to 7	Front	0 to 7
12 × SAS/SATA	8 to 11	8 to 11	Front	8 to 11
12 × NVMe	0 to 11	0 to 11	Front	-

📷 view source screenshot for verification (page 35)

4. 24 × E3.S Drive Configuration Figure 5-16 Drive Numbering

Configuration	Physical Drive No.	Drive No. Identified by the BMC	Front/Rear	Drive No. Identified by the RAID Card
24 × E3.S	0 to 23	0 to 23	Front	-

📷 view source screenshot for verification (page 35)

26 5.7.3 Drive LEDs 1. SAS/SATA Drive LEDs Figure 5-17 SAS/SATA Drive LEDs ![figure](images/reducto/p036_figure_0307.jpg)

Activity LED (①)	Locator/Error LED (②)			Description
Green	Blue	Red
Off	Off	RAID created	RAID not created	Drive absent
Off	Off	Solid on	Off	Drive absent
Solid on	Off	Off		Drive present but not in use
Blinking	Off	Off		Drive present and in use
Blinking	Solid pink			Copyback/Rebuild in progress
Solid on	Solid on	Off		Drive selected but not in use
Blinking	Solid on	Off		Drive selected and in use
Off	Solid on	Off		Drive is selected but fails
Any status	Off	Solid on		Drive fails

📷 view source screenshot for verification (page 36)

2. NVMe Drive LEDs Figure 5-18 NVMe Drive LEDs ![figure](images/reducto/p036_figure_0311.jpg) The NVMe drive LED can be lit up. 27 Table 5-7 NVMe Drive LED Description

Activity LED (①)	Locator/Error LED (②)		Description
Green	Blue	Red	Description
Off	Off	Off	Drive absent
Solid on	Off	Off	Drive present but not in use
Blinking	Off	Off	Drive present and in use
Blinking	Solid pink		Copyback/Rebuild/Initializing/Verifying in progress
Solid on	Solid on	Off	Drive selected but not in use
Blinking	Solid on	Off	Drive selected and in use
Off	Solid on	Off	Drive is selected but fails
Any status	Off	Solid on	Drive fails

📷 view source screenshot for verification (page 37)

3. E3.S SSD LEDs Figure 5-19 E3.S SSD LEDs ![figure](images/reducto/p037_figure_0320.jpg)

Activity LED (①)	Locator/Error LED (②)		Description
Green	Blue	Red	Description
Off	Off	Off	Drive absent
Solid on	Off	Off	Drive present but not in use
Blinking	Off	Off	Drive present and in use
Blinking	Solid pink		Copyback/Rebuild/Initializing/Verifying in progress
Solid on	Solid on	Off	Drive selected but not in use
Blinking	Solid on	Off	Drive selected and in use

📷 view source screenshot for verification (page 37)

Activity LED (①)	Locator/Error LED (②)		Description
Green	Blue	Red	Description
Off	Solid on	Off	Drive is selected but fails
-	Off	Solid on	Drive fails

📷 view source screenshot for verification (page 38)

5.7.4 RAID Cards The RAID card provides functions such as RAID configuration, RAID level migration, and drive roaming. For specific RAID card options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 5.8 Network NICs provide network expansion capabilities. • The OCP slots support OCP 3.0 cards. Users can select the OCP 3.0 cards as needed. • The PCIe expansion slots support PCIe NICs. Users can select the PCIe NICs as needed. • For specific NIC options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 5.9 I/O Expansion 5.9.1 PCIe Expansion Cards The PCIe expansion cards provide system expansion capabilities. • The server supports up to 8 PCIe 5.0 expansion slots and 2 dedicated slots for OCP 3.0 cards. • For specific PCIe expansion card options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 29 5.9.2 PCIe Slot Locations Figure 5-20 PCIe Slot Locations - 8 × PCIe Slot Configuration

figure p39 — PCle Riser Module 0 PCle Riser Module 1 PCle Riser Module 2 Slot 2 Slot 5 Slot 7 Slot 1 Slot 4 Slot 6 Slot 0 Slot 3

• Slot 0, slot 1 and slot 2 reside in PCIe riser module 0. • Slot 3, slot 4 and slot 5 reside in PCIe riser module 1. • Slot 6 and slot 7 reside in PCIe riser module 2. Figure 5-21 PCIe Slot Locations - 2 × PCIe Slot + 4 × 3.5-Inch Drive Configuration

• Slot 6 and slot 7 reside in PCIe riser module 2. Figure 5-22 PCIe Slot Locations - 6 × PCIe Slot + 4 × 2.5-Inch Drive Configuration

• Slot 0, slot 1 and slot 2 reside in PCIe riser module 0. • Slot 3, slot 4 and slot 5 reside in PCIe riser module 1. 30 Figure 5-23 PCIe Slot Locations - 2 × PCIe Slot + 4 × GPU Configuration

figure p40 — Slot 0 Slot 3 PCle Riser Module 3 PCle Riser Module 4

• 4 dual-slot GPUs are installed in the upper 1U space. • Slot 0 resides in PCIe riser module 3 in the lower-left 1U space. It can be populated with an FHHL PCIe expansion card. • Slot 3 resides in PCIe riser module 4 in the lower-left 1U space. It can be populated with an FHHL PCIe expansion card. 5.9.3 PCIe Riser Modules Figure 5-24 PCIe Riser Module 0/1 (Three PCIe x16 Slots)

31 Figure 5-25 PCIe Riser Module 2 (Two PCIe x16 Slots)

Figure 5-26 PCIe Riser Module 3/4 (One PCIe x16 Slot)

5.9.4 PCIe Slot Description Models with the rear PCIe riser module. 32 Table 5-8 PCIe Slot Description - Standard 8-Slot Configuration

PCIe Slot	Owner	PCIe Standard	Connector Width	Bus Width	Port No.	Form Factor
Slot 0	CPU0	PCIe 4.0/5.0	x16	x8	P3AB	FHHL
Slot 1	CPU0	PCIe 4.0/5.0	x16	x8	P3CD	Full-height 3/4-length
Slot 2	CPU0	PCIe 4.0/5.0	x16	x16	G3	Full-height 3/4-length
Slot 3	CPU0	PCIe 4.0/5.0	x16	x8	P2AB	FHHL
Slot 4	CPU0	PCIe 4.0/5.0	x16	x8	P2CD	Full-height 3/4-length
Slot 5	CPU0	PCIe 4.0/5.0	x16	x16	G0	Full-height 3/4-length
Slot 6	CPU0	PCIe 4.0/5.0	x16	x16	P0	Full-height 3/4-length
Slot 7	CPU0	PCIe 4.0/5.0	x16	x16	G1	Full-height 3/4-length
OCP 3.0 Slot	CPU0	PCIe 4.0/5.0	x16	x16	G2	SFF OCP 3.0
OCP 3.0 Slot	CPU0	PCIe 4.0/5.0	x16	x8/x16	P1AB/P1ABCD	SFF OCP 3.0

📷 view source screenshot for verification (page 42)

Table 5-9 PCIe Slot Description - GPU Configuration

PCIe Slot	Owner	PCIe Standard	Connector Width	Bus Width	Port No.	Form Factor
Slot 0	CPU0	PCIe 4.0/5.0	x16	x8	P3	FHHL

📷 view source screenshot for verification (page 42)

PCIe Slot	Owner	PCIe Standard	Connector Width	Bus Width	Port No.	Form Factor
Slot 3	CPU0	PCIe 4.0/5.0	x16	x8	P2	FHHL
OCP 3.0 Slot	CPU0	PCIe 4.0/5.0	x16	x8/x16	P1AB/P1ABCD	SFF OCP 3.0

📷 view source screenshot for verification (page 43)

5.10 PSUs • The server supports 1 or 2 PSUs. • The server supports AC or DC power input. • The PSUs are hot-swappable. • When 2 PSUs are configured, the PSUs are 1+1 redundant. • The server must use PSUs bearing the same part number (P/N code). • The PSUs feature short-circuit protection. Figure 5-27 PSU Locations

5.11 Fan Modules • The server supports 6 fan modules. Users can select 6038 or 6056 fans based on the configuration. • The fan modules are hot-swappable. • The server supports fans in N+1 redundancy, which means that the server can continue working properly when a single fan fails. • The server supports intelligent fan speed control. • The server must use fan modules bearing the same part number (P/N code). 34 Figure 5-28 Fan Module Locations

35 5.12 Boards 5.12.1 Motherboard Figure 5-29 Motherboard Layout

figure p45 — 57 17 16 FANS 50 FAN4 49 18 48 FAN3 46 09 [ඉ@ 19 44 43 FAN2 20 FANT 21 -FANO 35 33 31 29 24 22 23

Item	Feature	Item	Feature
1	Riser Power Connector	26	Drive BP I²C Connector
2	OCP 3.0 Card 0 Hot-Plug Button and LED Connector	27	GPU Riser Power Connector
3	MCIO x16 Connector	28	Drive Riser I²C Connector
4	Smart NIC Power Connector	29	GPU Riser Power Connector
5	NMI Connector	30	GPU Riser Power Connector
6	Button Cell Battery Socket	31	GPU Power Connector

📷 view source screenshot for verification (page 45)

Item	Feature	Item	Feature
7	Smart NIC UART Connector	32	Riser I²C Connector
8	M.2 Riser Sideband Connector	33	Leak Detection Connector
9	CMOS Jumper	34	Mid-Drive Power Connector
10	VPP Connector	35	Drive BP I²C Connector
11	USB 3.0 Port	36	Capacitor Board Power Connector
12	Drive BP I²C Connector	37	PSU1 Connector
13	Right Control Panel Connector	38	GPU Power Connector
14	OCP 3.0 Card 0 Power Connector	39	GPU Power Connector
15	Drive BP I²C Connector 4	40	PSU0 Connector
16	MCIO x8 Connector	41	GPU Power Connector
17	Inlet Temperature Sensor Connector	42	MCIO x8 Connector
18	Intrusion Detection Connector	43	Riser Power Connector
19	Intrusion Detection Connector	44	OCP 3.0 Card 1 Expansion Connector
20	MCIO x8 Connector	45	OCP 3.0 Card 1 Connector
21	Left Control Panel Connector	46	IPMB Connector
22	Front Drive BP Power Connector	47	OCP 3.0 Card 1 Hot-Plug Button and LED Connector
23	Drive BP SGPIO Connector	48	NC-SI Connector
24	Front Drive BP Power Connector	49	OCP 3.0 Card 0 NC-SI Connector
25	Drive BP I²C Connector 0	50	DC-SCM Connector

📷 view source screenshot for verification (page 46)

37 5.12.2 Drive Backplanes 1. Front Drive Backplanes • 24 × 2.5-Inch SAS/SATA/NVMe Drive Configuration Figure 5-30 8 × 2.5-Inch SAS/SATA/NVMe Drive Backplane

Item	Feature	Item	Feature
1	CPLD JTAG Connector	4	Drive BP Power Connector
2	MCIO x8 Connector	5	Slimline x4 Connector
3	VPP Connector	6	BMC_I²C Connector

📷 view source screenshot for verification (page 47)

● 25 × 2.5-Inch SAS/SATA/NVMe Drive Configuration Figure 5-31 25 × 2.5-Inch SAS/SATA/NVMe Drive Backplane

Item	Feature	Item	Feature
1	Slimline x8 Connector	6	Slimline x4 Connector
2	CPLD JTAG Connector	7	Expander Chip Debug Connector 1

📷 view source screenshot for verification (page 47)

Item	Feature	Item	Feature
3	VPP Connector	8	Expander Chip Debug Connector 2
4	Drive BP Power Connector	9	Expander Chip Debug Connector 3
5	BMC_I²C Connector	-	-

📷 view source screenshot for verification (page 48)

• 12 x 3.5-Inch SAS/SATA/NVMe Drive Configuration Figure 5-32 4 × 3.5-Inch SAS/SATA/NVMe Drive Backplane

Item	Feature	Item	Feature
1	VPP Connector	5	Slimline x4 Connector
2	Slimline x4 Connector	6	Slimline x8 Connector
3	Slimline x8 Connector	7	BMC I²C Connector
4	Power Connector	8	CPLD JTAG Connector

📷 view source screenshot for verification (page 48)

Figure 5-33 4 × 3.5-Inch SAS/SATA Drive Backplane

Item	Feature	Item	Feature
1	Drive BP Power Connector	3	BMC I²C Connector
2	SGPIO Connector	4	SATA 7-Pin Connector

📷 view source screenshot for verification (page 48)

39 Figure 5-34 12 × 3.5-Inch SAS/SATA Drive Backplane

Item	Feature	Item	Feature
1	Slimline x4 Connector	3	Drive BP Power Connector
2	I²C_BMC Connector	-	-

📷 view source screenshot for verification (page 49)

● 24 × E3.S Drive Configuration Figure 5-35 8 × E3.S Drive Backplane ![figure](images/reducto/p049_figure_0450.jpg)

Item	Feature	Item	Feature
1	VPP Connector	3	Drive BP Power Connector
2	I²C_BMC Connector	4	MCIO x8 Connector

📷 view source screenshot for verification (page 49)

2. Rear Drive Backplanes ● 4 x 3.5-Inch SAS/SATA + 4 x 2.5-Inch SAS/SATA/NVMe Drive Configuration 40 Figure 5-36 2 x 3.5-Inch SAS/SATA Drive Backplane ![figure](images/reducto/p050_figure_0458.jpg)

Item	Feature	Item	Feature
1	Slimline x4 Connector	3	Drive BP Power Connector
2	I²C_BMC Connector	-	-

📷 view source screenshot for verification (page 50)

Figure 5-37 2 × 2.5-Inch SAS/SATA Drive Backplane

Item	Feature	Item	Feature
1	CPLD JTAG Connector	3	Slimline x4 Connector
2	BMC_I²C Connector	4	Drive BP Power Connector

📷 view source screenshot for verification (page 50)

41 Figure 5-38 2 × 2.5-Inch NVMe Drive Backplane ![figure](images/reducto/p051_figure_0467.jpg)

Item	Feature	Item	Feature
1	BMC_I²C Connector	4	MCIO x8 Connector
2	SGPIO Connector	5	Drive BP Power Connector
3	CPLD JTAG Connector	-	-

📷 view source screenshot for verification (page 51)

42 6 Product Specifications 6.1 Technical Specifications Table 6-1 Technical Specifications

Item	Description
Form Factor	2U rack server
Processor	Supports one 4^th Gen AMD EPYC processor (Genoa) • Integrated memory controllers and 12 memory channels per processor • Integrated PCIe 5.0 controllers and 128 PCIe lanes per processor • Up to 128 cores • Max boost frequency of 4.40 GHz • L3 cache up to 384 MB • TDP up to 400 W Note: The information above is for reference only. See 7.2 Hardware Compatibility for details.
Memory	Supports up to 24 DDR5 DIMMs. • RDIMMs supported • Up to 4,800 MT/s at 1 DPC and 3,600 MT/s at 2 DPC • Mixing DDR5 DIMM types or mixing DDR5 DIMM specifications (capacity, bit width, rank, height, etc.) is not supported. • A server must use DDR5 DIMMs bearing the same part number (P/N code). Note: The information above is for reference only. See 7.2 Hardware Compatibility for details.
Storage	Supports multiple drive configurations. For detailed information, refer to 5.7.1 Drive Configurations. • Front: - Up to 24 × 2.5-inch hot-swap SAS/SATA/NVMe drive or - Up to 21 × 2.5-inch hot-swap SAS/SATA drive + 4 × 2.5-inch hot-swap SAS/SATA/NVMe drive or - Up to 12 × 3.5-inch hot-swap SAS/SATA/NVMe drive or - Up to 24 × hot-swap E3.S SSD

📷 view source screenshot for verification (page 52)

Item	Description
	• Rear: - Up to 4 × 2.5-inch hot-swap SAS/SATA/NVMe drive + 4 × 3.5-inch hot-swap SAS/SATA drive • Internal: - 2 × SATA/PCIe M.2 SSD
Network	• Up to two 1/10/25/40/100/200 Gb hot-plug OCP 3.0 cards • Standard 1/10/25/40/100/200 Gb PCIe NICs • 1 BMC management network port of 100/1,000 Mbps auto-negotiation
I/O Expansion	• Up to 8 PCIe expansion cards • 4 dual-slot GPUs or 8 single-slot GPUs/graphics cards • 2 OCP 3.0 cards For details, see 5.9.2 PCIe Slot Locations and 5.9.4 PCIe Slot Description.
Port	Supports multiple ports. • Front: - 1 × USB 3.0 port - 1 × USB 2.0/LCD Port - 1 × VGA port - 1 × USB type-C port • Rear: - 2 × USB 3.0 port - 1 × VGA port - 1 × BMC management network port - 1 × system/BMC serial port (micro USB) Note: OS installation on the USB storage media is not recommended.
Display	Integrated VGA on the DC-SCM board with a video memory of 64 MB and a maximum 16M color resolution of 1,920 × 1,200 at 60 Hz Notes: • The integrated VGA can support a maximum resolution of 1,920 × 1,200 only when the video driver matching the OS version is installed; otherwise, only the default resolution of the OS is supported. • When both the front and rear VGA ports are connected to monitors, only the monitor connected to the front VGA port works.
System Management	• UEFI • BMC • NC-SI

📷 view source screenshot for verification (page 53)

Item	Description
	• KSManage
Security	• Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) • ASP • AMD SEV • Firmware update mechanism based on digital signatures • UEFI Secure Boot • Hierarchical BIOS password protection • BIOS Secure Flash and BIOS Lock Enable (BLE) • BMC and BIOS dual-image mechanism • Chassis intrusion detection

📷 view source screenshot for verification (page 54)

6.2 Environmental Specifications Table 6-2 Environmental Specifications

Parameter	Description
Temperature^1,2	• Operating: 10°C to 35°C (50°F to 95°F) (For some configurations, the operating temperature is 5°C to 45°C (41°F to 113°F)) • Storage (packed): -40°C to +70°C (-40°F to +158°F) • Storage (unpacked): -40°C to +70°C (-40°F to +158°F)
Relative Humidity (RH, non-condensing)	• Operating: 5% to 90% RH • Storage (packed): 5% to 95% RH • Storage (unpacked): 5% to 95% RH
Altitude	Operating: 0 to 3,050 m (0 to 10,007 ft) Shipping (storage): 0 to 12,000 m (0 to 39,370 ft)
Corrosive Gaseous Contaminants	Maximum growth rate of corrosion film thickness: • Copper coupon: 300 Å/month (compliant with the gaseous corrosivity level of G1 defined in ANSI/ISA-71.04-2013) • Silver coupon: 200 Å/month (compliant with the gaseous corrosivity level of G1 defined in ANSI/ISA-71.04-2013)
Acoustic Noise^3,4,5,6	Noise emissions are measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Listed are the declared A-weighted

📷 view source screenshot for verification (page 54)

Parameter	Description
	sound power levels (LWAd) and the declared average bystander position A-weighted sound pressure levels (LpAm) at a server operating temperature of 23°C (73°F): • Idle: LWAd: 6.7 Bels for standard configuration LpAm: 49.9 dBA for standard configuration • Operating: LWAd: 7.2 Bels for standard configuration LpAm: 56.6 dBA for standard configuration

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Notes: 1. The GPU configuration supports an operating temperature range of 10°C to 30°C (50°F to 86°F) and some configurations with high CPU TDP support an operating temperature range of 10°C to 35°C (50°F to 95°F). 2. Standard operating temperature - 10°C to 35°C (50°F to 95°F) is the standard operating temperature range at sea level. From sea level to an altitude of 3,050 m (10,007 ft), derate the maximum allowable operating temperature by 1°C per 305 m (1°F per 556 ft). No direct sustained sunlight is permitted. The maximum temperature gradient is 20°C/h (36°F/h) and the maximum operating altitude is 3,050 m (10,007 ft), both varying with server configuration. - Any fan failure or operations above 30°C (86°F) may lead to system performance degradation. 3. This document lists the LWAd and LpAm of the product at a 23°C (73.4°F) ambient environment. All measurements are conducted in conformance with ISO 7779 (ECMA 74) and declared in conformance with ISO 9296 (ECMA 109). The listed sound levels apply to the standard configuration. Additional options may result in increased sound levels. Contact your sales representative for more information. 4. The sound levels shown here were measured based on specific configurations of a server. Sound levels vary by server configuration. These values are for reference only and subject to change without notice. 5. Product conformance to cited normative standards is based on sample testing, evaluation, or assessment. This product or family of products is eligible to bear the appropriate compliance logos and statements. 6. The listed sound levels apply to the standard configuration. Additional options may result in increased noise. 6.3 Physical Specifications Table 6-3 Physical Specifications

Item	Description
Outer Packaging Dimensions (L × W × H)	1,090 × 600 × 295 mm (42.91 × 23.62 × 11.61 in.)
Installation Dimension Requirements	• Installation requirements for the cabinet are as follows:

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Item

Description

- General cabinet compliant with the International Electrotechnical Commission 297 (IEC 297) standard - Width: 482.6 mm (19 in.) - Depth: Above 1,000 mm (39.37 in.) • Installation requirements for the server rails are as follows: - L-bracket rails: applicable to our cabinets only - Static rail kit: Distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.) - Ball-bearing rail kit: Distance between the front and rear mounting flanges ranges from 609 to 914 mm (23.98 to 35.98 in.) - When selecting a slide rail CMA, the cabinet depth should be ≥1,200 mm (47.24 in.)

Weight

• 25 × 2.5-inch drive configuration - Net weight: 25.5 kg (56.22 lbs) - Gross weight: 35 kg (77.16 lbs) (including server, packaging box, rails and accessory box) • 24 × 2.5-inch drive configuration - Net weight: 25.2 kg (55.56 lbs) - Gross weight: 35 kg (77.16 lbs) (including server, packaging box, rails and accessory box) • 12 × 3.5-inch drive configuration (with 2 GPUs) - Net weight: 31.2 kg (68.78 lbs) - Gross weight: 41 kg (90.39 lbs) (including server, packaging box, rails and accessory box) • 24 × E3.S drive configuration - Net weight: 22.8 kg (50.27 lbs) - Gross weight: 32.6 kg (71.87 lbs) (including server, packaging box, rails and accessory box) Note: The weight of a server varies by server configuration.

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47 Figure 6-1 Chassis Dimensions

Model	Za	Zb	Zc	Xa	Xb	Ya
KR2180-E2-A0-R0-00	800 mm (31.50 in.)	830 mm (32.68 in.)	11 mm (0.43 in.)	482 mm (18.98 in.)	431 mm (16.97 in.)	87 mm (3.43 in.)

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48 7 Operating System and Hardware Compatibility This section describes the OS and hardware compatibility of the server. For the latest compatibility configuration and the component models not listed in this document, contact your local sales representative. ) IMPORTANT • Using incompatible components may cause the server to work abnormally, and such failures are not covered by technical support or warranty. • The hardware compatibility of different models may vary slightly. Contact your sales representatives to confirm the detailed hardware configurations during the pre-sales phase. • The server performance is strongly influenced by application software, middleware and hardware. The subtle differences in them may lead to performance variation in the application and test software. - For requirements on the performance of specific application software, contact our sales representatives to confirm the detailed hardware and software configurations during the pre-sales phase. - For requirements on hardware performance consistency, define specific configuration requirements (for example, specific drive models, RAID cards, or firmware versions) during the pre-sales phase. 7.1 Supported Operating System Table 7-1 Supported Operating Systems OS Version Red Hat Enterprise Linux 9.1 CentOS 8.5 Windows Server 2022 Windows Server 2019 SUSE Linux Enterprise Server 15.4 Ubuntu 20.04.5 OpenEuler 22.03 49 OS Version Debian 11.2

After installing Linux OS, add iommu=pt in the OS. See the OS installation guide on our website for details. 7.2 Hardware Compatibility 7.2.1 CPU Specifications The server supports 1 AMD EPYC processor (Genoa). Table 7-2 CPU Specifications

Model	Cores	Threads	Base Frequency (GHz)	Max Boost Frequency (GHz)	Cache (MB)	Default TDP (W)
9654P	96	192	2.4	3.7	384	360
9654	96	192	2.4	3.7	384	360
9354	32	64	3.25	3.8	256	280
9124	16	32	3.00	3.7	64	200
9554P	64	128	3.1	3.75	256	360
9754	128	256	2.4	2.5	256	360
9554	64	128	3.1	3.75	256	360
9634	84	168	2.25	3.7	384	290
9454	48	96	2.75	3.8	256	290
9454P	48	96	2.75	3.8	256	290
9534	64	128	2.45	3.7	256	280

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7.2.2 DIMM Specifications The server supports up to 24 DDR5 DIMMs. The server supports 12 memory channels and 2 DIMM per channel. The server supports RDIMMs. 50 Table 7-3 DIMM Specifications

Type	Capacity (GB)	Rate (MT/s)	Data Width	Organization
RDIMM	16	4,800	x72	1R x8
RDIMM	32	4,800	x72	2R x8
RDIMM	64	4,800	x72	2R x4

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7.2.3 Drive Specifications Table 7-4 SAS/SATA HDD Specifications

Type	Capacity	Max. Qty.
SATA HDD	20 TB	20
SATA HDD	18 TB	20
SATA HDD	16 TB	20
SATA HDD	14 TB	20
SATA HDD	12 TB	20
SATA HDD	10 TB	20
SATA HDD	8 TB	20
SATA HDD	6 TB	20
SATA HDD	4 TB	20
SATA HDD	2 TB	20

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Table 7-5 SAS/SATA SSD Specifications

Type	Capacity	Max. Qty.
SATA SSD	1.92 TB	24
SATA SSD	7.68 TB	24
SATA SSD	3.84 TB	24
SATA SSD	960 GB	24
SATA SSD	480 GB	24
SATA SSD	240 GB	24

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Table 7-6 U.2 NVMe SSD Specifications

Type	Capacity	Max. Qty.
U.2 NVMe SSD	3.84 TB	24
U.2 NVMe SSD	7.68 TB	24
U.2 NVMe SSD	1.92 TB	24

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51 Table 7-7 M.2 SSD Specifications

Type	Capacity	Max. Qty.
M.2 SATA SSD	240 GB	2
M.2 SATA SSD	480 GB	2
M.2 PCIe SSD	3.84 TB	2
M.2 PCIe SSD	1.92 TB	2
M.2 PCIe SSD	960 GB	2

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7.2.4 SAS/RAID Card Specifications Table 7-8 SAS/RAID Card Specifications

Type	Description
SAS Card	SAS Card_BRCM_8R0_9500-8i_SMSAS3_PCIE4
	SAS Card_PM8222_PM8222_8_SAS3_PCIE
	SAS Card_PM8222_SmartHBA_8_SAS3_PCIE3
RAID Card	RAID Card_PM8204_RA_8_4GB_SAS3_PCIE3
	RAID Card_L_8R0_9560-8i_4G_HDM12G_PCIE4
	RAID Card_PM8204_RA_8_2GB_SAS3_PCIE3

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7.2.5 NIC Specifications Table 7-9 OCP Card Specifications

Type	Description	Speed (Gbps)	Port Qty.
OCP 3.0 Card	NIC_Andes-6_X710_10G_LC_OCP3x8_2	10	2
	NIC_SND_1G_I350_RJ_OCP3x4_2_XR	1	2
	NIC_Andes-M6_E810_25G_LC_OCP3x8_2	25	2
	NIC_I_100G_E810CQDA2_LC_OCP3x16_2_XR	100	2
	NIC_M_100G_MCX623436AN_LC_OCP3x16_2_XR	100	2
	NIC_M_25G_MCX623432AN_LC_OCP3x16_2_XR	25	2
	NIC_I_25G_E810XXVDA2_LC_OCP3x8_2_XR	25	2
	NIC_Andes-M6_E810_25G_LC_OCP3x8_2	25	2

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52 Table 7-10 PCIe NIC Specifications

Type	Description	Speed (Gbps)	Port Qty.
PCIe NIC	NIC_I_10G_EX710DA2_LC_PCIEx8_2_XR	10	2
	MCX631102AN-ADAT_25G	25	2
	NIC_Andes-M6_E810_25G_LC_PCIEx8_2	25	2
	NIC_I_100G_E810-CQDA2_LC_PCIEx16_2_XR	100	2
	NIC_M_25G_MCX623432AN_LC_OCP3x16_2_XR	25	2
	NIC_Vostok_I350_1G_RJ_PCIEx4_4	1	4

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7.2.6 HBA/HCA Card Specifications Table 7-11 HBA Card Specifications Type: HBA Card Description: HBA Card_E_0R1_LPE31000-AP_FC16G_PCIE 16G_Single_EMULEX Table 7-12 HCA Card Specifications

Type	Description	Speed (Gbps)	Port Qty.
HCA Card	HCA Card_M_2-HDR200_MCX653106A-HDAT_PCIE	200	2
HCA Card	HCA Card_M_1-HDR100_MCX653105A-ECAT_PCIE	100	2

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7.2.7 PSU Specifications The server supports up to 2 PSUs in 1+1 redundancy that follow the Intel Common Redundant Power Supply (CRPS) specification. The PSUs share a common electrical and structural design that allows for hot-swapping and tool-less installation into the server with the PSUs locking automatically after being inserted into the power bay. The CRPS PSUs are 80 Plus Platinum or Titanium rated with various output powers, allowing customers to choose as needed. • The following rated 110 Vac to 230 Vac PSUs in 1+1 redundancy are supported: - 2,700 W Platinum PSU: 1,000 W (110 Vac), 2,700 W (230 Vac) - 2,000 W Platinum PSU: 1,000 W (110 Vac), 2,000 W (230 Vac) - 1,600 W Platinum PSU: 1,000 W (110 Vac), 1,600 W (230 Vac) - 1,300 W Platinum PSU: 1,000 W (110 Vac), 1,300 W (230 Vac) 53 - 800 W Platinum PSU: 800 W (110 Vac), 800 W (230 Vac) - 550 W Platinum PSU: 550 W (110 Vac), 550 W (230 Vac) - 2,000 W Titanium PSU: 1,000W (110 Vac), 2,000W (230 Vac) - 1,600 W Titanium PSU: 1,000W (110 Vac), 1,600W (230 Vac) - 1,300 W Titanium PSU: 1,000W (110 Vac), 1,300W (230 Vac) - 800 W Titanium PSU: 800W (110 Vac), 800W (230 Vac) Note: At a rated input voltage of 110 Vac, the output power of a 1,300/1,600/2,000 W PSU will be derated to 1,000 W. Operating voltage range: - 110 Vac to 230 Vac: 90 Vac to 264 Vac • The following rated -48 Vdc PSUs in 1+1 redundancy are supported: - 800 W -48 Vdc PSU: 800 W (-48 Vdc) - 1,300 W -48 Vdc PSU: 1,300 W (-48 Vdc) Operating voltage range: -48 Vdc: -40 Vdc to -72 Vdc 54 8 Regulatory Information 8.1 Safety 8.1.1 General • Strictly comply with local laws and regulations while installing the equipment. The safety instructions in this section are only a supplement to local safety regulations. • To ensure personal safety and to prevent damage to the equipment, all personnel must strictly observe the safety instructions in this section and on the device labels. • People performing specialized activities, such as electricians and electric forklift operators, must possess qualifications recognized by the local government or authorities. 8.1.2 Personal Safety • Only personnel certified or authorized by us are allowed to perform the installation procedures. • Stop any operation that could cause personal injury or equipment damage. Report to the project manager and take effective protective measures. • Working during thunderstorms, including but not limited to handling equipment, installing cabinets and installing power cords, is forbidden. • Do not carry the weight over the maximum load per person allowed by local laws or regulations. Arrange appropriate installation personnel and do not overburden them. • Installation personnel must wear clean work clothes, work gloves, safety helmets and safety shoes, as shown in Figure 8-1. 55 Figure 8-1 Protective Clothing ![figure](images/reducto/p065_figure_0616.jpg) • Before touching the equipment, put on ESD clothes and ESD gloves or an ESD wrist strap, and remove any conductive objects such as wrist watches or metal jewelry, as shown in Figure 8-2, in order to avoid electric shock or burns. Figure 8-2 Removing Conductive Objects How to put on an ESD strap (Figure 8-3). a. Put your hand through an ESD wrist strap. b. Tighten the strap buckle to ensure a snug fit. c. Plug the alligator clip of the ESD wrist strap into the corresponding jack on the grounded cabinet or grounded chassis. 56 Figure 8-3 Wearing an ESD Wrist Strap

• Use tools correctly to avoid personal injury. • When moving or lifting equipment above shoulder height, use lifting devices and other tools as necessary to avoid personal injury or equipment damage due to equipment slippage. • The power sources of the server carry a high voltage. Direct contact or indirect contact through damp objects with the high-voltage power source is fatal. • To ensure personal safety, ground the server before connecting power. • When using ladders, always have someone hold and guard the bottom of the ladders. In order to prevent injury, never use a ladder alone. • When connecting, testing or replacing optical fiber cable, avoid looking into the optical port without eye protection in order to prevent eye damage from laser light. 8.1.3 Equipment Safety • To ensure personal safety and prevent equipment damage, use only the power cords and cables that come with the server. Do not use them with any other equipment. • Before touching the equipment, put on ESD clothing and ESD gloves to prevent static electricity from damaging the equipment. • When moving the server, hold the bottom of the server. Do not hold the handles of any module installed in the server, such as PSUs, fan modules, drive modules, or motherboard. Handle the equipment with care at all times. • Use tools correctly to avoid damage to the equipment. • Connect the power cords of active and standby PSUs to different PDUs to ensure high system reliability. 57 • To ensure equipment safety, always ground the equipment before powering it on. 8.1.4 Transportation Precautions Contact the manufacturer for precautions before transportation as improper transportation may damage the equipment. The precautions include but not limited to: • Hire a trusted logistics company to move all equipment. The transportation process must comply with international transportation standards for electronic equipment. Always keep the equipment being transported right-side up. Avoid collision, moisture, corrosion, packaging damage or contamination. • Transport the equipment in its original packaging. • If the original packaging is unavailable, separately package heavy and bulky components (such as chassis, blade servers and blade switches), and fragile components (such as optical modules and PCIe cards). • Power off all equipment before shipping. 8.1.5 Manual Handling Weight Limits

Observe local laws or regulations regarding the manual handling weight limits per person. The limits shown on the equipment and in the document are recommendations only. Table 8-1 lists the manual handling weight limits per person specified by some organizations. Table 8-1 Manual Handling Weight Limits per Person

Organization	Weight Limit (kg/lbs)
European Committee for Standardization (CEN)	25/55.13
International Organization for Standardization (ISO)	25/55.13
National Institute for Occupational Safety and Health (NIOSH)	23/50.72
Health and Safety Executive (HSE)	25/55.13
General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China (AQSIQ)	• Male: 15/33.08 • Female: 10/22.05

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58 9 Limited Warranty This limited warranty applies only to the original purchasers of our products who are direct customers or distributors of us (“Customer”). We warrant all our hardware products, if properly used and installed, to be free from defects in material and workmanship within the warranty period. The term "Hardware Product" is limited to the hardware components and required firmware. The term "Hardware Product" DOES NOT include software applications or programs, and DOES NOT include products or peripherals that are not supplied by us. We may, at our discretion, repair or replace the defective parts. Repair or replacement parts may be new, used, or equivalent to new in performance and reliability. Repair or replacement parts are warranted to be free of defects in material or workmanship for ninety (90) calendar days or for the remainder of the warranty period of the product, whichever is longer. Service offerings may vary by geographic region. Please contact your representative to identify service levels and needs for your region. 9.1 Warranty Service Our warranty service includes 24 x 7 remote technical support, RMA (Return Material Authorization) Service, ARMA (Advanced Return Material Authorization) Service, 9 x 5 x NBD (Next Business Day) Onsite Service and 24 x 7 x 4 Onsite Service. 9.1.1 Remote Technical Support The 24 × 7 remote technical support can be obtained through hotline, e-mail, and Service Portal*¹. Through hotline and e-mail support, our engineers help customers diagnose the causes of malfunctions and provide solutions. Service Portal*¹ provides access to firmware, customized update files, and related manuals for Hardware Products. Customer may also access the Service Portal*¹ to submit an RMA request or an ARMA request for parts replacement or repair. Information needed when requesting support: • Contact name, phone number, e-mail address • System serial number, part number, model and location (address) of the product needing service • Detailed description of problem, logs (SELs and blackbox logs, and any other related logs from OS), screenshot of issue, pictures of damaged/faulty parts, etc. 59 9.1.2 RMA Service Standard Replacement: When a hardware failure occurs, Customer may submit an RMA request to us via e-mail or Service Portal^*1. We will review and approve the RMA submission at our own discretion, and provide an RMA number and return information that Customer may use to return the defective part(s) for the RMA service. We will ship out replacement part(s) within one (1) business day after receiving the defective part(s) and cover one-way shipment. NOTE • Customer should return the defective parts in original packaging to our designated service center at their own expense. • After our further diagnosing and testing, if the defective parts conform to our repair policy, we will ship out the repair or replacement parts at our own expense; otherwise, we will return the defective parts at Customer’s expense. • If Customer needs to designate a logistics company, allocation of the shipping cost to us/Customer will be redefined. 9.1.3 ARMA Service Advanced Replacement: If a problem with our hardware products cannot be resolved via hotline or e-mail support and replacement part(s) are required, we will ship out replacement part(s) in advance within one (1) business day. Customer should return defective part(s) within five (5) business days after receiving the replacement(s). The shipping cost coverage varies by region. Contact your sales representative for details. NOTE • Customer should return the defective parts in original packaging to our designated service center. • We will ship out the replacement parts at our own expense after completing remote diagnosis. • If Customer needs to designate a logistics company, allocation of the shipping cost to us/Customer will be redefined. 9.1.4 9 × 5 × NBD Onsite Service When we ultimately determine that an onsite service call is required to repair or replace a defect, the call will be scheduled in accordance with the Response Time 60 Commitment. The response time is measured from the time when the remote troubleshooting is completed and logged to the arrival of a service engineer and parts to Customer location for repair. NOTE 9 × 5 × NBD: Our service engineer typically arrives at the customer's data center on the next business day. Service engineers are available on local business day from 9:00 am to 6:00 pm local time. Calls received/dispatches after 5:00 pm local time will require an additional day for the service engineer to arrive. 9.1.5 24 × 7 × 4 Onsite Service When we ultimately determine that an onsite service call is required to repair or replace a defect, the call will be scheduled in accordance with the Response Time Commitment. The response time is measured from the time when the remote troubleshooting is completed and logged to the arrival of a service engineer and parts to Customer location for repair.

24 x 7 x 4: Our service engineer typically arrives at the customer site within 4 hours. Service engineers are available at any time, including weekends and local national holidays. 9.2 Our Service SLA We offer a variety of Service Level Agreements (SLA)*² to meet customer requirements. • RMA Service • ARMA Service ● 9 x 5 x NBD Onsite Service • 24 x 7 x 4 Onsite Service 9.3 Warranty Exclusions We do not guarantee that there will be no interruptions or mistakes during the use of the products. We will not undertake any responsibility for the losses arising from any operation not conducted according to instructions intended for Hardware Products. 61 The Limited Warranty does not apply to • expendable or consumable parts, such as, but not limited to, batteries or protective coatings that are designed to diminish over time, unless failure has occurred during DOA period due to a defect in material or workmanship; • any cosmetic damage, such as, but not limited to, scratches, dents, broken plastics, metal corrosion, or mechanical damage, unless failure has occurred during DOA period due to a defect in material or workmanship; • damage or defects caused by accident, misuse, abuse, contamination, improper or inadequate maintenance or calibration or other external causes; • damage or defects caused by operation beyond the parameters as stipulated in the user documentation; • damage or defects by software, interfacing, parts or supplies not provided by us; • damage or defects by improper storage, usage, or maintenance; • damage or defects by virus infection; • loss or damage in transit which is not arranged by us; • Hardware Products that have been modified or serviced by non-authorized personnel; • any damage to or loss of any personal data, programs, or removable storage media; • the restoration or reinstallation of any data or programs except the software installed by us when the product is manufactured; • any engineering sample, evaluation unit, or non-mass production product that is not covered under warranty service; • any solid-state drive (SSD) which has reached its write endurance limit. In no event will we be liable for any direct loss of use, interruption of business, lost profits, lost data, or indirect, special, incidental or consequential damages of any kind regardless of the form of action, whether in contract, tort (including negligence), strict liability or otherwise, even if we have been advised of the possibility of such damage, and whether or not any remedy provided should fail of its essential purpose. *1 Service Portal availability is subject to customer type and customer location. Please contact your representative to learn more. *2 Not all SLA offerings are available at all customer locations. Some SLA offerings may be limited to geolocation and/or customer type. Please contact your representative to learn more. 62 10 System Management 10.1 Intelligent Management System BMC BMC, a remote server management system, supports mainstream management specifications in the industry such as IPMI 2.0 and Redfish 1.13. BMC features high operational reliability, easy serviceability for different business scenarios, accurate and comprehensive fault diagnosis capabilities, and industry-leading security reinforcement capabilities. BMC supports: • IPMI 2.0 • Redfish 1.13 • SNMP v1/v2c/v3 • HTML5/Java remote consoles (Keyboard, Video, Mouse) • Remote virtual media • Login via web browsers • Intelligent fault diagnosis Table 10-1 BMC Features

Feature	Description
Management Interface	Supports extensive remote management interfaces for various server O&M scenarios. The supported interfaces include: • IPMI • SMASH CLP • SNMP • HTTPS • Web GUI • Redfish • RESTful • DCMI • Syslog
Accurate and Intelligent Fault Location	IDL, a fault diagnosis system, offers accurate and comprehensive hardware fault location capabilities, and outputs detailed fault causes and handling suggestions.

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Feature	Description
Alert Management	Supports rich automatic remote alert capabilities, including proactive alerting mechanisms such as SNMP Trap (v1/v2c/v3), email alerts and syslog remote alerts to ensure 24 × 7 reliability.
Remote Console KVM	Supports HTML5- and Java-based remote console to remotely control and operate the monitor/mouse/keyboard of the server, providing highly available remote management capabilities without on-site operation.
Virtual Network Console (VNC)	Supports mainstream third-party VNC clients without relying on Java, improving management flexibility.
Remote Virtual Media	Supports virtualizing images, USB devices, folders and local media devices as media devices of remote servers, simplifying OS installation, file sharing, and other O&M tasks.
Web GUI	Supports the visual management interface developed by us, displaying abundant information of the server and components, and offers easy-to-use Web GUIs.
Crash Screenshot and Crash Video Recording	Supports automatic crash screenshot and crash video recording (video needs to be enabled manually) to capture the last screen and video before crash; provides manual screenshot, which can quickly capture the screen for easy inspection at scheduled time.
Dual Flash and Dual Image	Supports dual flash and dual image, enabling automatic flash failover in case of software or flash corruption, improving operational reliability.
Power Capping	Supports power capping, increasing deployment density and reducing energy consumption.
IPv4/IPv6	Supports both IPv4 and IPv6, enhancing network deployment flexibility.
Auto-Switching of Management Network Port	Supports auto-switching between the dedicated management network port and shared management network port, providing customers with flexible network deployment solutions for different management network deployment scenarios.
BMC Self-Diagnosis and Self-Recovery System	• Supports the reliable dual watchdog mechanism for hardware and software, enabling automatic restoration of BMC in case of BMC abnormality. • Provides a thermal protection mechanism, which is automatically triggered when the BMC is abnormal to ensure that the fan operates at safe speeds to avoid system overheating. • Supports self-diagnosis of processors, memory modules, and storage devices of BMC, and automatically cleans

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Feature	Description
	the workload to restore to normal when the device usage rate is too high.
Power Control	Supports virtual power buttons for power on/off, power cycle and reset.
UID LED	Supports remote lighting of the UID LED for locating the server in the server room.
Secure Firmware Update	Supports firmware update based on secure digital signatures, and mismatch prevention mechanism for firmware from different manufacturers and firmware for different server models; supports firmware update of BMC/BIOS/CPLD/ PSU.
Serial Port Redirection	Supports remote redirection of the system serial port, BMC serial port and other serial ports, and directs the server-side serial port output to the local administrator via the network for server debugging.
Storage Information Display	Displays RAID logical array information and drive information, and supports remote RAID creation for improved deployment efficiency.
User Role Management	Supports user detail management based on user roles and flexible creation of user roles with different privileges, and provides more user roles to allow administrators to grant different privileges to O&M personnel.
Security Feature	Adopts the industry-leading server security baseline standard V3.0. SSH, HTTPS, SNMP and IPMI use secure and reliable algorithms. BMC offers capabilities including secure update and boot and security reinforcement mechanisms such as anti-replay, anti-injection, and anti-brute force.
Double Factor Authentication	Supports double factor authentication for local BMC users. Users need to log in to the BMC with both password and certificate, thus to prevent attacks caused by password leakage.
Configuration Exporting and Importing	Imports and exports the existing system configurations.
System Information Display	Displays the server basic information such as the information and health status of key server components, including CPU, memory, power supply, device inventory, hard drive, network adapter, and security chip.
Fan Management	Displays the status, current speed, duty ratio, and other information of a fan module. You can select the fan control mode and preset the speed for each fan module in the Manual Fan Control mode.

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Feature	Description
Power Policy	Sets how the server operating system reacts under the BMC's control when AC power is reconnected to the server.
One-Click Erasing	Performs non-recoverable erasing on all storage devices of the server, preventing data leakage when the server is to be retired.
System Lockdown	After this feature is enabled, some parameters of the server cannot be set and some operations cannot be performed on the server.

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10.2 KSManage The server is compatible with the latest version of KSManage, a new-generation infrastructure O&M management platform for data centers. Built on cutting-edge O&M concepts, KSManage provides users with leading and efficient overall management solutions for data centers to ensure advanced infrastructure management. This platform provides a rich set of functions such as centralized asset management, in-depth fault diagnosis, component fault early warning, intelligent energy consumption management, 3D automatic topologies, and stateless automatic deployment. With these functions, users can implement centralized O&M of servers, storage devices, network devices, security devices, and edge devices, effectively improving O&M efficiency, reducing O&M costs, and ensuring the secure, reliable, and stable operation of data centers. KSManage offers: • lightweight deployment in multiple scenarios and full lifecycle management of devices • high reliability and on-demand scalability enabled by 1 to N data collectors • intelligent asset management and real-time tracking of asset changes • comprehensive monitoring for overall business control • intelligent fault diagnosis for reduced maintenance time • second-level performance monitoring for real-time status of devices • batch configuration, deployment and update, shortening the time needed to bring the production environment online • improved firmware version management efficiency • standardized northbound interfaces for easy integration and interfacing 66 Table 10-1 KSManage Features

Feature	Description
Home	Display of basic information (data centers, server rooms, cabinets, assets and alerts), quick addition of devices and custom home page
Assets	• Batch asset import, automatic asset discovery, and full lifecycle management of assets • Management of the full range of our server family, including general-purpose rack servers, AI servers, multi-node servers, edge servers and all-in-one servers • Management of our general-purpose disk arrays and distributed storage devices • Management of network devices (switches, routers, etc.), security devices (firewalls, load balancers, etc.), cabinets and clouds • Management of data centers • Asset warranty information management, asset inventory reports for server acceptance, asset attribute expansion, etc.
Monitor	• Display of real-time alerts, history alerts, blocked alerts and events • Fault prediction of drives and memories • Custom inspection plan and inspection result management • Notification record viewing • Intelligent fault diagnosis and analysis, automatic fault reporting and repair ticket viewing • Trap management and Redfish management • Management of monitoring rules, such as alert rules, notification rules, blocking rules, alert noise reduction rules, compression rules and fault reporting rules, and redefinition of the above rules.
Control	• Quick start of firmware update, OS installation, power management, drive data erasing and stress test • Batch firmware update (BMC/BIOS/RAID Card/NIC/Drive/HBA Card/MB CPLD/BP CPLD/PSU) • Batch firmware configuration (BMC/BIOS) • Batch RAID configuration and OS deployment for servers

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Feature	Description
	• Secure and quick drive data erasing • CPU and memory stress test • Automatic firmware baseline management • BMC and BIOS snapshot management • Repositories for update files
Energy Efficiency	• Overview of data center power consumption trend chart and carbon emission trend chart • Setting of server dynamic power consumption policies and minimum power consumption policies • Carbon asset and carbon emission management
Log	• Fault log record management • Diagnosis record and diagnosis rule management
Topologies	• Centralized management of multiple data centers and panoramic 3D views, including dynamic display of power consumption, temperature, alerts and cabinet capacity of the data center • Network topologies
Reports	• Management of warranty information reports, alert reports, asset reports, hardware reports and performance reports • Export of reports in .xlsx format
System	• Password management, alert forwarding and data dump • Customized KSManage parameters
Security	Security control of KSManage via a set of security policies such as user management, role management, authentication management (local authentication and LDAP authentication) and certificate management.

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68 10.3 KSManage Tools Table 10-2 Features of KSManage Tools

Feature	Description
KSManage Kits	A lightweight automatic batch O&M tool for servers, mainly used for server deployment, routine maintenance, firmware update, fault handling, etc.
KSManage Boot	A unified batch management platform for bare metals, with features including firmware management, hardware configuration, system deployment and migration, stress test and in-band management
KSManage Server CLI	Fast integration with third-party management platforms, delivering a new O&M mode of Infrastructure as Code (IaC)
KSManage Driver	Operates under the OS and gets system asset and performance information via the in-band mode, providing users with more comprehensive server management capabilities
KSManage Server Provisioning	Offers users with RAID configuration, intelligent OS installation, firmware update, hardware diagnosis, secure erasing and software upgrade, using the TF card as the carrier

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Table 11-1 Certifications

Country/Region	Certification	Mandatory/Voluntary
International	CB	Voluntary
EU	CE	Mandatory
US	FCC	Mandatory
	UL	Voluntary
	Energy Star	Voluntary
Canada	IC	Mandatory
EAEU	EAC	Mandatory
	EAC-RoHS	Mandatory
	FSS	Mandatory
South Korea	KC	Mandatory
South Korea	E-Standby	Mandatory
India	BIS	Mandatory
Australia	RCM	Mandatory

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12.1 Thermal Restrictions Table 12-1 Thermal Restrictions

Configuration	Max. Operating Temp. 30°C (86°F)	Max. Operating Temperature: 35°C (95°F)
12 × 3.5-Inch SAS/SATA Drive Config.	• DIMMs ≤24 pcs • CPU TDP ≤360 W • Unperforated chassis supported • Only NICs <40 Gb supported in some slots • 100 Gb NIC not supported in OCP1 slot • GPUs not supported	• DIMMs ≤24 pcs • CPU TDP ≤360 W • Unperforated chassis not supported • Only NICs <40 Gb supported in some slots • 100 Gb NIC not supported in OCP1 slot • GPUs not supported
24 × 2.5-Inch NVMe/SAS/SATA Config.	• DIMMs ≤24 pcs • CPU TDP ≤360 W • Unperforated chassis supported • Only NICs <40 Gb supported in some slots • 100 Gb NIC not supported in OCP1 slot • GPUs not supported	• DIMMs ≤24 pcs • CPU TDP ≤360 W • Unperforated chassis not supported • Only NICs <40 Gb supported in some slots • 100 Gb NIC not supported in OCP1 slot • GPUs not supported
GPU Configuration 1 – 8 × 2.5-Inch NVMe/SAS/SATA Drive	• DIMMs ≤12 pcs • CPU TDP ≤360 W • Unperforated chassis not supported • 100 Gb NIC supported in OCP1 slot • 6 single-slot A2/L4 GPUs supported	• DIMMs ≤12 pcs • CPU TDP ≤360 W • Unperforated chassis not supported • 100 Gb NIC not supported in OCP1 slot • 6 single-slot A2/L4 GPUs supported

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Configuration	Max. Operating Temp. 30°C (86°F)	Max. Operating Temperature: 35°C (95°F)
GPU Configuration 2 – 4 × 3.5-Inch SAS/SATA Drive	• DIMMs ≤12 pcs • CPU TDP ≤360 W • Unperforated chassis not supported • 100 Gb NIC supported in OCP1 slot • 6 single-slot A2/L4 GPUs supported	• DIMMs ≤12 pcs • CPU TDP ≤360 W • Unperforated chassis not supported • 100 Gb NIC not supported in OCP1 slot • 6 single-slot A2/L4 GPUs supported

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NOTE • The maximum operating temperature will drop by 5°C (9°F) if a single fan fails. • Single fan failure may affect system performance. • When the front bezel is used with any of the following, the maximum operating temperature will drop by 3°C (5.4°F): 100 Gb OCP 3.0 cards, 400 W TDP CPUs, 24 × 2.5-inch drive configuration, 12 × 3.5-inch drive configuration, or GPUs. • Consult your sales representative for detailed restrictions on component combination with rear NICs. 12.2 Model Table 12-2 Model

Certified Model	Description
KR2180-E2-A0-R0-00	Global

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12.3 RAS Features The server supports a variety of RAS (Reliability, Availability, and Serviceability) features. By configuring these features, the server can provide greater reliability, availability, and serviceability. 72 12.4 Sensor List Table 12-3 Sensor List

Sensor	Description	Sensor Location	Note
Inlet_Temp	Chassis air inlet temperature	Right mounting ear
Outlet_Temp	Chassis air outlet temperature	Motherboard
CPU0_Temp	CPU core temperature	CPU
CPU0_VR_Temp	CPU VR temperature	VR chip on the motherboard
CPU0_DIMMGx_T	The maximum temperature of the DIMMs of CPU0	DIMM	x indicates the DIMM number with a value of 0 to 1
HDD_MAX_Temp	Maximum temperature among all drives connected to the RAID card	Drives attached to the drive backplane
NVMe_Temp	Maximum temperature among all NVMe drives	Drives attached to the drive backplane
PSU_Inlet_Temp	PSU inlet temperature	PSU
OCP_0_NIC_Temp	OCP card temperature	Motherboard OCP card
OCP_0_SFP_Temp	The temperature of the SFP optical module on the OCP card	SFP optical module on the OCP card
PCIe_NIC_Temp	Maximum temperature among all PCIe NICs	Motherboard PCIe NIC
PCIe_SFP_Temp	The temperature of the SFP optical module on the PCIe NIC	SFP optical module on the PCIe NIC

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Sensor	Description	Sensor Location	Note
RAID_Temp	Maximum temperature among all RAID cards	Motherboard RAID cards
GPUx_Temp	GPUx temperature	GPU	x indicates the GPU number with a value of 0 to 3
HBA_Temp	HBA card temperature	HBA card
PCIe_HCA_Temp	HCA card temperature	HCA card
PCIe_HCA_SFP_T	The temperature of the SFP optical module on the HCA card	SFP optical module on the HCA card
OCP_RAID_Temp	RAID mezz card temperature	RAID mezz card
SYS_12V	12 V voltage supplied by motherboard to BMC	Motherboard
SYS_5V	5 V voltage supplied by motherboard to BMC	Motherboard
SYS_3V3	3.3 V voltage supplied by motherboard to BMC	Motherboard
P5V_STBY	5 V voltage of standard power connectors on the motherboard	Motherboard
P3V3_STBY	3.3 V voltage of standard power connectors on the motherboard	Motherboard
P1V8_STBY	1.8 V voltage of standard power connectors on the motherboard	Motherboard

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Sensor	Description	Sensor Location	Note
P1V05_USB	1.05 V voltage supplied to USB module	Motherboard
PVDD33_S5	The voltage supplied by VR chip to CPU	Motherboard
PVDDCR_CPU0_P0	The voltage supplied by VR chip to CPU	Motherboard
PVDDCR_CPU1_P0	The voltage supplied by VR chip to CPU	Motherboard
PVDD18_S5_P0	The voltage supplied by VR chip to CPU	Motherboard
PVDDCR_SOC_P0	The voltage supplied by VR chip to CPU	Motherboard
PVDD11_S3_P0	The voltage supplied by VR chip to CPU	Motherboard
PVDDIO_P0	The voltage supplied by VR chip to CPU	Motherboard
P12V_CPU0_DIMM1	12 V voltage supplied by motherboard to DIMMs	Motherboard
PSUx_VIN	PSUx input voltage	PSU	x indicates the PSU number with a value of 0 to 1
PSUx_VOUT	PSUx output voltage	PSU	x indicates the PSU number with a value of 0 to 1
RTC_Battery	RTC battery voltage	RTC battery on the motherboard
FANx_Status	FANx status	FANx	x indicates the fan module number with a value of 0 to 5

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Sensor	Description	Sensor Location	Note
FAN_Redundant	Fan redundancy status	Fan module
FANx_F_Speed	FANx speed in rpm	FANx	x indicates the fan module number with a value of 0 to 5
FANx_R_Speed	FANx speed in rpm	FANx	x indicates the fan module number with a value of 0 to 5
Total_Power	Total power	PSU
PSUx_PIN	PSUx input power	PSUx	x indicates the PSU number with a value of 0 to 1
PSUx_POUT	PSUx output power	PSUx	x indicates the PSU number with a value of 0 to 1
FAN_Power	Total fan power	Fan Modules
CPU_Power	Total CPU power	Motherboard
Memory_Power	Total memory power	Motherboard
CPU0_Status	CPU status	CPU
CPU_Config	CPU configuration status (mixing of CPUs, or primary CPU not installed)	CPU
CPU0_CxDy	CPU DIMM status	CPU DIMM	x indicates the memory channel number under the CPU with a value of A to L; y indicates the DIMM number with a value of 0 to 1
PCIe_Status	PCIe status error	PCIe bus

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Sensor	Description	Sensor Location	Note
Power_Button	Power button pressed	Power button on the front panel
Watchdog2	Watchdog	Motherboard
Sys_Health	BMC health status	BMC
UID_Button	UID button status	Motherboard
PWR_CAP_Fail	Power capping status	Motherboard
PSU_Redundant	PSU redundancy status	PSU
PSU_Mismatch	PSU model mismatch	PSUs
PSUx_Status	PSUx failure status	PSUx	x indicates the PSU number with a value of 0 to 1
Intrusion	Monitors chassis-opening activity (chassis intrusion detection)	Top cover
SysShutdown	Reason for system shutdown	-
ACPI_PWR	ACPI status
ME_FW_Status	System software process, system startup error
SysRestart	Reason for system restart
BIOS_Boot_Up	BIOS boot up complete
System_Error	Emergency system failure
POST_Status	POST status
CPU_Config	System hang	-
BMC_Boot_Up	Record the BMC boot event	-
SEL_Status	Record the event that system event logs are almost full/cleared	-

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Sensor	Description	Sensor Location	Note
BMC_Status	BMC status	-
LeakageSensor	Leak detection (reserved)	-

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78 13 Appendix B Acronyms and Abbreviations 13.1 A - E A AC: Alternating Current ACPI: Advanced Configuration and Power Interface AI: Artificial Intelligence AMD: Advanced Micro Devices, Inc. AMD-V: AMD Virtualization ANSI: American National Standards Institute AQSIQ: General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China ARMA: Advanced Return Material Authorization ASP: AMD Secure Processor AVX: Advanced Vector Extensions B BIOS: Basic Input Output System BLE: BIOS Lock Enable BMC: Baseboard Management Controller BOM: Bill of Materials BP: Backplane 79 C CAS: Column Address Strobe CB: Certification Body CCC: China Compulsory Certificate CE: Conformite Europeenne CEN: European Committee for Standardization CLI: Command-Line Interface CMA: Cable Management Arm CMOS: Complementary Metal-Oxide-Semiconductor COM: Communication CPLD: Complex Programmable Logic Device CPU: Central Processing Unit CRPS: Common Redundant Power Supply D DC: Direct Current DCMI: Data Center Manageability Interface DC-SCM: Datacenter-ready Secure Control Module DDR5: Double Data Rate 5 DIMM: Dual In-Line Memory Module DOA: Dead on Arrival DPC: DIMM Per Channel DRAM: Dynamic Random-Access Memory E EAC: Eurasian Conformity 80 ECC: Error-Correcting Code ECMA: European Computer Manufacturer Association ESD: Electro-static Discharge EU: European Union 13.2 F - J F FCC: Federal Communications Commission FHHL: Full-Height Half-Length FW: Firmware G GPU: Graphics Processing Unit GUI: Graphical User Interface H HBA: Host Bus Adapter HCA: Host Channel Adapter HDD: Hard Disk Drive HDT: Hardware Debug Tool HSE: Health and Safety Executive HTTPS: HyperText Transfer Protocol Secure I I/O: Input/Output 81 IC: Industry Canada ID: Identity IEC: International Electrotechnical Commission IOD: I/O Die IP: Internet Protocol IPMB: Intelligent Platform Management Bus IPMI: Intelligent Platform Management Interface ISA: International Society of Automation ISO: International Organization for Standardization J JTAG: Joint Test Action Group 13.3 K - O K KC: Korean Certification KVM: Keyboard Video Mouse L LC: Lucent Connector LCD: Liquid Crystal Display LDAP: Lightweight Directory Access Protocol LED: Light Emitting Diode M 82 MCIO: Mini Cool Edge IO ME: Management Engine N NBD: Next Business Day NC-SI: Network Controller Sideband Interface NIC: Network Interface Controller NIOSH: National Institute for Occupational Safety and Health NVMe: Non-Volatile Memory Express O OCP: Open Compute Project O&M: Operations and Maintenance OS: Operating System 13.4 P - T P PC: Personal Computer PCH: Platform Controller Hub PCIe: Peripheral Component Interconnect Express PFR: Platform Firmware Resilience PID: Proportional, Integral, Derivative POST: Power-On Self-Test PSU: Power Supply Unit PWR: Power 83 R RAID: Redundant Arrays of Independent Disks RAS: Reliability, Availability, Serviceability RDIMM: Registered Dual In-line Memory Module RH: Relative Humidity RHEL: Red Hat Enterprise Linux RMA: Return Material Authorization RST: Reset RTC: Real Time Clock S SAS: Serial Attached SCSI SATA: Serial Advanced Technology Attachment SCSI: Small Computer System Interface SDP: System Demonstration Platform SEL: System Event Log SEV: Secure Encrypted Virtualization SFF: Small Form Factor SFP: Small Form-factor Pluggable SGPIO: Serial General Purpose Input/Output SLA: Service Level Agreements SNMP: Simple Network Management Protocol SSD: Solid State Drive SSH: Secure Shell 84 T TCM: Trusted Cryptography Module TDP: Thermal Design Power TF: TransFlash TPM: Trusted Platform Module 13.5 U - Z U UART: Universal Asynchronous Receiver Transmitter UEFI: Unified Extensible Firmware Interface UID: Unit Identification UL: Underwriters Laboratories UMC: Unified Memory Controller USB: Universal Serial Bus V VGA: Video Graphics Array VLAN: Virtual Local Area Network VM: Virtual Machine VMD: Volume Management Device VNC: Virtual Network Console VPP: Virtual Pin Point VR: Voltage Regulator VRD: Voltage Regulator Down VROC: Virtual RAID on CPU 85