# Aivres KR2266 white paper (parsed) Parsed from Aivres's PDF https://aivres.com/wp-content/uploads/Aivres-White-Paper-KR2266V2-v1.pdf on 2026-10-15 (92 pages; OCR and table reconstruction by Reducto; tables are HTML inside this Markdown, images are figure crops from the PDF). Specifications belong to Aivres and are subject to change without notice; the PDF is the authority. Products: [kr2266v2](https://aivres.upstation.io/p/kr2266v2) ---
figure p1
AiVRES
White Paper for KR2266V2 Series Servers Powered by Intel Processors For KR2266-X2-A0-R0-00 Document Version: V1.0 Release Date: April 25, 2025 Copyright © 2025 AIVRES SYSTEMS INC. All rights reserved. No part of this document may be reproduced or transmitted in any form or by any means without our prior written consent. Applicable Model Model: KR2266-X2-A0-R0-00 Maintenance: Rear access Cooling: Air cooling Technical Support Global Service Hotline: (+1) 844-912-0007 Address: 1501 McCarthy Blvd, Milpitas, CA 95035 AIVRES SYSTEMS INC. Website: https://aivres.com Email: serversupport@aivres.com 1 Environmental Protection Please dispose of product packaging by recycling at a local recycling center for a greener planet. Trademarks All the trademarks or registered trademarks mentioned herein may be the property of their respective holders. This document does not mark any product or brand with the symbol ® or ™. Security Statement We are intensely focused on server product safety and have placed a high priority on this. For a better understanding of our server products, carefully read through the following security risk statements. • When servers are to be repurposed or retired, we recommend that you restore their firmware factory settings, delete information and clear logs from BIOS and BMC to protect data privacy. Meanwhile, we recommend that you wipe the drive data thoroughly and securely with trusted erasing tools. You can use KSManage Server Provisioning. Contact us for specific server models to which KSManage Server Provisioning is applicable. • For server open source software statements, please contact us. • Some interfaces and commands for production, assembly and return-to-depot, and advanced commands for locating faults, if used improperly, may cause equipment abnormality or business interruption. This is not described herein. Please contact us for such information. • External ports of our servers do not use private protocols for communication. • Our products will not initiatively obtain or use your personal data. Only when you consent to use certain functions or services, some personal data such as IP address and email address for alerts may be obtained or used during business operation or fault location. We have implemented necessary measures on product functions to ensure personal data security throughout the data lifecycle, including but not limited to data collection, storage, use, transmission, and destruction. Meanwhile, you are obligated to establish necessary user privacy policies in accordance with applicable national/regional laws and regulations to fully protect user personal data. • Committed to product data security, we have implemented necessary measures on product functions to protect system operation and security data throughout its lifecycle in strict accordance with relevant laws, regulations and supervision 2 requirements. As the owner of system operation and security data, you are obligated to establish necessary data security policies and take adequate measures in accordance with applicable national/regional laws and regulations to fully protect system operation and security data. • We will remain committed to the safety of our products and solutions to achieve better customer satisfaction. We have established emergency response procedures and action plans for security vulnerabilities, so that product safety issues can be dealt with in a timely manner. Please contact us for any safety problems found or necessary support on security vulnerabilities when using our products. Disclaimer The purchased products, services and features shall be bound by the contract made between the customer and us. All or part of the products, services and features described herein may not be within your purchase or usage scope. Unless otherwise agreed in the contract, we make no express or implied statement or warranty on the contents herein. Images provided herein are for reference only and may contain information or features that do not apply to your purchased model. This document is only used as a guide. We shall not be liable for any damage, including but not limited to loss of profits, loss of information, interruption of business, personal injury, or any consequential damage incurred before, during, or after the use of our products. We assume you have sufficient knowledge of servers and are well trained in protecting yourself from personal injury or preventing product damage during operation and maintenance. The information in this document is subject to change without notice. We shall not be liable for technical or editorial errors or omissions contained in this document. 3 *Preface* Abstract This document describes the KR2266V2 Intel-based server's appearance, features, performance parameters, and software and hardware compatibility, providing in-depth information of the server. Intended Audience This document is intended for pre-sales engineers. Symbol Conventions The symbols that may be found in this document are defined as follows.
Symbol Description
DANGER A potential for serious injury, or even death if not properly handled
WARNING A potential for minor or moderate injury if not properly handled
CAUTION A potential loss of data or damage to equipment if not properly handled
IMPORTANT Operations or information that requires special attention to ensure successful installation or configuration
NOTE Supplementary description of document information
📷 view source screenshot for verification (page 5) table source p5
Revision History
Version Date Description of Changes
V1.0 2025/04/25 Initial release
📷 view source screenshot for verification (page 5) table source p5
4 Table of Contents 1 Product Overview ... 8 2 Features ... 9 2.1 Scalability and Performance ... 9 2.2 Availability and Serviceability ... 11 2.3 Manageability and Security ... 11 2.4 Energy Efficiency ... 13 3 System Parts Breakdown ... 14 4 System Logical Diagram ... 15 5 Hardware Description ... 16 5.1 Front Panel ... 16 5.2 Rear Panel ... 16 5.2.1 8 × 2.5-Inch Drive Configuration ... 16 5.2.2 4 × 2.5-Inch Drive Configuration ... 17 5.2.3 4 × 2.5-Inch Drive + 2 × OCP 3.0 Card Configuration ... 18 5.2.4 2 × 2.5-Inch Drive Configuration ... 18 5.2.5 2 × 2.5-Inch Drive + 2 × 3.5-Inch Drive Configuration ... 19 5.2.6 2 × 2.5-Inch Drive + 4 × 3.5-Inch Drive Configuration ... 20 5.2.7 8 × E1.S Drive Configuration ... 20 5.3 LEDs and Buttons ... 21 5.4 Port Description ... 24 5.5 Processors ... 24 5.6 Memory ... 25 5.6.1 Identification ... 25 5.6.2 Memory Subsystem Architecture ... 26 5.6.3 Compatibility ... 27 5.6.4 Population Rules ... 28 5.6.5 DIMM Slot Layout ... 29 5.7 Storage ... 30 5.7.1 Drive Configurations ... 30 5.7.2 Drive Numbering ... 31 5.7.3 Drive LEDs ... 33 5.7.4 RAID Cards ... 34 5.8 Network ... 34 5.9 I/O Expansion ... 34 5.9.1 PCIe Expansion Cards ... 34 5.9.2 PCIe Slot Locations ... 35 5 5.9.3 PCIe Riser Modules............................................................................................ 35 5.9.4 PCIe Slot Description ....................................................................................... 37 5.10 PSUs .................................................................................................................... 38 5.11 Fan Modules....................................................................................................... 38 5.12 Boards................................................................................................................. 40 5.12.1 Motherboard................................................................................................... 40 5.12.2 Drive Backplanes ........................................................................................... 41 6 Product Specifications ............................................................................................ 44 6.1 Technical Specifications .................................................................................... 44 6.2 Environmental Specifications .............................................................................. 47 6.3 Physical Specifications ........................................................................................ 48 7 Operating System and Hardware Compatibility ........................................................ 50 7.1 Supported Operating Systems............................................................................... 50 7.2 Hardware Compatibility ........................................................................................ 51 7.2.1 CPU Specifications .......................................................................................... 51 7.2.2 DIMM Specifications ........................................................................................ 52 7.2.3 Drive Specifications .......................................................................................... 52 7.2.4 SAS/RAID Card Specifications ........................................................................... 53 7.2.5 NIC Specifications ............................................................................................ 54 7.2.6 HBA/HCA Card Specifications ............................................................................ 55 7.2.7 PSU Specifications ............................................................................................ 56 8 Regulatory Information ............................................................................................ 58 8.1 Safety..................................................................................................................... 58 8.1.1 General ............................................................................................................. 58 8.1.2 Personal Safety.................................................................................................. 58 8.1.3 Equipment Safety .............................................................................................. 60 8.1.4 Transportation Precautions................................................................................. 61 8.1.5 Manual Handling Weight Limits......................................................................... 61 9 Limited Warranty ..................................................................................................... 62 9.1 Warranty Service .................................................................................................. 62 9.1.1 Remote Technical Support ................................................................................. 62 9.1.2 RMA Service .................................................................................................... 63 9.1.3 ARMA Service.................................................................................................... 63 9.1.4 9 × 5 × NBD Onsite Service .............................................................................. 63 9.1.5 24 × 7 × 4 Onsite Service ................................................................................. 64 9.2 Our Service SLA ................................................................................................... 64 9.3 Warranty Exclusions ............................................................................................ 64 10 System Management .............................................................................................. 66 6 10.1 Intelligent Management System BMC....................................................................66 10.2 KSManage..............................................................................................................69 10.3 KSManage Tools....................................................................................................72 11 Certifications .............................................................................................................73 12 Appendix A..................................................................................................................74 12.1 Operating Temperature Specification Limits......................................................74 12.2 Model......................................................................................................................79 12.3 RAS Features ........................................................................................................80 12.4 Sensor List..............................................................................................................80 13 Appendix B Acronyms and Abbreviations ...............................................................86 7 1 Product Overview The KR2266V2 Intel-based system is a high-density 2U storage server powered by the 4th/5th Gen Intel Xeon Scalable processors (SPR/EMR). It features an innovative three-layer storage that significantly improves storage density, computing power, network bandwidth, and intelligent management. In addition, the balanced and symmetric system architecture provides increased data capacity, larger data throughput, and stronger data processing capabilities, making it suitable for big data, CDN, hyper-convergence, distributed storage, and other application scenarios. Figure 1-1 KR2266V2 Intel-Based System
figure p9
289898989
8
figure p10
2 Features
2.1 Scalability and Performance Table 2-1 Scalability and Performance
Technical Feature Description
Intel Xeon Scalable Processors • SPR: One processor supports up to 60 cores, a max. Turbo frequency of 4.1 GHz, an L3 cache of 112.5 MB, and 4 UPI links at up to 16 GT/s. • EMR: One processor supports up to 64 cores, a max. Turbo frequency of 4.2 GHz, an L3 cache of 320 MB, and 4 UPI links at up to 16 GT/s. - Provides a larger L2 cache with an optimized processor cache hierarchy. - Supports Intel Turbo Boost Technology 2.0 and automatically scales CPU speeds up to the max. Turbo frequency at peak workloads, allowing processor cores to exceed the thermal design power (TDP) for a limited time. - Supports Intel Hyper-Threading Technology, allowing up to 2 threads to run on each core to improve the performance of multi-threaded applications. - Supports Intel Virtualization Technology that provides hardware assist to the virtualization software, allowing the operating system to better use hardware to handle virtualized workloads. - Supports Intel Advanced Vector Extensions 512 (Intel AVX-512), significantly accelerating the workloads that are strongly floating point compute intensive. - Supports Intel DL Boost (VNNI) instructions, improving the performance for deep learning applications.
DIMM Form Factor Up to 16 DDR5 ECC DIMMs [4,800 MT/s (SPR) or 5,600 MT/s (EMR), RDIMMs], delivering superior speed, high availability, and a memory capacity of up to 4 TB.
Flexible Drive Configurations Provides elastic and expandable storage solutions to meet different capacity and upgrade requirements.
📷 view source screenshot for verification (page 10) table source p10
9
Technical Feature Description
• Front: - Up to 24 × 3.5-inch SAS/SATA drive (hot-swap) • Rear: - Configuration 1: Up to 4 × 3.5-inch SAS/SATA drive (hot-swap) + 2 × 2.5-inch SAS/SATA/NVMe drive (hot-swap) - Configuration 2: Up to 8 × 2.5-inch SAS/SATA/NVMe drive (hot-swap) - Configuration 3: Up to 8 × E1.S SSD (hot-swap) • Internal: - Up to 8 × 2.5-inch SAS/SATA drive - 2 × PCIe/SATA M.2 SSD (connected to the onboard M.2 SSD connectors) - 2 × SATA M.2 SSD (expanded through an adapter)
Support for NVMe SSDs Up to 8 hot-swap PCIe 5.0 NVMe SSDs or E1.S SSDs, providing a significantly higher IOPS number over high-end enterprise-class SATA SSDs and boosting storage performance with the ultimate storage I/O.
12 Gbps Serial Attached SCSI (SAS) Doubles the internal storage data transfer rate of 6 Gbps SAS solution, maximizing the performance of storage I/O-intensive applications.
Intel Integrated I/O Technology The processors integrate the PCIe 5.0 controller to significantly reduce I/O latency and enhance overall system performance.
PCIe Expansion Up to 8 PCIe expansion slots, including 6 standard PCIe slots at the rear, 1 OCP 3.0 slot and 1 internal LP PCIe slot (expanded through an MCIO connector), supporting up to PCIe 5.0.
OCP Expansion Supports up to 2 OCP 3.0 cards (1 installed into a dedicated OCP 3.0 slot, and the other expanded through a PCIe slot). The OCP 3.0 slots that can flexibly support 1/10/25/100 Gb OCP 3.0 cards.
📷 view source screenshot for verification (page 11) table source p11
10 2.2 Availability and Serviceability Table 2-2 Availability and Serviceability
Technical Feature Description
Hot-Swap SAS/SATA/NVMe Drives Supports hot-swap drives with RAID levels 0/1/1E/10/5/50/6/60 and RAID cache provided by RAID cards, and data protection enabled by the super-capacitor in case of power failures.
Reliability • The BMC monitors system parameters in real time and sends alerts in advance, enabling technicians to take appropriate measures in time to ensure stable operation and minimize system downtime. • SSDs are much more reliable than traditional HDDs, increasing system uptime.
Availability • The LEDs on front and rear panels and the BMC Web GUI indicate the status of key components and quickly lead technicians to failed (or failing) components, simplifying maintenance and speeding up troubleshooting. • Provides 2 hot-swap PSUs with 1+1 redundancy. • Provides 6 hot-swap fans (6038 fans and 6056 fans), with N+1 redundancy (6056 fans).
Maintenance Efficiency The BMC management network port on the rear panel enables remote BMC O&M, improving O&M efficiency.
📷 view source screenshot for verification (page 12) table source p12
2.3 Manageability and Security Table 2-3 Manageability and Security
Technical Feature Description
Remote Management The BMC monitors system operating status and enables remote management.
NC-SI Feature Allows a network port to serve as a management port and a service port. The NC-SI feature is disabled by default and can be enabled/disabled through the BIOS or BMC. Notes: The service port with NC-SI enabled supports: • Being bonded to any network port of the OCP card or of the PCIe NIC that supports NC-SI.
📷 view source screenshot for verification (page 12) table source p12
11
Technical Feature Description
• Enablement/Disablement and configuration of Virtual Local Area Network (VLAN), which is disabled by default. • Both IPv6 and IPv4 addresses, of which the IP address, subnet mask, and default gateway can be configured, as well as the prefix length of IPv6 address.
Unified Extensible Firmware Interface (UEFI) The industry-standard UEFI improves the efficiency of setup, configuration and update, and simplifies the error handling process.
TPM & TCM Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) provide advanced encryption.
Intel Trusted Execution Technology Intel Trusted Execution Technology provides enhanced security through hardware-based resistance to malicious software attacks.
Firmware Update Mechanism The firmware update mechanism based on digital signatures prevents unauthorized firmware updates.
UEFI Secure Boot Protects the system from malicious bootloaders.
Hierarchical Password Protection in BIOS Ensures system boot and management security.
Dual-Image Mechanism for BMC and BIOS Recovers firmware upon detection of corrupted firmware.
BMC Secure Boot Protects BMC from malicious tampering.
BMC Access Control Policies Flexible BMC access control policies improve BMC management security.
BMC Management Security Supports flexible BMC access control policies and double factor authentication.
Intel SGX Technology Intel Software Guard Extensions (SGX) technology allows applications to run in its own isolated space, helping prevent malicious theft and modification of critical codes and data.
System Secure Erase Function Optional system secure erase function can wipe data on the storage devices with one click.
Chassis Intrusion Detection Enhances physical security.
📷 view source screenshot for verification (page 13) table source p13
12 2.4 Energy Efficiency Table 2-4 Energy Efficiency
Technical Feature Description
80 Plus Platinum/ Titanium PSUs Equipped with 80 Plus Platinum/Titanium PSUs of different power efficiency levels, with a power efficiency of up to 96% at a load of 50%.
1+1 Redundant PSUs Support AC/DC power input with improved power conversion efficiency.
VRD Solution Features the high-efficiency single-board voltage regulator-down (VRD) solution, reducing DC-DC conversion loss.
Intelligent Fan Speed Control and CPU Frequency Scaling Supports Proportional-Integral-Derivative (PID) intelligent fan speed control and intelligent CPU frequency scaling, conserving energy.
System Cooling Design Offers a fully-optimized system cooling design with energy-efficient cooling fans, lowering energy consumption from system cooling.
Power Capping and Power Control Provides power capping and power control measures.
Staggered Spin-up of Drives Supports staggered spin-up of drives, reducing power consumption during server startup.
Intel Intelligent Power Capability Supports Intel Intelligent Power Capability (IIPC) to optimize energy usage in the processor cores by turning computing functions on only when needed.
Low Power Consumption Supports low-voltage 4th/5th Gen Intel Xeon Scalable processors, consuming less energy and meeting the demands of data centers and telecommunications environments constrained by power and thermal limits.
📷 view source screenshot for verification (page 14) table source p14
13 3 System Parts Breakdown
figure p15
NOTE
The exploded view is for reference only. The actual configuration may vary. Figure 3-1 Exploded View
figure p15
(20 15 21 (16 (21) (78)
Item Feature Item Feature
1 Front Drive Backplane 12 OCP 3.0 Card
2 System Air Duct 13 PCIe Riser Module
3 Fan Module 14 Super-Capacitor
4 Top Cover 15 Rear Drive Air Duct
5 PDB 16 Expander Card
6 PSU 17 Motherboard
7 Rear 3.5-Inch Drive 18 DIMM
8 Rear 3.5-Inch Drive Backplane 19 Processor Heatsink Module
9 PCIe Riser Module 20 Chassis
10 Rear 2.5-Inch Drive Backplane 21 Top/Middle/Bottom Drive Drawer
11 Rear 2.5-Inch Drive - -
📷 view source screenshot for verification (page 15) table source p15
14 4 System Logical Diagram Figure 4-1 System Logical Diagram
figure p16
DDR5 DIMM x8 DDR5 DIMM x8 x8x8 РЕЗ PE4 UPIO UPIO UPI x24 UPI1 UPI1 CPUO UP12 UPI x24 UP12 CPU1 UPI3 -UPI x24 UP13 SBLINK<0> PMSYNCO SBLINK<<0> PMDOWN PEO PE1 PE2 PEO x16 x16 DM13.0 SBLINK_PCH x16 Cool Edge PCIE GEN5 x16 Connector +PCIe GEN5 x16 Проемою DMI x4 PCle GENS x16 Cool Edge OCP3.0 Connector PCle GEN5 x16 PCle GENS x16 Connector DRAM NCSI to OCP1&NIC M.2.0 SATA x1/PCIe x4- SATA3:0 DMI[3:0] NCSI to OCPO M.2 1 SATA x1/PCIe x4 - SATA[1133]|| PO[15] PCIe Gen2 x1 R145 PCH -USB 2.0 x BMC Suimine SAS Slimline SAS SATA[19:16] | SMBUS ME AST2600 VGA VGA TAG TAG TACH $9.99 FAN x6 -USB2.0 x1 ▶ Us8213 TF Module Conn eSPI eSP -USB3.0 x CPLD BMC/System Port
• One or two 4th/5th Gen Intel Xeon Scalable processors (SPR/EMR). • Up to 16 DDR5 DIMMs. • 4 UPI links per CPU at up to 16 GT/s per link. • Up to 6 standard PCIe expansion slots at the rear, supporting up to PCIe 5.0, and up to 2 OCP 3.0 slots (1 dedicated OCP 3.0 slot and the other one needs to be expanded through a PCIe riser card). • The RAID card occupies a PCIe expansion slot and is connected to the drive backplane through the SAS signal cable. Multiple local storage specifications are supported through different drive backplanes. • The motherboard integrates Platform Controller Hub (PCH) to support 2 USB 3.0 ports, 2 SATA/PCIe M.2 SSDs, and up to 2 TF cards. • The motherboard integrates an AST2600 management chip and supports 1 VGA port, 1 BMC management network port, 1 system/BMC serial port, 1 TF card slot, and other connectors. 15 5 Hardware Description 5.1 Front Panel Figure 5-1 Front View
figure p17
8 3 4
Item Feature Item Feature
1 Power Button and LED 5 USB Type-C Port
2 Drive Drawer 6 USB Type-C Status LED
3 Drive Label 7 UID/BMC RST Button and LED
4 Ear Latch 8 LEDs
📷 view source screenshot for verification (page 17) table source p17
5.2 Rear Panel
figure p17
NOTE
The rear views herein demonstrate configurations with all drives installed. The actual configuration may vary. 5.2.1 8 × 2.5-Inch Drive Configuration Figure 5-2 Rear View
figure p17
1 2 XXXX BBXXXX XXXX XXXX XX 11109 8 7 6 5 4 3
16
Item Feature Item Feature
1 2.5-Inch Drive Bay 7 BMC Management Network Port
2 PSU 8 System/BMC Serial Port
3 OCP 3.0 Card 0 9 PCIe Slot 0
4 PCIe Slot 3 10 UID/BMC RST Button and LED
5 VGA Port 11 OCP 3.0 Card 0 Hot-Plug Button and LED
6 USB 3.0 Port - -
📷 view source screenshot for verification (page 18) table source p18
5.2.2 4 × 2.5-Inch Drive Configuration Figure 5-3 Rear View
figure p18
1 3 4 5 6 XXXXI XXXX I 14 13 12 11 10 9 8
Item Feature Item Feature
1 PCIe Riser Module 0 8 PCIe Slot 3
2 PCIe Slot 2 9 VGA Port
3 PCIe Slot 1 10 USB 3.0 Port
4 PCIe Slot 0 11 BMC Management Network Port
5 2.5-Inch Drive Bay 12 System/BMC Serial Port
6 PSU 13 UID/BMC RST Button and LED
7 OCP 3.0 Card 0 14 OCP 3.0 Card 0 Hot-Plug Button and LED
📷 view source screenshot for verification (page 18) table source p18
17 5.2.3 4 × 2.5-Inch Drive + 2 × OCP 3.0 Card Configuration Figure 5-4 Rear View
figure p19
2 11 10 9 87 6 5 4 3
Item Feature Item Feature
1 2.5-Inch Drive Bay 7 BMC Management Network Port
2 PSU 8 System/BMC Serial Port
3 OCP 3.0 Card 0 9 UID/BMC RST Button and LED
4 PCIe Slot 3 10 OCP 3.0 Card 0 Hot-Plug Button and LED
5 VGA Port 11 OCP 3.0 Card 1
6 USB 3.0 Port - -
📷 view source screenshot for verification (page 19) table source p19
5.2.4 2 × 2.5-Inch Drive Configuration Figure 5-5 Rear View
figure p19
3 4 6 7 8 9 10 16 15 14 13 12 11
Item Feature Item Feature
1 PCIe Riser Module 0 10 PSU
2 PCIe Slot 2 11 OCP 3.0 Card 0
3 PCIe Slot 1 12 VGA Port
📷 view source screenshot for verification (page 19) table source p19
18
Item Feature Item Feature
4 PCIe Slot 0 13 USB 3.0 Port
5 PCIe Riser Module 1 14 BMC Management Network Port
6 PCIe Slot 5 15 System/BMC Serial Port
7 PCIe Slot 4 16 UID/BMC RST Button and LED
8 PCIe Slot 3 17 OCP 3.0 Card 0 Hot-Plug Button and LED
9 2.5-Inch Drive Bay - -
📷 view source screenshot for verification (page 20) table source p20
5.2.5 2 × 2.5-Inch Drive + 2 × 3.5-Inch Drive Configuration Figure 5-6 Rear View
figure p20
1 3 5 6 14 13 12 11 10 9 8
Item Feature Item Feature
1 PCIe Riser Module 0 8 OCP 3.0 Card 0
2 PCIe Slot 2 9 VGA Port
3 PCIe Slot 1 10 USB 3.0 Port
4 PCIe Slot 0 11 BMC Management Network Port
5 3.5-Inch Drive Bay 12 System/BMC Serial Port
6 2.5-Inch Drive Bay 13 UID/BMC RST Button and LED
7 PSU 14 OCP 3.0 Card 0 Hot-Plug Button and LED
📷 view source screenshot for verification (page 20) table source p20
19 5.2.6 2 × 2.5-Inch Drive + 4 × 3.5-Inch Drive Configuration Figure 5-7 Rear View
figure p21
3 XXX XXX 10 9 6 5 4
Item Feature Item Feature
1 3.5-Inch Drive Bay 6 USB 3.0 Port
2 2.5-Inch Drive Bay 7 BMC Management Network Port
3 PSU 8 System/BMC Serial Port
4 OCP 3.0 Card 0 9 UID/BMC RST Button and LED
5 VGA Port 10 OCP 3.0 Card 0 Hot-Plug Button and LED
📷 view source screenshot for verification (page 21) table source p21
5.2.7 8 × E1.S Drive Configuration Figure 5-8 Rear View
figure p21
2 3 4 6 13 12 11 10 9 8 7
Item Feature Item Feature
1 PCIe Riser Module 0 8 VGA Port
2 PCIe Slot 2 9 USB 3.0 Port
3 PCIe Slot 1 10 BMC Management Network Port
📷 view source screenshot for verification (page 21) table source p21
20
Item Feature Item Feature
4 PCIe Slot 0 11 System/BMC Serial Port
5 E1.S SSD 12 UID/BMC RST Button and LED
6 PSU 13 OCP 3.0 Card 0 Hot-Plug Button and LED
7 OCP 3.0 Card 0 - -
📷 view source screenshot for verification (page 22) table source p22
5.3 LEDs and Buttons Table 5-1 LED and Button Description
Item Icon Feature Description
1 [power-button-icon] Power Button and LED • Power LED: - Off = No power - Solid green = Power-on state - Solid orange = Standby state • Power button: - Press and release the button to power on the system from the standby state. - Press and hold the button for 6 seconds to force a shutdown from the power-on state.
2 [system-status-icon] System Status LED • Off = Normal • Blinking red (1 Hz) = A warning error is detected on CPU, memory, power supply, drive, fan, etc. • Solid red = A critical error is detected on CPU, memory, power supply, drive, fan, etc.
3 [fan-icon] Fan Status LED • Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs, including fan failure and fan absence
📷 view source screenshot for verification (page 22) table source p22
21
Item Icon Feature Description
4 [icon-power] Power Status LED • Off = Normal • Blinking red (1 Hz) = A warning error occurs • Solid red = A critical error occurs
5 [icon-drawer] Drive Drawer Status LED • Off = Normal • Solid red = A failure occurs Note: [icon-drawer-top], [icon-drawer-middle], and [icon-drawer-bottom] denote the top, middle, and bottom drive drawers, respectively.
6 [icon-uid] UID/BMC RST Button and LED • UID/BMC RST LED: - Solid blue = The UID LED is activated by the UID button or via the BMC - Gradually turning blue within 2 seconds and then gradually turning off within 2 seconds = PFR authentication in progress (Note: The server can be powered on only after this LED turns off.) - Blinking blue (4 Hz) = PFR authentication fails and the firmware images cannot be recovered • UID/BMC RST button: - Press and release the button to activate the UID LED. - Press and hold the button for 6 seconds to force a BMC reset.
7 - USB Type-C Status LED • Connected to a terminal: - Off = Not connected to a terminal - Blinking green (2 Hz) for 3 seconds and then off = Port function is disabled - Solid green = Connected to a terminal • Connected to a USB storage device:
📷 view source screenshot for verification (page 23) table source p23
22
Item Icon Feature Description
- Off = Not connected to a USB storage device - Blinking red (1 Hz) = Job fails or is completed with an error reported - Blinking green (2 Hz) = Job in progress - Blinking green (2 Hz) 5 times and then off = Port function is disabled - Solid green = Job is completed successfully
8 - OCP 3.0 Card 0 Hot-Plug Button and LED • OCP 3.0 card hot-plug LED: - Off = OCP card is powered off - Blinking green = OCP card is getting ready for hot-plugging or OCP card is identified after being inserted - Solid green = OCP card is powered on • OCP 3.0 card hot-plug button: - With the LED solid on, press and release the button to power off the OCP card. - With the LED off and the OCP card installed, press and release the button to power on the OCP card. Notes: • Press and release the button before removing or powering on the OCP card. • When the LED is off, the OCP card can be removed. (The OCP card can be removed only when the LED is off.) • The LED blinking frequency may vary with different brands and models.
📷 view source screenshot for verification (page 24) table source p24
23 5.4 Port Description Table 5-2 Port Description
Item Port Description
1 VGA Port Enables you to connect a display terminal to the system.
2 USB 3.0 Port Enables you to connect a USB device to the system.
3 USB Type-C Port Enables you to read a USB flash drive through the BMC or access the BMC through an external device. • Connected to a USB device: For automatic log copying to the USB device and automatic configuration importing to the BMC. • Connected to a terminal (PC or phone): For system monitoring and BMC local O&M.
4 System/BMC Serial Port • BMC serial port: Enables you to print BMC logs and debug the BMC. • System serial port: Enables you to print system logs.
5 BMC Management Network Port Enables you to manage the server. Note: It is a Gigabit Ethernet port that supports 100 Mbps and 1,000 Mbps auto-negotiation.
6 OCP 3.0 Network Port Enables you to connect the system to the network.
7 PCIe NIC Port Enables you to connect the system to the network.
📷 view source screenshot for verification (page 25) table source p25
5.5 Processors • Supports one or two Intel Xeon Scalable processors. • If only 1 processor is configured, install it in the CPU0 socket. • The processors used in a server must be the same model. • For specific processor options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 24 Figure 5-9 Processor Locations
figure p26
CPU 1 CPU O
5.6 Memory 5.6.1 Identification To determine DIMM characteristics, refer to the label attached to the DIMM and the following figure and table. Figure 5-10 DIMM Identification
figure p26
1 23 4 5 6 7 16GB 1R x8 PC5-4800 B - RXX 16GB 1Rx8 PCS-48008-RXX CE
Item Description Example
1 Capacity • 16 GB • 32 GB • 64 GB
📷 view source screenshot for verification (page 26) table source p26
25
Item Description Example
• 128 GB • 256 GB
2 Rank(s) • 1R = Single rank • 2R = Dual rank • 2S2R = Two ranks of two high stacked 3DS DRAM • 2S4R = Four ranks of two high stacked 3DS DRAM • 4R = Quad rank
3 Data width of DRAM • x4 = 4 bits • x8 = 8 bits
4 DIMM slot type PC5 = DDR5
5 Maximum memory speed • 4,800 MT/s • 5,600 MT/s • 6,400 MT/s
6 CAS latency • SDP 4800B = 40-39-39 • 3DS 4800B = 46-39-39 • SDP 5600B = 46-45-45 • 3DS 5600B = 52-45-45
7 DIMM type R = RDIMM
📷 view source screenshot for verification (page 27) table source p27
5.6.2 Memory Subsystem Architecture The server supports 16 DIMM slots and 8 memory channels per CPU. Table 5-3 DIMM Slot List
CPU Channel ID Silk Screen
CPU0 Channel 0 CPU0_C0D0
Channel 1 CPU0_C1D0
Channel 2 CPU0_C2D0
Channel 3 CPU0_C3D0
Channel 4 CPU0_C4D0
Channel 5 CPU0_C5D0
Channel 6 CPU0_C6D0
📷 view source screenshot for verification (page 27) table source p27
26
CPU Channel ID Silk Screen
Channel 7 CPU0_C7D0
CPU1 Channel 0 CPU1_C0D0
Channel 1 CPU1_C1D0
Channel 2 CPU1_C2D0
Channel 3 CPU1_C3D0
Channel 4 CPU1_C4D0
Channel 5 CPU1_C5D0
Channel 6 CPU1_C6D0
Channel 7 CPU1_C7D0
📷 view source screenshot for verification (page 28) table source p28
5.6.3 Compatibility Refer to the following rules to configure the DDR5 DIMMs. IMPORTANT • A server must use DDR5 DIMMs with the same part number (P/N code). All DDR5 DIMMs operate at the same speed, which is the lowest of: - Memory speed supported by a specific CPU. - Maximum operating speed of a specific memory configuration. • Mixing DDR5 DIMMs of different specifications (capacity, bit width, rank, height, etc.) is not supported. • For specific memory options, consult your local sales representative or refer to 7.2 Hardware Compatibility. • DDR5 DIMMs can be used with the 4th/5th Gen Intel Xeon Scalable processors (SPR/EMR). The maximum memory capacity supported is identical for different CPU models. • The maximum number of DIMMs supported varies with the CPU type, DIMM type and rank quantity. NOTE Maximum number of DIMMs supported per channel ≤ Maximum number of ranks supported per channel ÷ Number of ranks per DIMM. 27 Table 5-4 DDR5 DIMM Specifications
Item Value
Capacity per DDR5 DIMM (GB) 16 32 64 128
Type RDIMM RDIMM RDIMM RDIMM
Rated speed (MT/s) SPR: 4,800 EMR: 5,600 SPR: 4,800 EMR: 5,600 SPR: 4,800 EMR: 5,600 SPR: 4,800 EMR: 5,600
Operating voltage (V) 1.1 1.1 1.1 1.1
Maximum number of DDR5 DIMMs supported in a servera 16 16 16 16
Maximum capacity of DDR5 DIMMs supported in a server 256 512 1,024 2,048
Actual speed (MT/s) 1 DPCc SPR: 4,800 EMR: 5,600 SPR: 4,800 EMR: 5,600 SPR: 4,800 EMR: 5,600 SPR: 4,800 EMR: 5,600
📷 view source screenshot for verification (page 29) table source p29
Notes: - a: The maximum number of DDR5 DIMMs supported is based on the dual-CPU configuration. The number is halved for the single-CPU configuration. - b: It indicates the maximum memory capacity supported when all the DIMM slots are populated with DDR5 DIMMs. The maximum DDR5 capacity varies with the CPU type. - c: DIMM Per Channel (DPC) is the number of DIMMs per memory channel. - The information above is for reference only. Consult your local sales representative for details. 5.6.4 Population Rules General population rules for DDR5 DIMMs: • Install DIMMs only when the corresponding processor is installed. • Install dummies in the empty DIMM slots. Population rules for DDR5 DIMMs in specific modes: • Memory sparing mode - Follow the general population rules. - Each channel must have a valid online spare configuration. - Each channel can have a different online spare configuration. - Each channel with a DIMM installed must have a spare rank. • Memory mirroring mode - Follow the general population rules. 28 - Each processor supports 4 integrated memory controllers (iMCs). Each iMC has 2 channels to be populated with DIMMs. Installed DIMMs must be of the same capacity and organization. - In a multi-processor configuration, each processor must have a valid memory mirroring configuration. 5.6.5 DIMM Slot Layout Up to 16 DDR5 DIMMs can be installed in a server, and a balanced DIMM configuration is recommended for optimal memory performance. DIMM configuration must be compliant with the DIMM population rules. Figure 5-11 DIMM Slot Layout
figure p30
CPUO C7D0 CPU0 C6D0 CPUO_C5DO CPU0_C4D0 CPU O CPUO_CODO CPU_C1DO CPUO C2DO CPUO C3D0 CPU1 C7DO CPU1 C6D0 CPU1_C5DO CPUT_C4D0 CPU 1 CPU1_CODO CPU1 C1D0 CPU1_C2DO CPU1_C3D0
Table 5-5 DDR5 DIMM Population Rules (Single-CPU Configuration)
DDR5 QTY CPU0
C0D0 C1D0 C2D0 C3D0 C4D0 C5D0 C6D0 C7D0
1 ●
2 ● ●
4 ● ● ● ●
6 ● ● ● ● ● ●
8 ● ● ● ● ● ● ● ●
📷 view source screenshot for verification (page 30) table source p30
Table 5-6 DDR5 DIMM Population Rules (Dual-CPU Configuration)
DDR5 QTY CPU0 CPU1
C0D0 C1D0 C2D0 C3D0 C4D0 C5D0 C6D0 C7D0 C0D0 C1D0 C2D0 C3D0 C4D0 C5D0 C6D0 C7D0
2 ● ●
4 ● ● ● ●
8 ● ● ● ● ● ● ● ●
12 ● ● ● ● ● ● ● ● ● ● ● ●
16 ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●
📷 view source screenshot for verification (page 30) table source p30
29 5.7 Storage
figure p31
NOTE
For the physical drive No. of each configuration, refer to 5.7.2 Drive Numbering. 5.7.1 Drive Configurations Table 5-7 Drive Configurations
Front Drives Rear Drives Internal Drives Drive Management Mode
24 × 3.5-Inch drive (Drive bays with physical drive No. 0 to 24 support SAS/SATA drives only) 8 × 2.5-inch NVMe drive N/A • SAS/SATA drive: PCIe RAID card + expander card • NVMe drive: CPU
4 × 2.5-inch NVMe drive + 4 × 2.5-inch SAS/SATA drive N/A • SAS/SATA drive: PCIe RAID card + expander card • NVMe drive: CPU/PCIe RAID card
4 × 2.5-inch NVMe drive N/A • SAS/SATA drive: PCIe RAID card + expander card • NVMe drive: CPU/PCIe RAID card
2 × 2.5-inch NVMe drive + 2 × 2.5-inch SAS/SATA drive N/A • SAS/SATA drive: PCIe RAID card + expander card • NVMe drive: CPU
2 × 2.5-inch NVMe drive + 2 × 2.5-inch SAS/SATA drive (system drive) N/A • SAS/SATA drive: PCIe RAID card + expander card + PCIe RAID card (for system drives) • NVMe drive: CPU
4 × 2.5-inch SAS/SATA drive N/A SAS/SATA drive: PCIe RAID card + expander card
📷 view source screenshot for verification (page 31) table source p31
30
Front Drives Rear Drives Internal Drives Drive Management Mode
2 × 2.5-inch NVMe drive N/A • SAS/SATA drive: PCIe RAID card + expander card • NVMe drive: CPU
2 × 2.5-inch SAS/SATA drive N/A SAS/SATA drive: PCIe RAID card + expander card
2 × 3.5-inch SAS/SATA drive + 2 × 2.5-inch SAS/SATA drive N/A SAS/SATA drive: PCIe RAID card + expander card
4 × 3.5-inch SAS/SATA drive + 2 × 2.5-inch SAS/SATA drive N/A • 3.5-inch SAS/SATA drive: PCIe RAID card + expander card • 2.5-inch SAS/SATA drive: PCH
8 × E1.S SSD N/A • SAS/SATA drive: PCIe RAID card + expander card • E1.S SSD: CPU
4 × 2.5-inch SAS/SATA drive 8 × 2.5-inch SAS/SATA drive SAS/SATA drive: PCIe RAID card + expander card
4 × 3.5-inch SAS/SATA drive + 2 × 2.5-inch SAS/SATA drive 8 × 2.5-inch SAS/SATA drive SAS/SATA drive: PCIe RAID card + expander card
📷 view source screenshot for verification (page 32) table source p32
5.7.2 Drive Numbering • 24 × 3.5-Inch SAS/SATA Drive Configuration Figure 5-12 Drive Numbering
figure p32
0~7 CR 2626262 8~15 16~23
31
Physical Drive No. Drive No. Identified by the BMC Drive Number Identified by an 8i RAID Card and an Expander Card
0 0 0
1 1 1
2 2 2
3 3 3
4 4 4
5 5 5
6 6 6
7 7 7
8 8 8
9 9 9
10 10 10
11 11 11
12 12 12
13 13 13
14 14 14
15 15 15
16 16 16
17 17 17
18 18 18
19 19 19
20 20 20
21 21 21
22 22 22
23 23 23
📷 view source screenshot for verification (page 33) table source p33
32 5.7.3 Drive LEDs 1. SAS/SATA Drive LEDs Figure5-13 SAS/SATA Drive LEDs ![figure](images/reducto/p034_figure_0297.jpg)
Activity LED (①) Locator/Error LED (②) Description
Green Blue Red
Off Off RAID created RAID not created Drive absent
Solid on Off
Solid on Off Off Drive present but not in use
Blinking (4 Hz) Off Off Drive present and in use
Blinking (4 Hz) Solid pink Copyback/Rebuild in progress
Solid on Solid on Off Drive selected but not in use
Blinking (4 Hz) Solid on Off Drive selected and in use
Off Solid on Off Drive is selected but fails
Any status Off Solid on Drive fails
📷 view source screenshot for verification (page 34) table source p34
2. NVMe Drive LEDs Figure 5-14 NVMe Drive LEDs ![figure](images/reducto/p034_figure_0301.jpg) When the VMD function is enabled and the latest VMD driver is installed, the NVMe drives support surprise hot swap, and the LEDs can be lit up. 33 Table 5-8 NVMe Drive LED Description
Activity LED (①) Locator/Error LED (②) Description
Green Blue Red
Off Off Off Drive absent
Solid on Off Off Drive present but not in use
Blinking (4 Hz) Off Off Drive present and in use
Blinking (4 Hz) Solid pink Copyback/Rebuild/Initializing/ Verifying in progress
Solid on Solid on Off Drive selected but not in use
Blinking (4 Hz) Solid on Off Drive selected and in use
Off Solid on Off Drive is selected but fails
Any status Off Solid on Drive fails
📷 view source screenshot for verification (page 35) table source p35
5.7.4 RAID Cards The RAID card provides functions such as RAID configuration, RAID level migration, and drive roaming. For specific RAID card options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 5.8 Network NICs provide network expansion capabilities. • The OCP slots support OCP 3.0 cards. Users can select the OCP 3.0 cards as needed. • The PCIe expansion slots support PCIe NICs. Users can select the PCIe cards as needed. • For specific NIC options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 5.9 I/O Expansion 5.9.1 PCIe Expansion Cards PCIe expansion cards provide system expansion capabilities. • Up to 6 standard PCIe expansion slots at the rear, including 2 PCIe 5.0 x16 slots. ● 1 dedicated slot for the OCP 3.0 card at the rear. 34 • 1 OCP 3.0 card expanded through a PCIe slot at the rear. • 1 internal LP PCIe slot (expanded through an MCIO connector). • For specific PCIe expansion card options, consult your local sales representative or refer to 7.2 Hardware Compatibility. 5.9.2 PCIe Slot Locations • 3-Slot PCIe Riser Modules Figure 5-15 PCIe Slots
figure p36
Slot 2 Slot 5 XXXI Slot 1 Slot 4 Slot 0 Slot 3
- Slot 0, slot 1, and slot 2 reside in PCIe riser module 0. - Slot 3, slot 4, and slot 5 reside in PCIe riser module 1. • 1-Slot PCIe Riser Modules Figure 5-16 PCIe Slots
figure p36
XXXXL XXXX XXXX XXXX XXXX XXXX XXXX XXXX Slot 0 Slot 3 PCS
- Slot 0 resides in PCIe riser module 2. - Slot 3 resides in PCIe riser module 3. 5.9.3 PCIe Riser Modules • PCIe Riser Module 0 35 Figure 5-17 PCIe Riser Module 0 (2 × PCIe x8 Slot + 1 × PCIe x16 Slot)
figure p37
Slot 0 Slot 1 Slot 2
• PCIe Riser Module 1 (2 × PCIe x8 Slot + 1 × PCIe x16 Slot) Figure 5-18 PCIe Riser Module 1
figure p37
Slot 3 Slot 4 Slot 5 サ
• PCIe Riser Module 2 Figure 5-19 PCIe Riser Module 2 (1 × PCIe x8 Slot)
figure p37
Slot 0
36 • PCIe Riser Module 3 Figure 5-20 PCIe Riser Module 3 (1 × PCIe x8 Slot)
figure p38
Slot 3
5.9.4 PCIe Slot Description
figure p38
NOTE
When CPU1 is absent, the corresponding PCIe slots are not available. Table 5-9 PCIe Slot Description
PCIe Slot Owner PCIe Standard Connector Width Bus Width Form Factor
Slot 0 CPU1 PCIe 4.0 x8 x8 FHHL
Slot 1 CPU1 PCIe 4.0 x8 x8 FHHL
Slot 2 CPU1 PCIe 5.0 x16 x16 FHFL
Slot 3 CPU0 PCIe 4.0 x8 x8 FHHL
Slot 4 CPU0 PCIe 5.0 x16 x16 FHFL
Slot 5 CPU0 PCIe 4.0 x8 x8 FHHL
📷 view source screenshot for verification (page 38) table source p38
37
PCIe Slot Owner PCIe Standard Connector Width Bus Width Form Factor
OCP 3.0 Slot CPU0 PCIe 3.0 x16 x16 SFF OCP 3.0
*Internal LP PCIe Slot CPU0 PCIe 4.0 x8 x8 HHHL
📷 view source screenshot for verification (page 39) table source p39
NOTE The internal LP PCIe slot is expanded through an MCIO connector. For details, contact your local sales representative. 5.10 PSUs • The server supports 1 or 2 PSUs. • The server supports AC or DC power input. • The PSUs are hot-swappable. • The server supports 2 PSUs in 1+1 redundancy. • The server must use PSUs with the same part number (P/N code). • The PSUs provide short circuit protection. Figure 5-21 PSU Locations
figure p39
PSU 0 PSU 1
5.11 Fan Modules • The server supports 6 fan modules. Users can select 6038 and 6056 fans based on the configuration. • The fan modules are hot-swappable. 38 • The 6056 fans support N+1 redundancy, which means that the server can continue working properly when a single fan fails. • The server supports intelligent fan speed control. • The server must use fan modules with the same part number (P/N code). Figure 5-22 Fan Module Locations
figure p40
FAN Modules
39 5.12 Boards 5.12.1 Motherboard Figure 5-23 Motherboard
figure p41
CPU1 C3D0 CPU1 C2D0 CPU1 C1DO CPU1_CODO FANS 35 CPU1 34 33 32 FAN4 31 CPUT CADO O 30 CPU1_C5DO CPU1 C6D0 CPU1_C7D0 29 CPUO C3D0 CPU0_C2D0 28 CPUO_C1DO FAN3 CPUO_CODO 27 26 CPUO -FAN2 - - -00 ล CPUD CADO CPUO C5D0 CPU: C6D) -FAN1 CPUO C7D0 14 18 17 16 -FANO 15
Item Feature Item Feature
1 PCIe Riser Power Connector (CPU1) 19 OCP 3.0 Card 0 Connector
2 PCIe Riser Signal Connector (CPU1) 20 VPP Connector
3 M.2 SSD Connector 21 M.2 Adapter Connector
4 SATA Connector 22 PCIe Riser Signal Connector (CPU0)
5 NC-SI Connector 23 LP Riser Connector
6 Intrusion Detection Connector 24 System TF Card Adapter Connector
📷 view source screenshot for verification (page 41) table source p41
40
Item Feature Item Feature
7 Bottom Drive Drawer Pull Sensing Connector 25 PCIe Riser Power Connector (CPU0)
8 MCIO x8 Connector (CPU1) 26 VGA Port
9 Middle Drive Drawer Pull Sensing Connector 27 BMC TF Card Connector
10 Top Drive Drawer Pull Sensing Connector 28 USB 3.0 Port
11 MCIO x8 Connector (CPU0) 29 BMC Management Network Port
12 Left Control Panel Connector 30 System/BMC Serial Port
13 Front Drive BP I2C Connector 31 Button Cell Battery Socket
14 Power Connector 32 CMOS Jumper
15 PDB Connector 33 TPM/TCM Connector
16 Smart NIC UART Connector 34 UID/BMC RST Button and LED
17 RAID Key Connector 35 OCP 3.0 Card 0 Hot-Plug Button and LED
18 I2C Connector (for front and rear drive backplanes and expander card) - -
📷 view source screenshot for verification (page 42) table source p42
5.12.2 Drive Backplanes 1. Front Drive Backplane • 8 × 3.5-Inch SAS/SATA Drive Backplane Figure 5-24 8 × 3.5-Inch SAS/SATA Drive Backplane
figure p42
1 1 1 1
Item Feature Item Feature
1 SAS Connector 2 Gen-Z Connector
📷 view source screenshot for verification (page 42) table source p42
41 2. Rear Drive Backplanes • 8 x 2.5-Inch SAS/SATA/NVMe Drive Backplane Figure 5-25 8 × 2.5-Inch SAS/SATA/NVMe Drive Backplane
figure p43
1 232 2324 5
Item Feature Item Feature
1 Power Connector 4 I2C Connector
2 MCIO x8 Connector 5 VPP Connector
3 SAS Connector - -
📷 view source screenshot for verification (page 43) table source p43
• 2 × 2.5-Inch SAS/SATA/NVMe Drive Backplane Figure 5-26 2 × 2.5-Inch SAS/SATA/NVMe Drive Backplane
figure p43
2 4 3
Item Feature Item Feature
1 I2C Connector 3 MCIO x8 Connector
2 VPP Connector 4 Power Connector
📷 view source screenshot for verification (page 43) table source p43
• 2 × 2.5-Inch SAS/SATA Drive Backplane 42 Figure 5-27 2 × 2.5-Inch SAS/SATA Drive Backplane
figure p44
1 3 2
Item Feature Item Feature
1 I2C Connector 3 Power Connector
2 SAS Connector - -
📷 view source screenshot for verification (page 44) table source p44
• 2 × 3.5-Inch SAS/SATA Drive Backplane Figure 5-28 2 × 3.5-Inch SAS/SATA Drive Backplane ![figure](images/reducto/p044_figure_0426.jpg)
Item Feature Item Feature
1 SAS Connector 3 Power Connector
2 I2C Connector - -
📷 view source screenshot for verification (page 44) table source p44
43 6 Product Specifications 6.1 Technical Specifications Table 6-1 Technical Specifications
Item Description
Form Factor 2U rack server
Chipset Intel Emmitsburg
Processor Supports 1 or 2 processors. • 4th/5th Gen Intel Xeon Scalable processors (SPR/EMR) • Integrated memory controllers and 8 memory channels per processor • Integrated PCIe 5.0 controllers and 80 PCIe lanes per processor • 4 UPI links per CPU at up to 16 GT/s per link • Up to 60 cores (SPR) or 64 cores (EMR) per CPU • Max. Turbo frequency of 4.1 GHz (SPR) or 4.2 GHz (EMR) • L3 cache up to 112.5 MB (SPR) or 320 MB (EMR) per CPU • TDP up to 350 W Note: The information above is for reference only. See 7.2 Hardware Compatibility for details.
Memory Supports up to 16 DDR5 DIMMs. • RDIMMs supported • Up to 4,800 MT/s (SPR) or 5,600 MT/s (EMR) • Mixing DDR5 DIMMs of different specifications (capacity, bit width, rank, height, etc.) is not supported. • A server must use DDR5 DIMMs with the same part number (P/N code). Note: The information above is for reference only. See 7.2 Hardware Compatibility for details.
Storage Supports multiple drive configurations. See 5.7.1 Drive Configurations for details. • Front: - Up to 24 × 3.5-inch SAS/SATA drive (hot-swap) • Rear:
📷 view source screenshot for verification (page 45) table source p45
44
Item Description
- Configuration 1: Up to 4 × 3.5-inch SAS/SATA drive (hot-swap) + 2 × 2.5-inch SAS/SATA/NVMe drive (hot-swap) - Configuration 2: Up to 8 × 2.5-inch SAS/SATA/NVMe drive (hot-swap) - Configuration 3: Up to 8 × E1.S SSD (hot-swap) • Internal: - Up to 8 × 2.5-inch SAS/SATA drive - 2 × PCIe/SATA M.2 SSD (connected to the onboard M.2 SSD connectors) - 2 × SATA M.2 SSD (expanded through an adapter) - When the server is configured with an SND 9230 RAID card, the M.2 SSDs support RAID configuration. Notes: • It is recommended that the M.2 SSD be only used as a boot device for installing the OS. • The M.2 SSD has low endurance and cannot be used as a data storage device, especially in scenarios with frequent data erasing and re-writing. The reason is that write limits can be reached within a short period of time, which will result in damage and unavailability. • For data storage, use enterprise-class HDDs or SSDs with higher DWPD. • Write-intensive business software will cause the M.2 SSD to reach write endurance and wear out; therefore, the M.2 SSD is not recommended for such business scenarios. • Do not use the M.2 SSD as caching. • Supports multiple models of RAID cards. See 7.2 Hardware Compatibility for details. • RAID cards provide functions such as RAID configuration, RAID level migration, and disk roaming. • RAID cards support power failure protection enabled by the super-capacitor to protect user data. • A PCIe RAID card occupies 1 PCIe slot.
Network Supports multiple network expansion configurations. • OCP 3.0 card - 1 hot-swap OCP 3.0 card installed in the OCP 3.0 slot - 1 OCP 3.0 card expanded through a PCIe slot • Standard PCIe NICs that can be selected as needed
I/O Expansion Supports up to 8 PCIe expansion slots, including 6 standard PCIe slots at the rear, 1 OCP 3.0 slot and 1 internal LP PCIe slot (expanded through an MCIO connector), supporting up to PCIe 5.0. For details, see 5.9.2 PCIe Slot Locations and 5.9.4 PCIe Slot Description.
📷 view source screenshot for verification (page 46) table source p46
45
Item Description
Port • Front: - 1 × USB type-C port • Rear: - 2 × USB 3.0 port - 1 × VGA port - 1 × system/BMC serial port - 1 × BMC management network port Note: OS installation on the USB storage media is not recommended.
Display Integrated VGA on the motherboard with a video memory of 64 MB and a maximum 16M color resolution of 1,920 × 1,200 at 60 Hz Notes: • The integrated VGA can support a maximum resolution of 1,920 × 1,200 only when the video driver matching the OS version is installed; otherwise, only the default resolution of the OS is supported. • When the front and rear VGA ports are both connected to monitors, only the monitor connected to the front VGA port works.
System Management • UEFI • BMC • NC-SI • KSManage
Security • Intel Platform Firmware Resilience (PFR) • Trusted Platform Module (TPM) 2.0 and Trusted Cryptography Module (TCM) • Intel Trusted Execution Technology • Firmware update mechanism based on digital signatures • UEFI Secure Boot • Hierarchical BIOS password protection • BIOS Secure Flash and BIOS Lock Enable (BLE) • BMC and BIOS dual-image mechanism • Chassis intrusion detection
📷 view source screenshot for verification (page 47) table source p47
46 6.2 Environmental Specifications Table 6-2 Environmental Specifications
Item Description
Temperature1,2,3 • Operating: 5°C to 45°C (41°F to 113°F) • Storage (packed): -40°C to 70°C (-40°F to 158°F) • Storage (unpacked): -40°C to 55°C (-40°F to 131°F)
Relative Humidity (RH, non-condensing) • Operating: 10% to 90% RH • Storage (packed): 10% to 93% RH • Storage (unpacked): 10% to 93% RH
Operating Altitude ≤3,050 m (10,007 ft)
Corrosive Gaseous Contaminants Maximum growth rate of corrosion film thickness: • Copper coupon: 300 Å/month (compliant with the gaseous corrosivity level of G1 defined in ANSI/ISA-71.04-2013) • Silver coupon: 200 Å/month (compliant with the gaseous corrosivity level of G1 defined in ANSI/ISA-71.04-2013)
Acoustic Noise4,5,6 Noise emissions are measured in accordance with ISO 7779 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109). Listed are the declared A-weighted sound power levels (LWAd) and the declared average bystander position A-weighted sound pressure levels (LpAm) at a server operating temperature of 23°C (73.4°F): • Idle: - LWAd: 6.9 B - LpAm: 60.7 dBA • Operating: - LWAd: 7.7 B - LpAm: 64.5 dBA
📷 view source screenshot for verification (page 48) table source p48
Notes: 1. Not all configurations support the operating temperature range of 5°C to 45°C (41°F to 113°F). The 1U heatsink configuration supports an operating temperature range of 10°C to 40°C (50°F to 104°F). 2. Standard operating temperature - 10°C to 35°C (50°F to 95°F) is the standard operating temperature range at sea level. At the altitude of 0 to 3,050 m (0 to 10,007 ft), derate the maximum allowable temperature by 1°C per 305 m (1°F per 556 ft). The maximum temperature gradient is 20°C/h (36°F/h), varying 47 with server configuration. - Any fan failure or operations above 30°C (86°F) may lead to system performance degradation. 3. Expanded operating temperature: - For some configurations, the supported system inlet ambient temperature can be expanded to 5°C to 10°C (41°F to 50°F) and 35°C to 40°C (95°F to 104°F) at sea level. At an altitude of 0 to 950 m (0 to 3,117 ft), derate the maximum allowable operating temperature by 1°C per 305 m (1°F per 556 ft). At an altitude of 950 to 3,050 m (3,117 to 10,007 ft), derate the maximum allowable operating temperature by 1°C per 175 m (1°F per 319 ft). - For some configurations, the supported system inlet ambient temperature can be expanded to 40°C to 45°C (104°F to 113°F) at sea level. At an altitude of 0 to 950 m (0 to 3,117 ft), derate the maximum allowable operating temperature by 1°C per 305 m (1°F per 556 ft). At an altitude of 950 to 3,050 m (3,117 to 10,007 ft), derate the maximum allowable operating temperature by 1°C per 125 m (1°F per 228 ft). - Any fan failure or operations under expanded operating temperature may lead to system performance degradation. 4. This document lists the LWAd and LpAm of the product at a 23°C (73.4°F) ambient environment. All measurements are conducted in conformance with ISO 7779 (ECMA 74) and declared in conformance with ISO 9296 (ECMA 109). Contact your sales representative for more information. 5. The sound levels shown here were measured based on the specific configurations of a server. Sound levels vary by server configurations, loads and ambient temperature. These values are for reference only and subject to change without notice. 6. Product conformance to cited normative standards is based on sample testing, evaluation, or assessment. This product or family of products is eligible to bear the appropriate compliance logos and statements. 6.3 Physical Specifications Table 6-3 Physical Specifications
Item Description
Outer Packaging Dimensions (L × W × H) 1,168 × 721 × 279 mm (45.98 × 28.39 × 10.98 in.)
Installation Dimension Requirements • Installation requirements for the cabinet are as follows: - General cabinet compliant with the International Electrotechnical Commission 297 (IEC 297) standard - Width: 482.6 mm (19 in.) - Depth: Above 1,000 mm (39.37 in.) • Installation requirements for the server rails are as follows: - Static rail kit: The distance between the front and rear mounting flanges ranges from 650 to 910 mm (25.59 to 35.83 in.)
📷 view source screenshot for verification (page 49) table source p49
48
Item Description
- Ball-bearing rail kit: The distance between the front and rear mounting flanges ranges from 650 to 910 mm (25.59 to 35.83 in.)
Weight 24 × 3.5-inch drive configuration: • Net weight: 49.2 kg (108.47 lbs) • Gross weight: 58 kg (127.87 lbs) (including server, packaging box, rails and accessory box) Note: The server weight varies by configuration.
📷 view source screenshot for verification (page 50) table source p50
Figure 6-1 Chassis Dimensions
figure p50
Zc Zb Za Xa Xb Ya
Model Za Zb Zc Xa Xb Ya
KR2266-X2-A0-R0-00 866 mm (34.09 in.) 892.6 mm (35.14 in.) 29 mm (1.14 in.) 482 mm (18.98 in.) 447 mm (17.60 in.) 87 mm (3.43 in.)
📷 view source screenshot for verification (page 50) table source p50
49 7 Operating System and Hardware Compatibility This section describes the OS and hardware compatibility of the server. For the latest compatibility configuration and the component models not listed in this document, contact your local sales representative. IMPORTANT • Using incompatible components may cause the server to work abnormally, and such failures are not covered by technical support or warranty. • The server performance is strongly influenced by application software, middleware and hardware. The subtle differences in them may lead to performance variation in the application and test software. - For requirements on the performance of specific application software, contact your sales representatives to confirm the detailed hardware and software configurations during the pre-sales phase. - For requirements on hardware performance consistency, define specific configuration requirements (for example, specific drive models, RAID cards, or firmware versions) during the pre-sales phase. 7.1 Supported Operating Systems Table 7-1 Supported Operating Systems OS Version Windows Server 2019 Windows Server 2022 SUSE Linux Enterprise Server 15 SP4 Red Hat Enterprise Linux 8.6 Red Hat Enterprise Linux 9.0 Ubuntu 20.04 UOS V20 ICS 6.5.3 50 OS Version Oracle 8.6 Oracle 9.0 KOS V5.8 7.2 Hardware Compatibility 7.2.1 CPU Specifications Table 7-2 CPU Specifications
Model Cores Threads Base Frequency (GHz) Max. Turbo Frequency (GHz) Cache (MB) TDP (W)
4410Y 12 24 2.00 3.90 30 150
4410T 10 20 2.70 4.00 26.25 150
4416+ 20 40 2.00 3.90 37.5 165
4510 12 24 2.40 4.10 30 150
4514Y 16 32 2.00 3.40 30 150
5415+ 8 16 2.90 4.10 22.5 150
5416S 16 32 2.00 4.00 30 150
5418Y 24 48 2.00 3.80 45 185
5420+ 28 56 2.00 4.10 52.5 205
5520+ 28 56 2.20 4.00 52.5 205
6414U 32 64 2.00 3.40 60 250
6426Y 16 32 2.50 4.10 37.5 185
6430 32 64 2.10 3.40 60 270
6434 8 16 3.70 4.10 22.5 195
6438N 32 64 2.00 3.60 60 205
6438Y+ 32 64 2.00 4.00 60 205
6438M 32 64 2.20 3.90 60 205
6442Y 24 48 2.60 4.00 60 225
6448Y 32 64 2.10 4.10 60 225
6448H 32 64 2.40 4.10 60 250
6454S 32 64 2.20 3.40 60 270
📷 view source screenshot for verification (page 52) table source p52
51
Model Cores Threads Base Frequency (GHz) Max. Turbo Frequency (GHz) Cache (MB) TDP (W)
6542Y 24 48 2.90 4.10 60 250
8444H 16 32 2.90 4.00 45 270
8450H 28 56 2.00 3.50 75 250
8452Y 36 72 2.00 3.20 67.5 300
8460Y+ 40 80 2.00 3.70 105 300
8462Y+ 32 64 2.80 4.10 60 300
8468 48 96 2.10 3.80 105 350
8468H 48 96 2.10 3.80 105 330
8470N 52 104 1.70 3.60 97.5 300
8471N 52 104 1.80 3.60 97.5 300
8480+ 56 112 2.00 3.80 105 350
8490H 60 120 1.90 3.50 112.5 350
📷 view source screenshot for verification (page 53) table source p53
7.2.2 DIMM Specifications Table 7-3 DIMM Specifications
Type Capacity (GB) Speed (MT/s) Organization
RDIMM 16 4,800 1R x8
32 4,800 1R x4/2R x8
64 4,800 2R x4
16 5,600 1R x8
32 5,600 1R x4/2R x8
64 5,600 2R x4
📷 view source screenshot for verification (page 53) table source p53
7.2.3 Drive Specifications Table 7-4 SAS/SATA HDD Specifications
Type Speed in rpm Capacity (TB) Max. Qty.
3.5-Inch SAS HDD 7.2k 2/4/6/8/10/12/14/16/18/20 28
📷 view source screenshot for verification (page 53) table source p53
52
Type Speed in rpm Capacity (TB) Max. Qty.
3.5-Inch SATA HDD 7.2k 2/4/6/8/10/12/14/16/18/20/22 28
📷 view source screenshot for verification (page 54) table source p54
Table 7-5 SATA/SAS SSD Specifications
Type Capacity Max. Qty.
SATA SSD 240 GB/480 GB/960 GB/1.92 TB/3.84 TB/7.68 TB 4
SAS SSD 960 GB/1.92 TB/3.84 TB/7.68 TB/15.36 TB 4
📷 view source screenshot for verification (page 54) table source p54
Table 7-6 U.2 NVMe SSD Specifications
Type Capacity Max. Qty.
U.2 NVMe SSD 960 GB/1.92 TB/3.84 TB/7.68 TB/15.36 TB 8
📷 view source screenshot for verification (page 54) table source p54
Table 7-7 M.2 SSD Specifications
Type Capacity Max. Qty.
SATA M.2 SSD 240 GB/480 GB/960 GB 2
NVMe M.2 SSD 960 GB/1.92 TB/3.84 TB 2
📷 view source screenshot for verification (page 54) table source p54
7.2.4 SAS/RAID Card Specifications Table 7-8 SAS/RAID Card Specifications
Type Description
SAS Card BRCM_8R0_9500-8i_SMSAS3_PCIE4
8222_HBA_8R0_SAS3_PCIE3_MCTP
8222_S-HBA_8R0_SAS3_PCIE3_M
ZQ_8238HBA_16R0_12G_PCIE3_M
ZQ_8238SHBA_16R0_12G_PCIE3_M
RAID Card BRCM_8R0_9540-8i_0_SMSAS3_PCIE4
BRCM_8R0_9560-8i_4G_SMSAS3_PCIE4_7
BRCM_16R_9560-16i_8_SMSAS3_PCIE4_7
PM8204_RA_8_2GB_SAS3_PCIE3
📷 view source screenshot for verification (page 54) table source p54
53
Type Description
PM8204_RA_8_4GB_SAS3_PCIE3
ZQ_8236_16R0_4G_12G_PCIE3_M
DW_PM8254_8R0_4G_SAS4_PCIE4
📷 view source screenshot for verification (page 55) table source p55
7.2.5 NIC Specifications Table 7-9 OCP Card Specifications
Type Description Speed (Gbps) Port Qty.
OCP 3.0 Card M_I350_1G_RJ_PCIex4-G2_4_OCP 1 4
SND_10G_X550_RJ_OCP3x4_2_XR 10 2
I_10G_X710DA2_LC_OCP3x8_2_XR_M7 10 2
IAG_10G_X710_LC_OCP3x8_2_XR 10 2
M_25G_MCX631432AN_LC_OCP3x8_2_XR 25 2
M_25G_MCX631432AN_LC_OCP3x8_2_XR 25 2
I_25G_E810XXVDA2_LC_OCP3x8_2_XR_M7 25 2
BROADCM_100G_57508_LC_OCP3x16_2_XR 100 2
I_100G_E810CQDA2_LC_OCP3x16_2_XR_M7 100 2
M_100G_MCX623436AN_LC_OCP3x16_2_XR 100 2
📷 view source screenshot for verification (page 55) table source p55
54 Table 7-10 PCIe NIC Specifications
Type Description Speed (Gbps) Port Qty.
PCIe NIC Intel_W_I350-T4V2_RJ_PCI-E4X_1KM 1 4
IAG_1G_I350_RJ_PCIEx4_4_XR 1 4
I_10G_EX710DA2_LC_PCIEx8_2_XR_M7 10 2
Vostok_82599_10G_LC_PCIEx8_2 10 2
Pyxis_X550_10G_RJ_P4-G3_2 10 2
I_10G_X710T2L_RJ_PCIEx8_2_XR_M7 10 2
I_10G_EX710DA4FH_LC_PCIEx8_4_XR_M7 10 4
IAG_10G_X710_LC_PCIEx8_2_XR 10 2
M_25G_MCX512A-ACAT_LC_PCIEx8_2_XR 25 2
M_25G_MCX631102AN_LC_PCIEx8_2_XR 25 2
A-M6_E810_25G_LC_P8-G4_2_M7 25 2
I_25G_E810XXVDA2_LC_PCIEx8_2_XR_M7 25 2
IAG_25G_BCM57414_LC_PCIEx8_2_XR 25 2
SOLARFL_25G_9250_LC_PCIEx8_2_XR_PLUS 25 2
M_25G_MCX512A-ACAT_LC_PCIEx8_2_XR_MT 25 2
BRCM_25G_57414_LC_PCIEx8_2_XR_MT 25 2
M_100G_MCX623106AN_LC_PCIEx16_2_XR 100 2
I_100G_E810CQDA2_LC_PCIEx16_2_XR_M7 100 2
BROADCM_100G_508_LC_PCIEx16_2_XR 100 2
M_200G_MCX755106AS_LC_PCIEx16_2_XR 200 2
M_200G_MCX623105AN_LC_PCIEx16_XR 200 1
📷 view source screenshot for verification (page 56) table source p56
7.2.6 HBA/HCA Card Specifications Table 7-11 HBA Card Specifications
Type Description Speed (Gbps) Port Qty.
HBA Card QL_OR2_QLE2692-ISR-BK_FC16G_PCIE 16 2
E_OR1_LPE31000-AP_FC16G_PCIE 16 1
E_OR2_LPE31002_FC16G_PCIE 16 2
E_OR2_LPE35002_FC32G_PCIE 32 2
📷 view source screenshot for verification (page 56) table source p56
55
Type Description Speed (Gbps) Port Qty.
Marvell_0R2_QLE2772_FC32G_PCIE_4.0 32 2
E_0R2_LPE36002_FC64G_PCIE 64 2
📷 view source screenshot for verification (page 57) table source p57
Table 7-12 HCA Card Specifications
Type Description Speed (Gbps) Port Qty.
HCA Card M_2-HDR100_MCX653106A-ECAT_PCIE 100 2
M_1-HDR200_MCX653105A-HDAT_PCIE 200 1
M_2-QSFP_MCX653106A-HDAT_PCIE 200 2
NV_1-NDR200_MCX75310AAS-HEAT_PCIE 200 1
NV_1-NDR_MCX75310AAS-NEAT_PCIE 400 1
📷 view source screenshot for verification (page 57) table source p57
7.2.7 PSU Specifications The server supports up to 2 PSUs in 1+1 redundancy that follow the Intel Common Redundant Power Supply (CRPS) specification. The PSUs share a common electrical and structural design that allows for hot-swap and tool-less installation into the server with the PSUs locking automatically after being inserted into the power bay. The CRPS PSUs are 80 Plus Platinum or Titanium rated with various output powers, allowing customers to choose as needed. The following rated 110 Vac, 230 Vac PSUs in 1+1 redundancy are supported: • Output power: - 800 W Platinum PSU: 800 W (110 Vac), 800 W (230 Vac) - 1,300 W Platinum PSU: 1,000 W (110 Vac), 1,300 W (230 Vac) - 1,600 W Platinum PSU: 1,000 W (110 Vac), 1,600 W (230 Vac) - 2,000 W Platinum PSU: 1,000 W (110 Vac), 2,000 W (230 Vac) - 800 W Titanium PSU: 800 W (110 Vac), 800 W (230 Vac) - 1,300 W Titanium PSU: 1,000 W (110 Vac), 1,300 W (230 Vac) - 1,600 W Titanium PSU: 1,000 W (110 Vac), 1,600 W (230 Vac) - 2,000 W Titanium PSU: 1,000 W (110 Vac), 2,000 W (230 Vac) • Operating voltage range: 56 - 110 Vac/230 Vac: 90 Vac to 264 Vac The following rated -48 Vdc PSUs in 1+1 redundancy are supported: • Output power: - 800 W PSU: 800 W (-48 Vdc) - 1,300 W PSU: 1,300 W (-48 Vdc) • Operating voltage range: - -48 Vdc: -40 Vdc to -72 Vdc 57 8 Regulatory Information 8.1 Safety 8.1.1 General • Strictly comply with local laws and regulations while installing the equipment. The safety instructions in this section are only a supplement to local safety regulations. • To ensure personal safety and to prevent damage to the equipment, all personnel must strictly observe the safety instructions in this section and on the device labels. • People performing specialized activities, such as electricians and electric forklift operators, must possess qualifications recognized by the local government or authorities. 8.1.2 Personal Safety • Only personnel certified or authorized by us are allowed to perform the installation procedures. • Stop any operation that could cause personal injury or equipment damage. Report to the project manager and take effective protective measures. • Working during thunderstorms, including but not limited to handling equipment, installing cabinets and installing power cords, is forbidden. • Do not carry the weight over the maximum load per person allowed by local laws or regulations. Arrange appropriate installation personnel and do not overburden them. • Installation personnel must wear clean work clothes, work gloves, safety helmets and safety shoes, as shown in Figure 8-1. 58 Figure 8-1 Protective Clothing ![figure](images/reducto/p060_figure_0582.jpg) • Before touching the equipment, put on ESD clothes and ESD gloves or an ESD wrist strap, and remove any conductive objects such as wrist watches or metal jewelry, as shown in Figure 8-2, in order to avoid electric shock or burns. Figure 8-2 Removing Conductive Objects How to put on an ESD strap (Figure 8-3). 1. Put your hand through an ESD wrist strap. 2. Tighten the strap buckle to ensure a snug fit. 3. Plug the alligator clip of the ESD wrist strap into the corresponding jack on the grounded cabinet or grounded chassis. 59 Figure 8-3 Wearing an ESD Wrist Strap
figure p61
5
• Use tools correctly to avoid personal injury. • When moving or lifting equipment above shoulder height, use lifting devices and other tools as necessary to avoid personal injury or equipment damage due to equipment slippage. • The power sources of the server carry a high voltage. Direct contact or indirect contact through damp objects with the high-voltage power source is fatal. • To ensure personal safety, ground the server before connecting power. • When using ladders, always have someone hold and guard the bottom of the ladders. In order to prevent injury, never use a ladder alone. • When connecting, testing or replacing optical fiber cable, avoid looking into the optical port without eye protection in order to prevent eye damage from laser light. 8.1.3 Equipment Safety • To ensure personal safety and prevent equipment damage, use only the power cords and cables that come with the server. Do not use them with any other equipment. • Before touching the equipment, put on ESD clothing and ESD gloves to prevent static electricity from damaging the equipment. • When moving the server, hold the bottom of the server. Do not hold the handles of any module installed in the server, such as PSUs, fan modules, drive modules, or motherboard. Handle the equipment with care at all times. • Use tools correctly to avoid damage to the equipment. • Connect the power cords of active and standby PSUs to different PDUs to ensure high system reliability. 60 • To ensure equipment safety, always ground the equipment before powering it on. 8.1.4 Transportation Precautions Contact the manufacturer for precautions before transportation as improper transportation may damage the equipment. The precautions include but are not limited to: • Hire a trusted logistics company to move all equipment. The transportation process must comply with international transportation standards for electronic equipment. Always keep the equipment being transported right-side up. Avoid collision, moisture, corrosion, packaging damage or contamination. • Transport the equipment in its original packaging. • If the original packaging is unavailable, separately package heavy and bulky components (such as chassis, blade servers and blade switches), and fragile components (such as optical modules and PCIe expansion cards). • Power off all equipment before shipping. 8.1.5 Manual Handling Weight Limits
figure p62
CAUTION
Observe local laws or regulations regarding the manual handling weight limits per person. The limits shown on the equipment and in the document are recommendations only. Table 8-1 lists the manual handling weight limits per person specified by some organizations. Table 8-1 Manual Handling Weight Limits per Person
Organization Weight Limit (kg/lbs)
European Committee for Standardization (CEN) 25/55.13
International Organization for Standardization (ISO) 25/55.13
National Institute for Occupational Safety and Health (NIOSH) 23/50.72
Health and Safety Executive (HSE) 25/55.13
General Administration of Quality Supervision, Inspection and Quarantine of the People’s Republic of China (AQSIQ) • Male: 15/33.08 • Female: 10/22.05
📷 view source screenshot for verification (page 62) table source p62
61 9 Limited Warranty This limited warranty applies only to the original purchasers of our products who are direct customers or distributors of us ("Customer"). We warrant all our hardware products, if properly used and installed, to be free from defects in material and workmanship within the warranty period. The term “Hardware Product” is limited to the hardware components and required firmware. The term “Hardware Product” DOES NOT include software applications or programs, and DOES NOT include products or peripherals that are not supplied by us. We may, at our discretion, repair or replace the defective parts. Repair or replacement parts may be new, used, or equivalent to new in performance and reliability. Repair or replacement parts are warranted to be free of defects in material or workmanship for ninety (90) calendar days or for the remainder of the warranty period of the product, whichever is longer. Service offerings may vary by geographic region. Please contact your representative to identify service levels and needs for your region. 9.1 Warranty Service Our warranty service includes 24 × 7 remote technical support, RMA (Return Material Authorization) Service, ARMA (Advanced Return Material Authorization) Service, 9 × 5 × NBD (Next Business Day) Onsite Service and 24 × 7 × 4 Onsite Service. 9.1.1 Remote Technical Support The 24 × 7 remote technical support can be obtained through hotline, e-mail, and Service Portal*1. Through hotline and e-mail support, our engineers help customers diagnose the causes of malfunctions and provide solutions. Service Portal*1 provides access to firmware, customized update files, and related manuals for Hardware Products. Customer may also access the Service Portal*1 to submit an RMA request or an ARMA request for parts replacement or repair. Information needed when requesting support: • Contact name, phone number, e-mail address • System serial number, part number, model and location (address) of the product needing service • Detailed description of problem, logs (SELs and blackbox logs, and any other related logs from OS), screenshot of issue, pictures of damaged/faulty parts, etc. 62 9.1.2 RMA Service Standard Replacement: When a hardware failure occurs, Customer may submit an RMA request to us via e-mail or Service Portal*1. We will review and approve the RMA submission at our own discretion, and provide an RMA number and return information that Customer may use to return the defective part(s) for the RMA service. We will ship out replacement part(s) within one (1) business day after receiving the defective part(s) and cover one-way shipment. NOTE • Customer should return the defective parts in original packaging to our designated service center at their own expense. • After our further diagnosing and testing, if the defective parts conform to our repair policy, we will ship out the repair or replacement parts at our own expense; otherwise, we will return the defective parts at Customer’s expense. • If Customer needs to designate a logistics company, allocation of the shipping cost to us/Customer will be redefined. 9.1.3 ARMA Service Advanced Replacement: If a problem with our hardware products cannot be resolved via hotline or e-mail support and replacement part(s) are required, we will ship out replacement part(s) in advance within one (1) business day. Customer should return defective part(s) within five (5) business days after receiving the replacement(s). The shipping cost coverage varies by region. Contact your sales representative for details. NOTE • Customer should return the defective parts in original packaging to our designated service center. • We will ship out the replacement parts at our own expense after completing remote diagnosis. • If Customer needs to designate a logistics company, allocation of the shipping cost to us/Customer will be redefined. 9.1.4 9 × 5 × NBD Onsite Service When we ultimately determine that an onsite service call is required to repair or replace a defect, the call will be scheduled in accordance with the Response Time 63 Commitment. The response time is measured from the time when the remote troubleshooting is completed and logged to the arrival of a service engineer and parts to Customer location for repair.
figure p65
NOTE
9 × 5 × NBD: Our service engineer typically arrives at the customer’s data center on the next business day. Service engineers are available on local business day from 9:00 am to 6:00 pm local time. Calls received/dispatches after 5:00 pm local time will require an additional day for the service engineer to arrive. 9.1.5 24 × 7 × 4 Onsite Service When we ultimately determine that an onsite service call is required to repair or replace a defect, the call will be scheduled in accordance with the Response Time Commitment. The response time is measured from the time when the remote troubleshooting is completed and logged to the arrival of a service engineer and parts to Customer location for repair.
figure p65
NOTE
24 × 7 × 4: Our service engineer typically arrives at the customer site within 4 hours. Service engineers are available at any time, including weekends and local national holidays. 9.2 Our Service SLA We offer a variety of Service Level Agreements (SLA)*2 to meet customer requirements. • RMA Service ● ARMA Service • 9 x 5 x NBD Onsite Service • 24 x 7 x 4 Onsite Service 9.3 Warranty Exclusions We do not guarantee that there will be no interruptions or mistakes during the use of the products. We will not undertake any responsibility for the losses arising from any operation not conducted according to instructions intended for Hardware 64 Products. The Limited Warranty does not apply to • expendable or consumable parts, such as, but not limited to, batteries or protective coatings that are designed to diminish over time, unless failure has occurred during DOA period due to a defect in material or workmanship; • any cosmetic damage, such as, but not limited to, scratches, dents, broken plastics, metal corrosion, or mechanical damage, unless failure has occurred during DOA period due to a defect in material or workmanship; • damage or defects caused by accident, misuse, abuse, contamination, improper or inadequate maintenance or calibration or other external causes; • damage or defects caused by operation beyond the parameters as stipulated in the user documentation; • damage or defects by software, interfacing, parts or supplies not provided by us; • damage or defects by improper storage, usage, or maintenance; • damage or defects by virus infection; • loss or damage in transit which is not arranged by us; • Hardware Products that have been modified or serviced by non-authorized personnel; • any damage to or loss of any personal data, programs, or removable storage media; • the restoration or reinstallation of any data or programs except the software installed by us when the product is manufactured; • any engineering sample, evaluation unit, or non-mass production product that is not covered under warranty service; • any solid-state drive (SSD) which has reached its write endurance limit. In no event will we be liable for any direct loss of use, interruption of business, lost profits, lost data, or indirect, special, incidental or consequential damages of any kind regardless of the form of action, whether in contract, tort (including negligence), strict liability or otherwise, even if we have been advised of the possibility of such damage, and whether or not any remedy provided should fail of its essential purpose. *1 Service Portal availability is subject to customer type and customer location. Please contact your representative to learn more. *2 Not all SLA offerings are available at all customer locations. Some SLA offerings may be limited to geolocation and/or customer type. Please contact your representative to learn more. 65 10 System Management 10.1 Intelligent Management System BMC BMC, a remote server management system, supports mainstream management specifications in the industry such as IPMI 2.0 and Redfish 1.13. BMC features high operational reliability, easy serviceability for different business scenarios, accurate and comprehensive fault diagnosis capabilities, and industry-leading security reinforcement capabilities. BMC supports: • IPMI 2.0 • Redfish 1.13 • SNMP v1/v2c/v3 • HTML5/Java remote consoles (Keyboard, Video, Mouse) • remote virtual media • login via web browsers • intelligent fault diagnosis Table 10-1 BMC Features
Feature Description
Management Interface Supports extensive remote management interfaces for various server O&M scenarios. The supported interfaces include: • IPMI • SMASH CLP • SNMP • HTTPS • Web GUI • Redfish • RESTful • Syslog
📷 view source screenshot for verification (page 67) table source p67
66
Feature Description
Accurate and Intelligent Fault Location IDL, a fault diagnosis system, offers accurate and comprehensive hardware fault location capabilities, and outputs detailed fault causes and handling suggestions.
Alert Management Supports rich automatic remote alert capabilities, including proactive alerting mechanisms such as SNMP Trap (v1/v2c/v3), email alerts and syslog remote alerts to ensure 24 × 7 reliability.
Remote Console KVM Supports HTML5- and Java-based remote console to remotely control and operate the monitor/mouse/keyboard of the server, providing highly available remote management capabilities without on-site operation.
Virtual Network Console (VNC) Supports mainstream third-party VNC clients without relying on Java, improving management flexibility.
Remote Virtual Media Supports virtualizing images, USB devices, folders and local media devices as media devices of remote servers, simplifying OS installation, file sharing, and other O&M tasks.
Web GUI Supports the visual management interface developed by us, displaying abundant information of the server and components, and offers easy-to-use Web GUIs.
Crash Screenshot and Crash Video Recording • Supports automatic crash screenshot and crash video recording (video needs to be enabled manually) to capture the last screen and video before crash. • Provides manual screenshot, which can quickly capture the screen for easy inspection at scheduled time.
Dual Flash and Dual Image Supports dual flash and dual image, enabling automatic flash failover in case of software or flash corruption, improving operational reliability.
Power Capping Supports power capping, increasing deployment density and reducing energy consumption.
IPv4/IPv6 Supports both IPv4 and IPv6, enhancing network deployment flexibility.
Auto-Switching of Management Network Port Supports auto-switching between the dedicated management network port and shared management network port, providing customers with flexible network deployment solutions for different management network deployment scenarios.
BMC Self-Diagnosis and Self-Recovery System • Supports the reliable dual watchdog mechanism for hardware and software, enabling automatic restoration of BMC in case of BMC abnormality. • Provides a thermal protection mechanism, which is automatically triggered when the BMC is abnormal to
📷 view source screenshot for verification (page 68) table source p68
67
Feature Description
ensure that the fan operates at safe speeds to avoid system overheating. • Supports self-diagnosis of processors, memory modules, and storage devices of BMC, and automatically cleans the workload to restore to normal when the device usage rate is too high.
Power Control Supports virtual power buttons for power on/off, power cycle and reset.
UID LED Supports remote lighting of the UID LED for locating the server in the server room.
Secure Firmware Update • Supports firmware update based on secure digital signatures, and mismatch prevention mechanism for firmware from different manufacturers and firmware for different models • Supports firmware update of BMC/BIOS/CPLD/PSU.
Serial Port Redirection Supports remote redirection of the system serial port, BMC serial port and other serial ports, and directs the server-side serial port output to the local administrator via the network for server debugging.
Storage Information Display Displays RAID logical array information and drive information, and supports remote RAID creation for improved deployment efficiency.
User Role Management Supports user detail management based on user roles and flexible creation of user roles with different privileges, provides more user roles to allow administrators to grant different privileges to O&M personnel.
Security Features Adopts the industry-leading server security baseline standard V3.0. SSH, HTTPS, SNMP and IPMI use secure and reliable algorithms. BMC offers capabilities including secure update and boot and security reinforcement mechanisms such as anti-replay, anti-injection, and anti-brute force.
Double Factor Authentication Supports double factor authentication for local BMC users. Users need to log in to the BMC with both password and certificate, thus to prevent attacks caused by password leakage.
Configuration Exporting and Importing To import and export the existing system configurations.
📷 view source screenshot for verification (page 69) table source p69
68
Feature Description
System Information Display Displays the server basic information such as the information and health status of major server components, including CPU, memory, power supply, device inventory, hard drive, network adapter, and security chip.
Fan Management Displays the status, current speed, duty ratio, and other information of a fan module. You can select the fan control mode and preset the speed for each fan module in the Manual Fan Control mode.
Power Policy To set how the server operating system reacts under the BMC’s control when AC power is reconnected to the server.
One-Key Erasing To perform non-recoverable erasing on all storage devices of the server, preventing data leakage when the server is to be retired.
System Lockdown After this feature is enabled, some parameters of the server cannot be set and some operations cannot be performed on the server.
📷 view source screenshot for verification (page 70) table source p70
10.2 KSManage The server is compatible with the latest version of KSManage, a new-generation infrastructure O&M management platform for data centers. Built on cutting-edge O&M concepts, KSManage provides users with leading and efficient overall management solutions for data centers to ensure advanced infrastructure management. This platform provides a rich set of functions such as centralized asset management, in-depth fault diagnosis, component fault early warning, intelligent energy consumption management, 3D automatic topologies, and stateless automatic deployment. With these functions, users can implement centralized O&M of servers, storage devices, network devices, security devices, and edge devices, effectively improving O&M efficiency, reducing O&M costs, and ensuring the secure, reliable, and stable operation of data centers. KSManage offers: • lightweight deployment in multiple scenarios and full lifecycle management of devices ● high reliability and on-demand scalability enabled by 1 to N data collectors • intelligent asset management and real-time tracking of asset changes • comprehensive monitoring for overall business control • intelligent fault diagnosis for reduced maintenance time • second-level performance monitoring for real-time status of devices 69 • batch configuration, deployment and update, shortening the time needed to bring the production environment online • improved firmware version management efficiency • standardized northbound interfaces for easy integration and interfacing Table 10-2 KSManage Features
Feature Description
Home • Display of basic information (data centers, server rooms, cabinets, assets and alerts), quick addition of devices and custom home page
Assets • Batch asset import, automatic asset discovery, and full lifecycle management of assets • Management of the full range of our server family, including general-purpose rack servers, AI servers, multi-node servers, edge servers and all-in-one servers • Management of our general-purpose disk arrays and distributed storage devices • Management of network devices (switches, routers, etc.), security devices (firewalls, load balancers, etc.), cabinets and clouds • Management of data centers • Asset warranty information management, asset inventory reports for server acceptance, asset attribute expansion, etc.
Monitor • Display of real-time alerts, history alerts, blocked alerts and events • Fault prediction of drives and memories • Custom inspection plan and inspection result management • Notification record viewing • Intelligent fault diagnosis and analysis, automatic fault reporting and repair ticket viewing • Trap management and Redfish management • Management of monitoring rules, such as alert rules, notification rules, blocking rules, alert noise reduction rules, compression rules and fault reporting rules, and redefinition of above rules
Control • Quick start of firmware update, OS installation, power management, drive data erasing and stress test
📷 view source screenshot for verification (page 71) table source p71
70
Feature Description
• Batch firmware update (BMC/BIOS/RAID Card/NIC/Drive/HBA Card/MB CPLD/BP CPLD/PSU) • Batch firmware configuration (BMC/BIOS) • Batch RAID configuration and OS deployment for servers • Secure and quick drive data erasing • CPU and memory stress test • Automatic firmware baseline management • BMC and BIOS snapshot management • Repositories for update files
Energy Efficiency • Overview of data center power consumption trend chart and carbon emission trend chart • Setting of server dynamic power consumption policies and minimum power consumption policies • Server temperature optimization, utilization optimization, power consumption characteristics analysis, power consumption prediction, load distribution, etc. • Carbon asset and carbon emission management
Log • Fault log record management • Diagnosis record and diagnosis rule management
Topologies • Centralized management of multiple data centers and panoramic 3D views, including dynamic display of power consumption, temperature, alerts and cabinet capacity of the data center • Network topologies
Reports • Management of warranty information reports, alert reports, asset reports, hardware reports and performance reports • Export of reports in .xlsx format
System • Password management, alert forwarding and data dump • Customized KSManage parameters
Security Security control of KSManage via a set of security policies such as user management, role management, authentication management (local authentication and LDAP authentication) and certificate management
📷 view source screenshot for verification (page 72) table source p72
71 10.3 KSManage Tools Table 10-3 Features of KSManage Tools
Feature Description
KSManage Kits A lightweight automatic batch O&M tool for servers, mainly used for server deployment, routine maintenance, firmware update, fault handling, etc.
KSManage Boot A unified batch management platform for bare metals, with features including firmware management, hardware configuration, system deployment and migration, stress test and in-band management
KSManage Server CLI Fast integration with third-party management platforms, delivering a new O&M mode of Infrastructure as Code (IaC)
KSManage Driver Operates under the OS and gets system asset and performance information via the in-band mode, providing users with more comprehensive server management capabilities.
KSManage Server Provisioning Offers users with RAID configuration, intelligent OS installation, firmware update, hardware diagnosis, secure erasing and software upgrade, using the TF card as the carrier.
📷 view source screenshot for verification (page 73) table source p73
72 11 Certifications Table 11-1 Certifications
Country/Region Certification Mandatory/Voluntary
International CB Voluntary
EU CE Mandatory
US FCC Mandatory
UL Voluntary
Korea E-Standby Voluntary
KC Mandatory
Canada IC Mandatory
📷 view source screenshot for verification (page 74) table source p74
73
figure p75
12 Appendix A
12.1 Operating Temperature Specification Limits • 4th Gen Intel Xeon Scalable Processor (SPR) Configuration Table 12-1 Operating Temperature Specification Limits
Config. Max. Operating Temperature: 30°C (86°F) Max. Operating Temperature: 35°C (95°F) Max. Operating Temperature: 40°C (104°F) Max. Operating Temperature: 45°C (113°F)
2 × 2.5-Inch Drive + 6 × PCIe Expansion Card Config. (with 6056 fans and 2U heatsinks) • CPU TDP ≤350 W • Rear drive power consumption ≤20 W • CPU TDP ≤300 W • Rear drive power consumption ≤15 W • CPU TDP ≤220 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported • CPU TDP ≤165 W • Rear drive power consumption ≤5 W • CX6 NICs and 100 Gb or above NICs not supported
2 × 2.5-Inch Drive + 6 × PCIe Expansion Card Config. (with 6056 fans and 1U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤20 W Not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card Config. • CPU TDP ≤350 W • Rear drive power • CPU TDP ≤350 W • Rear drive power • CPU TDP ≤220 W • Rear drive power • CPU TDP ≤165 W • Rear drive power
📷 view source screenshot for verification (page 75) table source p75
74
Config. Max. Operating Temperature: 30°C (86°F) Max. Operating Temperature: 35°C (95°F) Max. Operating Temperature: 40°C (104°F) Max. Operating Temperature: 45°C (113°F)
(with 6056 fans and 2U heatsinks) consumption ≤20 W consumption ≤15 W consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported consumption ≤5 W • CX6 NICs and 100 Gb or above NICs not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card Config. (with 6056 fans and 1U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported Not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card Config. (with 6038 fans and 2U heatsinks) • CPU TDP ≤225 W • Rear drive power consumption ≤20 W • CPU TDP ≤225 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported • CPU TDP ≤120 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported Not supported
8 × 2.5-Inch Drive Config. (with 6056 fans and 2U heatsinks) • CPU TDP ≤350 W • Rear drive power consumption ≤20 W • CPU TDP ≤350 W • Rear drive power consumption ≤15 W • CPU TDP ≤220 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or • CPU TDP ≤165 W • Rear drive power consumption ≤5 W • CX6 NICs and 100 Gb or
📷 view source screenshot for verification (page 76) table source p76
75
Config. Max. Operating Temperature: 30°C (86°F) Max. Operating Temperature: 35°C (95°F) Max. Operating Temperature: 40°C (104°F) Max. Operating Temperature: 45°C (113°F)
above NICs not supported above NICs not supported
8 × 2.5-Inch Drive Config. (with 6056 fans and 1U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported Not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card + 8 × 2.5-Inch Internal Drive Config. (with 6056 fans and 1U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported Not supported
📷 view source screenshot for verification (page 77) table source p77
NOTE • The maximum operating temperature is 5°C (9°F) lower than the rated value if a single fan fails. • Single fan failure may affect system performance. • If the server is configured with 100 Gb or above OCP/PCIe NICs, or CX6 NICs, the maximum operating temperature is 3°C (5.4°F) lower than the rated value. 76 • 5th Gen Intel Xeon Scalable Processor (EMR) Configuration Table 12-2 Operating Temperature Specification Limits
Config. Max. Operating Temperature: 30°C (86°F) Max. Operating Temperature: 35°C (95°F) Max. Operating Temperature: 40°C (104°F) Max. Operating Temperature: 45°C (113°F)
2 × 2.5-Inch Drive + 6 × PCIe Expansion Card Config. (with 6056 fans and 2U heatsinks) • CPU TDP ≤300 W • Rear drive power consumption ≤20 W • CPU TDP ≤270 W • Rear drive power consumption ≤15 W • CPU TDP ≤205 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported • CPU TDP ≤165 W • Rear drive power consumption ≤5 W • CX6 NICs and 100 Gb or above NICs not supported
2 × 2.5-Inch Drive + 6 × PCIe Expansion Card Config. (with 6056 fans and 1U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤20 W Not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card Config. (with 6056 fans and 2U heatsinks) • CPU TDP ≤300 W • Rear drive power consumption ≤20 W • CPU TDP ≤270 W • Rear drive power consumption ≤15 W • CPU TDP ≤205 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported • CPU TDP ≤165 W • Rear drive power consumption ≤5 W • CX6 NICs and 100 Gb or above NICs not supported
4 × 2.5-Inch Drive • CPU TDP ≤185 W • CPU TDP ≤165 W • CPU TDP ≤120 W Not supported
📷 view source screenshot for verification (page 78) table source p78
77
Config. Max. Operating Temperature: 30°C (86°F) Max. Operating Temperature: 35°C (95°F) Max. Operating Temperature: 40°C (104°F) Max. Operating Temperature: 45°C (113°F)
+ 4 × PCIe Expansion Card Config. (with 6056 fans and 1U heatsinks) • Rear drive power consumption ≤25 W • Rear drive power consumption ≤20 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card Config. (with 6038 fans and 2U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤20 W • CPU TDP ≤165 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported • CPU TDP ≤120 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported Not supported
8 × 2.5-Inch Drive Config. (with 6056 fans and 2U heatsinks) • CPU TDP ≤300 W • Rear drive power consumption ≤20 W • CPU TDP ≤270 W • Rear drive power consumption ≤15 W • CPU TDP ≤205 W • Rear drive power consumption ≤10 W • CX6 NICs and 100 Gb or above NICs not supported • CPU TDP ≤165 W • Rear drive power consumption ≤5 W • CX6 NICs and 100 Gb or above NICs not supported
8 × 2.5-Inch Drive Config. (with 6056 fans and • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤15 W Not supported
📷 view source screenshot for verification (page 79) table source p79
78
Config. Max. Operating Temperature: 30°C (86°F) Max. Operating Temperature: 35°C (95°F) Max. Operating Temperature: 40°C (104°F) Max. Operating Temperature: 45°C (113°F)
1U heatsinks) • CX6 NICs and 100 Gb or above NICs not supported
4 × 2.5-Inch Drive + 4 × PCIe Expansion Card + 8 × 2.5-Inch Internal Drive Config. (with 6056 fans and 1U heatsinks) • CPU TDP ≤185 W • Rear drive power consumption ≤25 W • CPU TDP ≤165 W • Rear drive power consumption ≤20 W • CPU TDP ≤120 W • Rear drive power consumption ≤15 W • CX6 NICs and 100 Gb or above NICs not supported Not supported
📷 view source screenshot for verification (page 80) table source p80
NOTE • The maximum operating temperature is 5°C (9°F) lower than the rated value if a single fan fails. • Single fan failure may affect system performance. • If the server is configured with 100 Gb or above OCP/PCIe NICs, or CX6 NICs, the maximum operating temperature is 3°C (5.4°F) lower than the rated value. 12.2 Model
Certified Model Description
KR2266-X2-A0-R0-00 Global
📷 view source screenshot for verification (page 80) table source p80
79 12.3 RAS Features The server supports a variety of RAS (Reliability, Availability, and Serviceability) features. By configuring these features, the server can provide greater reliability, availability, and serviceability. 12.4 Sensor List Table 12-3 Sensor List
Sensor Description Sensor Location
Inlet_Temp Air inlet temperature Left mounting ear
Outlet_Temp Air outlet temperature Motherboard
CPUx_Temp CPUx core temperature CPUx x indicates the CPU number with a value of 0 - 1
CPUx_DTS CPUx DTS temperature, CPU margin temperature before it reaches the throttling frequency CPUx x indicates the CPU number with a value of 0 - 1
CPUx_DIMM_T The maximum temperature among DDR5 DIMMs of CPUx CPUx x indicates the CPU number with a value of 0 - 1
PCH_Temp PCH temperature Motherboard
PSU_Inlet_Temp The maximum PSU temperature PSUs
CPUx_VR_Temp CPUx VR temperature CPUx x indicates the CPU number with a value of 0 - 1
NVMe_Temp The maximum temperature among all NVMe drives connected to the backplane NVMe drives connected to the backplane
HBA_Temp HBA card temperature HBA card
FPGA_Card_Temp FPGA card temperature FPGA card
RAID_Temp PCIe RAID card temperature (The maximum temperature will be taken in case of multiple RAID cards, RAID cards
📷 view source screenshot for verification (page 81) table source p81
80
Sensor Description Sensor Location
including SAS card and RAID card)
HDD_MAX_Temp The maximum temperature among all drives Drives
M.2_Max_Temp The maximum temperature among all internal M.2 NVMe SSDs Internal M.2 NVMe SSDs
M.2_Zone_Temp Air inlet temperature of the internal M.2 SSD zone Motherboard
OCP_NIC_Temp OCP card temperature (The maximum temp. will be taken in case of multiple OCP cards) OCP cards
OCP_NIC_SFP_Temp The maximum temperature among all OCP card SFP modules Optical modules
PCIe_NIC_Temp PCIe NIC temperature (The maximum temp. will be taken in case of multiple PCIe NICs) PCIe NICs
PCIe_NIC_SFP_T The maximum temperature among all PCIe NIC SFP modules Optical modules
PSUx_VIN PSUx input voltage PSUx x indicates the PSU number with a value of 0 - 1
PSUx_VOUT PSUx output voltage PSUx x indicates the PSU number with a value of 0 - 1
SYS_12V System 12 V voltage Motherboard
SYS_5V System 5 V voltage Motherboard
SYS_3V3 System 3.3 V voltage Motherboard
RTC_Battery Motherboard RTC battery voltage Motherboard
PVCCIN_CPUx CPUx core voltage CPUx x indicates the CPU number with a value of 0 - 1
PVCCFA_FIVR_CPUx UPI IIO voltage CPUx x indicates the CPU number with a value of 0 - 1
📷 view source screenshot for verification (page 82) table source p82
81
Sensor Description Sensor Location
PVCCINFAON_CPUx CPUx start voltage CPUx x indicates the CPU number with a value of 0 - 1
PVCCFA_EHV_CPUx Controller voltage CPUx x indicates the CPU number with a value of 0 - 1
PVCCD_HV_CPUx Memory controller voltage CPUx x indicates the CPU number with a value of 0 - 1
PVNN_MAIN_CPUx CPUx voltage CPUx x indicates the CPU number with a value of 0 - 1
BMC_RGM_STBY3V3 BMC 3.3 V voltage Motherboard
PVNN_PCH_STBY PCH core voltage Motherboard
P1V_BMC_STBY_SEN BMC 1 V voltage Motherboard
P1V05_PCH_STBY PCH logic voltage Motherboard
P2V5_BMC_STBY BMC standby voltage Motherboard
P1V2_STBY_SENSOR Motherboard 1.2 V voltage Motherboard
P1V8_STBY_SENSOR Motherboard 1.8 V voltage Motherboard
P3V3_STBY_SCALED Motherboard 3.3 V voltage Motherboard
P12V_CPUx_DIMM CPUx DIMM voltage CPUx x indicates the CPU number with a value of 0 - 1
P12V_STBY_OCP0 OCP0 12 V voltage Motherboard
P3V3_STBY_OCP0 OCP0 3.3 V voltage Motherboard
P12V_STBY_OCP1 OCP1 12 V voltage Motherboard
P3V3_STBY_OCP1 OCP1 3.3 V voltage Motherboard
P12V_HDD Drive 12 V voltage Motherboard
P5V_HDD Drive 5 V voltage Motherboard
P5V_STBY_USB1 USB voltage Motherboard
P5V_STBY_USB2 USB voltage Motherboard
P3V3_PCIE PCIe riser card 3.3 V voltage Motherboard
P12V_PCIE PCIe riser card 12 V voltage Motherboard
📷 view source screenshot for verification (page 83) table source p83
82
Sensor Description Sensor Location
P12V_FAN Fan voltage Motherboard
FANx_k_Speed Fan rotor speed FANx • x indicates the fan number with a value of 0 - 5; • k denotes front rotor and rear rotor, with a value of F/R respectively
Total_Power Total power PSUs
PSUx_PIN PSUx input power PSUx x indicates the PSU number with a value of 0 - 1
PSUx_POUT PSUx output power PSUx x indicates the PSU number with a value of 0 - 1
CPU_Power Total CPU power (obtained through ME) Motherboard
Memory_Power Total memory power (obtained through ME) Motherboard
FAN_Power Total fan power Fans
MEM_ResourceRate Memory utilization rate -
CPU_ResourceRate CPU utilization rate -
Air_Press Air pressure Left mounting ear
CPUx_Status CPUx status CPUx x indicates the CPU number with a value of 0 - 1
SEL_Status SEL status -
PSU_Mismatch PSU models mismatch -
PSU_Redundant PSU redundancy status -
FANx_Status FANx health status FANx x indicates the fan number with a value of 0 - 5
FAN_Redundant Fan redundancy status -
📷 view source screenshot for verification (page 84) table source p84
83
Sensor Description Sensor Location
PCIe_Status The status of PCIe device (including PCIe bus, slots and cards) -
POST_Status System firmware and POST status -
PWR_CAP_Fail Power capping failure -
CPUx_CnDm DIMM health status • CPUx - x indicates the CPU number with a value of 0 - 1; • CnDm - n indicates the channel number with a value of 0 - 7; - m indicates the DIMM slot number with a value of 0
CPU_Config CPU configuration status (mixing of CPUs, or primary CPU not installed) -
PSUx_Status PSUx status PSUx x indicates the PSU number with a value of 0 - 1
k_HDDx Drive health status Drive k denotes front, internal and rear, with a value of F/I/R respectively; x indicates the drive number, with a value of 0 - 23
ACPI_PWR ACPI power status -
Sys_Health System health status -
BMC_Boot_Up BMC boot up complete -
BIOS_Boot_Up BIOS boot up complete -
Intrusion Chassis-opening activity Top cover
ME_FW_Status ME health status -
📷 view source screenshot for verification (page 85) table source p85
84
Sensor Description Sensor Location
TPM_Verify TPM verification status -
HDD_k__Drawer Drive drawer status Drive drawer k k denotes the top/middle/bottom drive drawer, with a value of U/M/L respectively
Sys_Health System health status -
PWR_On_TMOUT Power-on timeout -
System_Error Emergency system errors (The sensor indicates IERR, Error0, Error1, and Error2. In the case of an alarm triggered by an IERR, the faulty component can be located based on the MCA register analysis log, IDL, and SEL). IERR and Error2 will trigger crash screen recording. -
BMC_Status BMC status (including chip status, hardware status, and self-test status) -
📷 view source screenshot for verification (page 86) table source p86
85 13 Appendix B Acronyms and Abbreviations A AC: Alternating Current ACPI: Advanced Configuration and Power Interface AI: Artificial Intelligence ANSI: American National Standards Institute AQSIQ: General Administration of Quality Supervision, Inspection and Quarantine of the People's Republic of China ARMA: Advanced Return Material Authorization AVX: Advanced Vector Extensions B BIOS: Basic Input Output System BLE: BIOS Lock Enable BMC: Baseboard Management Controller BP: Backplane C CAS: Column Address Strobe CB: Certification Body CCC: China Compulsory Certificate CDN: Content Delivery Network CE: Conformite Europeenne CEN: European Committee for Standardization CLI: Command-Line Interface CMOS: Complementary Metal-Oxide-Semiconductor CPLD: Complex Programmable Logic Device CPU: Central Processing Unit 86 CRPS: Common Redundant Power Supply D DC: Direct Current DDP: Dual Die Package DDR5: Double Data Rate 5 DIMM: Dual In-line Memory Module DL: Deep Learning DOA: Dead on Arrival DPC: DIMM Per Channel DRAM: Dynamic Random Access Memory DTS: Digital Thermal Sensor DWPD: Drive Writes Per Day E ECC: Error-Correcting Code ECMA: European Computer Manufacturers Association EMR: Emerald Rapids ESD: Electrostatic Discharge F FCC: Federal Communications Commission FHFL: Full-Height Full-Length FHHL: Full-Height Half-Length FPGA: Field Programmable Gate Array FW: Firmware G GPU: Graphics Processing Unit GUI: Graphical User Interface 87 H HBA: Host Bus Adapter HCA: Host Channel Adapter HDD: Hard Disk Drive HHHL: Half-Height Half-Length HSE: Health and Safety Executive HTML: HyperText Markup Language HTTPS: HyperText Transfer Protocol Secure 1 I2C: Inter-Integrated Circuit IEC: International Electrotechnical Commission IERR: Internal Error IIO: Integrated Input/Output controller IIPC: Intel Intelligent Power Capability I/O: Input/Output IOPS: Input/Output Operations Per Second IP: Internet Protocol IPMI: Intelligent Platform Management Interface ISA: International Society of Automation ISO: International Organization for Standardization K KC: Korea Certification KVM: Keyboard, Video, Mouse L LDAP: Lightweight Directory Access Protocol LED: Light Emitting Diode LP: Low Profile 88 M MCA: Machine Check Architecture MCIO: Mini Cool Edge Input/Output ME: Management Engine N NBD: Next Business Day NC-SI: Network Controller Sideband Interface NIC: Network Interface Card NIOSH: National Institute for Occupational Safety and Health NVMe: Non-Volatile Memory Express 0 OCP: Open Compute Project OS: Operating System P PC: Personal Computer PCH: Platform Controller Hub PCIe: Peripheral Component Interconnect Express PDB: Power Distribution Board PDU: Power Distribution Unit PFR: Platform Firmware Resilience PID: Proportional, Integral, Derivative POST: Power-On Self-Test PSU: Power Supply Unit PXE: Preboot Execution Environment 89 R RAID: Redundant Arrays of Independent Disks RAS: Reliability, Availability, Serviceability RDIMM: Registered Dual In-line Memory Module RH: Relative Humidity RMA: Return Material Authorization RST: Reset RTC: Real Time Clock S SAS: Serial Attached SCSI SATA: Serial Advanced Technology Attachment SCSI: Small Computer System Interface SDP: Single Die Package SEL: System Event Log SFF: Small Form Factor SFP: Small Form-factor Pluggable SGX: Software Guard Extensions SLA: Service Level Agreements SLES: SUSE Linux Enterprise Server SNMP: Simple Network Management Protocol SPR: Sapphire Rapids SSD: Solid State Drive SSH: Secure Shell T TCM: Trusted Cryptography Module TDP: Thermal Design Power TF: TransFlash TPM: Trusted Platform Module 90 U UART: Universal Asynchronous Receiver Transmitter UEFI: Unified Extensible Firmware Interface UID: Unit Identification UL: Underwriters Laboratories UPI: Ultra Path Interconnect USB: Universal Serial Bus V VGA: Video Graphics Array VLAN: Virtual Local Area Network VMD: Volume Management Device VNC: Virtual Network Console VNNI: Vector Neural Network Instructions VPP: Virtual Pin Port VRD: Voltage Regulator-Down X XDP: eXtend Debug Port 91